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TC281-30

Texas Instruments

TC281-30 by Texas Instruments

TC281-30 by Texas Instruments is an 8x8 um CCD image sensor with a max supply voltage of 13V. It offers a dynamic range of 62 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -10 to 45 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,127 parts In-Stock

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Vyrian

USA . 3,501 parts In-Stock

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Parana Technologies

USA . 1,390 parts In-Stock

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$1.499

100+ parts

$139.183

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$1.349

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1,390

$1.499

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$1.349

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$1.650

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$1.518

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$1.650

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ChromeModa Solutions

Germany . 4,082 parts In-Stock

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$1.684

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$1.381

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$1.684

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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$1.684

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$1.516

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AZTECH Wire

Italy . 639 parts In-Stock

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$8.245

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$20.750

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One Stop Electronics

USA . 191 parts In-Stock

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$23.750

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Semicontronic

India . 309 parts In-Stock

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$54.750

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$53.381

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$53.108

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Corphita

USA . 3,384 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Experience crystal-clear images like never before with the TC281-30 Image Sensor by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. Ideal for a wide range of applications, this sensor offers unparalleled performance and accuracy. With its advanced technology and innovative design, the TC281-30 ensures exceptional value and benefits for all customers. Upgrade your imaging experience today with the TC281-30 from Texas Instruments.

Feature Benefit Bullets

Pixel Size (um): 8X8

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 13 V

Higher maximum supply voltage provides flexibility in power supply options and can handle higher voltage fluctuations, ensuring stable operation in varying conditions.

Body Width: 17.65 inch

Compact body width makes it easy to integrate this image sensor into various devices and systems without taking up much space.

Power Supplies (V): 13

Matching power supply voltage ensures efficient power consumption and optimal performance of the image sensor.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD technology offers high-quality image sensing capabilities, making this sensor a reliable choice for imaging applications.

Body Height: 4.33 mm

Low body height enables the image sensor to be used in slim devices or applications where space is limited.

Package Shape or Style: RECTANGULAR

Rectangular package shape offers easy integration and alignment of the image sensor within a device or system.

Minimum Supply Voltage: 11 V

Having a lower minimum supply voltage ensures compatibility with a wide range of power sources and allows for energy-efficient operation.

Maximum Operating Temperature: 45 °C

High maximum operating temperature range allows the image sensor to function reliably in various environmental conditions without overheating.

Horizontal Pixel: 1010

High horizontal pixel count enables the image sensor to capture wider and more detailed images, making it suitable for applications requiring expansive image capture.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with many existing systems and allows for easy integration with analog signal processing circuits.

Minimum Operating Temperature: -10 °C

Low minimum operating temperature ensures the image sensor can operate in cold environments without performance degradation.

Maximum Operating Current: 5 mA

Low maximum operating current ensures low power consumption and extends the battery life of devices using this image sensor.

Housing: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired housing provides durability and protection to the image sensor, making it suitable for rugged environments.

Dynamic Range: 62 dB

High dynamic range allows the image sensor to capture images with a wide range of brightness levels, ensuring accurate and detailed image reproduction.

Vertical Pixel: 1030

High vertical pixel count enables the image sensor to capture taller images with more detail, making it suitable for applications requiring vertical image capture.

Body Length/Diameter: 27.94 mm

Compact body length/diameter allows for easy integration and placement of the image sensor within devices or systems.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connection of the image sensor to circuit boards or other electronic components.

Array Type: FRAME TRANSFER

Frame transfer array type enables fast image capture and processing, making this image sensor suitable for applications requiring real-time imaging.

Sensitivity (V/lx.s): 0.03 V/lx.s

High sensitivity allows the image sensor to capture clear and detailed images even in low light conditions, making it suitable for low-light imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature enables easy and secure installation of the image sensor on circuit boards or other mounting surfaces.

Technical Specifications

Image Sensors TC281-30 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Array Type:

FRAME TRANSFER

Body Width:

17.65 inch

Body Height:

4.33 mm

Body Length/Diameter:

27.94 mm

Dynamic Range:

62 dB

Horizontal Pixel:

1010

Housing:

CERAMIC, METAL-SEALED COFIRED

Mounting Feature:

Maximum Operating Current:

5 mA

Maximum Operating Temperature:

45 Cel

Minimum Operating Temperature:

-10 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

8X8

Power Supplies (V):

13

Sensitivity (V/lx.s):

.03 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

13 V

Minimum Supply Voltage:

11 V

Termination Type:

SOLDER

Vertical Pixel:

1030

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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