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AR0143ATSC00XUEA0-DPBR

Onsemi

AR0143ATSC00XUEA0-DPBR by Onsemi

Onsemi's AR0143ATSC00XUEA0-DPBR is a 1/4 inch CMOS image sensor with 1344x968 resolution, offering 30 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and solder termination type.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 8,569 parts In-Stock

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VNN

France . 914 parts In-Stock

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Digiode

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 749 parts In-Stock

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$21.360

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Ampacity Inc.

Singapore . 1,168 parts In-Stock

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$35.750

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TANS Electronics

Latvia . 8,071 parts In-Stock

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Continental Prestige Electronics

USA . 4,629 parts In-Stock

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SupplyDigital Components

Austria . 4,249 parts In-Stock

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Kulean Microsystems

USA . 3,628 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Argo Parts USA

USA . 2,464 parts In-Stock

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Problanco Electronics

Mexico . 2,002 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Corphita

USA . 633 parts In-Stock

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UHIMA Technologies

Türkiye . 590 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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Overview

Capture every moment in stunning clarity with the AR0143ATSC00XUEA0-DPBR Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. Perfect for a wide range of applications, this CMOS image sensor delivers exceptional performance and precision. With a high resolution of 1344 x 968 pixels and a frame rate of 30 fps, this sensor ensures sharp and detailed images every time. Discover the endless possibilities this sensor offers and elevate your projects to new heights with Onsemi.

Feature Benefit Bullets

Body Width: 9 inch

The wide body width allows for more space for the image sensor components, potentially leading to better performance and accuracy.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption, making this product energy-efficient.

Body Height: 1.55 mm

The low body height makes this image sensor suitable for small and compact devices.

Package Shape or Style: SQUARE

The square package shape provides ease of mounting and integration into various devices.

Horizontal Pixel: 1344

Higher horizontal pixel count allows for higher resolution images to be captured.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these high-quality terminal finishes ensures a reliable connection and longevity of the image sensor.

Vertical Pixel: 968

The vertical pixel count contributes to the overall clarity and detail of captured images.

Body Length/Diameter: 9 mm

The compact body length/diameter is suitable for space-constrained applications.

Optical Format (inch): 1/4

The 1/4 inch optical format is a standard size, compatible with a wide range of devices.

Termination Type: SOLDER

Solder termination ensures a secure and reliable connection for the image sensor.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface allows for easy communication with other components, simplifying integration.

Frame Rate: 30 fps

A high frame rate of 30 fps ensures smooth and clear video capture.

Array Type: FRAME

The frame array type enhances the image sensor's ability to capture detailed images.

Mounting Feature: SURFACE MOUNT

The surface mount feature makes it easy to mount the image sensor onto PCBs and other surfaces.

Technical Specifications

Image Sensors AR0143ATSC00XUEA0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.55 mm

Body Length/Diameter:

9 mm

Frame Rate:

30 fps

Horizontal Pixel:

1344

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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