Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV1SE025KA-GDC by Onsemi is a CMOS image sensor with 4.50X4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 53 fps in an optical format of 1.37 inches.
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With a small pixel size, this image sensor can capture detailed images with high resolution.
Operating at a maximum supply voltage of 2V ensures low power consumption and efficient performance.
A high master clock frequency of 310 MHz enables fast processing and data transfer rates.
Compact body width allows for easy integration into various devices and systems.
Stable power supply voltage of 3.3V ensures consistent and reliable operation.
CMOS sensor technology provides high sensitivity and low noise performance for superior image quality.
Rectangular package shape makes it easy to mount and secure in place within a device.
Operating at a low minimum supply voltage of 1.6V ensures energy efficiency.
With a high maximum operating temperature of 85 °C, this sensor can withstand harsh environmental conditions.
High horizontal pixel count allows for wide image capture and detailed visualization.
Operating at a minimum temperature of -40 °C ensures functionality in cold environments.
Efficient power usage with a maximum operating current of 380 mA for extended battery life.
Ceramic housing provides durability and protection for the sensor components.
High dynamic range of 56.2 dB allows for capturing a wide range of light intensities in an image.
Equal vertical pixel count ensures uniform image resolution and quality.
The compact body length/diameter of 43.1 mm allows for versatile mounting options.
Wide spectral response range of 400-1000 nm enables capturing images across various wavelengths of light.
Optical format of 1.37 inches provides a suitable sensor size for different imaging applications.
Solder termination ensures secure connections for reliable data transfer.
4-wire interface facilitates easy connectivity with other devices for data exchange.
High frame rate of 53 fps allows for smooth and real-time image capturing.
Frame array type provides a structured layout for capturing images with precision.
Through hole mounting feature offers a secure and stable attachment to a device or system.
Image Sensors NOIV1SE025KA-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Interface Type:
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
Spectral Response (nm):
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Devices EOL 26/Jul/2018
PCN Design/Specification - PYTHON/VITA Dev DS Update 17/May/2018
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
Vishay Sprague
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MT9P031I12STM-DR
Onsemi's MT9P031I12STM-DR is a 2.2x2.2 um CMOS image sensor with 2592 (H) x 1944 (V) pixels, offering a max supply voltage of 1.9V and operating temperature range from -30 to 70 °C. Ideal for applications requiring a digital output interface, this sensor provides a dynamic range of 70.1 dB and operates at a frame rate of 14 fps.
MT9M001C12STM
Aptina
IMAGE SENSOR,CMOS; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.20-3.40V; Termination Type: SOLDER; Frame Rate: 30 fps;
AR0141CS2C00SUEA0-DR
The Onsemi AR0141CS2C00SUEA0-DR is a CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 50 MHz master clock. It operates b/w -30 to 70 °C and has a dynamic range of 79 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
MT9V034C12STC-DP1
Onsemi's MT9V034C12STC-DP1 is a 6x6 um CMOS image sensor with 752H x 480V pixels, offering a dynamic range of 100 dB. Operating at 3-3.6 V, it has a max frame rate of 60 fps and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying lighting conditions.
MT9V125IA7XTC-DR1
MT9V125IA7XTC-DR1 by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 71.7dB dynamic range. It operates at -40 to 85 °C, has a digital current output, and uses a 2-wire interface. Ideal for applications requiring high-quality imaging in compact devices like surveillance cameras or industrial inspection systems.
AS0149ATSC00XUEA0-DRBR-E
IMAGE SENSOR,CMOS;
MT9P111
The Onsemi MT9P111 is a CMOS image sensor with 1.4x1.4 um pixel size, offering 2592x1944 resolution and 60 dB dynamic range. Operating at 30 fps with a master clock of 96 MHz, it is ideal for applications requiring high-quality imaging in temperature ranges from -30 to 70 °C.
AR0144CSSM00SUKA0-CRBR
Onsemi's AR0144CSSM00SUKA0-CRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution and 3x3 um pixel size. It offers a frame rate of 60 fps, suitable for applications requiring high-quality imaging in compact devices like smartphones and tablets. The sensor features a surface mount package style with solder termination, making it ideal for integration into various electronic products.
MT9V113D00STC
MT9V113D00STC by Onsemi is a 2.2x2.2um CMOS image sensor with 1/11-inch optical format. It operates at 1.7-1.95V, offering a digital voltage output range of 0.40-1.40V and a frame rate of 30fps. Ideal for applications requiring high dynamic range imaging with low power consumption.
AR0330CM1C00SHKA0-CP
The Onsemi AR0330CM1C00SHKA0-CP is a 1/3-inch CMOS image sensor with 2304 (H) x 1296 (V) pixels. It operates at a max supply voltage of 1.9V and has a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging with a frame rate of up to 60 fps, such as surveillance cameras and industrial machine vision systems.
TC281-30
TC281-30 by Texas Instruments is an 8x8 um CCD image sensor with a max supply voltage of 13V. It offers a dynamic range of 62 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -10 to 45 °C.
KAI-0340-ABB-CP-AE-D
IMAGE SENSOR,CCD;
AR0220AT4C00XUEA2-DRBR
Onsemi's AR0220AT4C00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output at 60 fps. Ideal for frame array applications, it features a rectangular package style suitable for surface mount installation.
AR0330SR1C00SUKA0-CR
The Onsemi AR0330SR1C00SUKA0-CR is a 1/3 inch CMOS image sensor with 2304 (H) x 1296 (V) pixels. It operates at a max supply voltage of 1.9V and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging, such as surveillance cameras and industrial machine vision systems.
MT9D115W00STCK25AC1-750
MT9D115W00STCK25AC1-750 by Onsemi is an image sensor with 1.75um pixel size, 1600x1200 resolution, and 85MHz master clock. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range and frame rate of 15fps.
CMV4000-3E12M1PP
Ams Ag
CMV4000-3E12M1PP by Ams Ag is a ceramic-housed CMOS image sensor with 60 dB dynamic range, 37 fps frame rate, and sensitivity of 5.56 V/lx.s. It operates b/w -30°C to 70°C, features SPI interface output, and is ideal for applications requiring high-quality imaging in varying lighting conditions.
NOIP1FN5000A-LTI
NOIP1FN5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592x2048 pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
KAI-16070-AXA-JD-B2
KAI-16070-AXA-JD-B2 by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 15.5 V max supply voltage. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging equipment due to its impressive technical specifications.
MT9V137C12STC-DP
Onsemi's MT9V137C12STC-DP is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.6 dB and sensitivity of 11.9 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.9 V and frame rate of 30 fps, suitable for surface mount applications in various imaging systems.
OVM9724-RADA
Omnivision Technologies
Omnivision Technologies' OVM9724-RADA is a CMOS image sensor with 1.4X1.4 um pixel size and 70.4 dB dynamic range. It operates b/w -30 to 70 °C, offering 30 fps frame rate for applications requiring high sensitivity at 0.74 V/lx.s, such as surveillance cameras and automotive vision systems.
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NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SE1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Power Supplies (V): 3.3; Minimum Supply Voltage: 1.6 V; Maximum Operating Current: 75 mA;
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
NOIV1SN2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SN1300A-XXC
IMAGE SENSOR,CMOS; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Dynamic Range: 53 dB; Additional Features: GLOBAL SHUTTER, ROLLING SHUTTER; Body Length/Diameter: 10.617 mm;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SN012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
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