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KAI-2020-AAA-CR-BA

Onsemi

KAI-2020-AAA-CR-BA by Onsemi

The Onsemi KAI-2020-AAA-CR-BA is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 14.5V, providing a dynamic range of 60 dB. This rectangular CCD sensor with analog voltage output is ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,086 parts In-Stock

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Vyrian

USA . 574 parts In-Stock

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TANS Electronics

Latvia . 6,413 parts In-Stock

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SupplyDigital Components

Austria . 5,208 parts In-Stock

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Problanco Electronics

Mexico . 2,956 parts In-Stock

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Kulean Microsystems

USA . 2,356 parts In-Stock

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Corphita

USA . 1,030 parts In-Stock

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Corohmni

South Africa . 287 parts In-Stock

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UHIMA Technologies

Türkiye . 72 parts In-Stock

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Overview

Capture breathtaking images with the KAI-2020-AAA-CR-BA Image Sensor by Onsemi. Crafted with precision and expertise, this sensor delivers unparalleled quality and performance. Ideal for a wide range of applications, from professional photography to industrial imaging, this sensor offers unmatched value and benefits to customers. Experience superior image clarity, exceptional dynamic range, and reliable output, making it the perfect choice for all your imaging needs. Trust in Onsemi's reputation for excellence and innovation – elevate your imaging experience with the KAI-2020-AAA-CR-BA.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images and better image quality.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for better performance and flexibility in power input.

Body Width: 20.32 inch

Compact body width makes it easy to integrate into different applications.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high-quality imaging with low noise levels.

Body Height: 4.44 mm

Low body height allows for slim design and easy installation in tight spaces.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides compatibility with standard mounting options.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in reducing power consumption and heat generation.

Horizontal Pixel: 1600

Higher horizontal pixel count results in sharper and detailed images.

Output Type: ANALOG VOLTAGE

Analog voltage output is suitable for a wide range of applications and interfaces.

Dynamic Range: 60 dB

High dynamic range ensures accurate representation of bright and dark areas in images.

Vertical Pixel: 1200

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 33.02 mm

Moderate body length/diameter makes it versatile for different mounting options.

Data Rate: 40 Mbps

High data rate enables fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination provides reliable electrical connections and durability.

Array Type: INTERLINE

Interline array type offers high sensitivity and low noise for improved image quality.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature ensures secure and stable installation in various applications.

Technical Specifications

Image Sensors KAI-2020-AAA-CR-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1600

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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