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KAI-2001-AAA-CF-AE

Onsemi

KAI-2001-AAA-CF-AE by Onsemi

KAI-2001-AAA-CF-AE by Onsemi is an Image Sensor with 7.4X7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,066 parts In-Stock

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2,066

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Vyrian

USA . 175 parts In-Stock

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175

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Distributors (Availability)

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TANS Electronics

Latvia . 7,146 parts In-Stock

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7,146

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Kulean Microsystems

USA . 6,001 parts In-Stock

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6,001

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Problanco Electronics

Mexico . 5,681 parts In-Stock

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5,681

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SupplyDigital Components

Austria . 2,630 parts In-Stock

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2,630

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Corphita

USA . 2,279 parts In-Stock

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2,279

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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Corohmni

South Africa . 181 parts In-Stock

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Overview

Discover the unparalleled quality and innovation of the KAI-2001-AAA-CF-AE by Onsemi, a leading manufacturer in image sensors. This cutting-edge product offers a wide range of applications in various industries, providing customers with exceptional value and benefits. Experience superior image quality, reliability, and performance like never before with this advanced technology. Trust Onsemi to deliver top-of-the-line solutions that exceed expectations. Elevate your projects with the KAI-2001-AAA-CF-AE and revolutionize your imaging experience.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

A smaller pixel size provides higher resolution and improved image quality.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for more flexibility in the power input, ensuring reliable performance.

Body Width: 20.32 inch

A compact body width makes the sensor easy to integrate into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image capture and low noise levels.

Body Height: 3.56 mm

A low body height enables the sensor to be used in slim devices or applications with space constraints.

Package Shape or Style: RECTANGULAR

Rectangular packaging is commonly used and easily mountable in different configurations.

Minimum Supply Voltage: 14.5 V

Having a minimum supply voltage ensures stable operation even in conditions with lower power availability.

Horizontal Pixel: 1600

Higher horizontal pixel count results in sharper and more detailed images.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for direct interfacing with analog signal processing circuits without additional conversion.

Dynamic Range: 60 dB

A wide dynamic range enables the sensor to capture a broad range of light intensities, resulting in better image quality.

Vertical Pixel: 1200

Higher vertical pixel count contributes to improved image resolution and clarity.

Body Length/Diameter: 33.02 mm

The moderate body length/diameter makes the sensor versatile for various mounting options and applications.

Data Rate: 40 Mbps

High data rate allows for fast image capture and transmission, suitable for real-time applications.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for long-term use.

Array Type: INTERLINE

Interline array design helps reduce image lag and improves image quality for moving objects.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting offers a sturdy and convenient way to attach the sensor to a circuit board or device.

Technical Specifications

Image Sensors KAI-2001-AAA-CF-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 14 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

3.56 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1600

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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