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NOIV1SE025KA-GTI

Onsemi

NOIV1SE025KA-GTI by Onsemi

NOIV1SE025KA-GTI by Onsemi is an Image Sensor with 4.5um Pixel Size, 310 MHz Master Clock, and 5120 Horizontal Pixels. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices.

Median Price

$2,647.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

$2,533.080

100+ parts

$2,381.100

1k+ parts

$2,229.110

10k+ parts

-

5

$2,533.080

$2,381.100

$2,229.110

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DigiKey

USA . 12 parts In-Stock

1+ parts

$2,647.060

100+ parts

-

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12

$2,647.060

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Verical

USA . 12 parts In-Stock

1+ parts

$3,158.425

100+ parts

-

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12

$3,158.425

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 79 parts In-Stock

1+ parts

$2,514.707

100+ parts

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79

$2,514.707

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Vyrian

USA . 2,128 parts In-Stock

1+ parts

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2,128

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Flip Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,404 parts In-Stock

1+ parts

$2,382.354

100+ parts

-

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1,404

$2,382.354

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Corohmni

South Africa . 438 parts In-Stock

1+ parts

$2,647.060

100+ parts

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438

$2,647.060

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Problanco Electronics

Mexico . 5,323 parts In-Stock

1+ parts

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5,323

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 3,249 parts In-Stock

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3,249

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Kulean Microsystems

USA . 2,572 parts In-Stock

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2,572

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TANS Electronics

Latvia . 2,418 parts In-Stock

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2,418

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UHIMA Technologies

Türkiye . 914 parts In-Stock

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914

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Overview

Experience unparalleled image quality and reliability with the NOIV1SE025KA-GTI by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this cutting-edge Image Sensor to deliver exceptional performance in various applications. With its high-resolution capabilities and advanced features, this sensor provides clear, crisp images in any environment. Trust in the value and benefits that Onsemi brings to the table, and discover the advantages of using the NOIV1SE025KA-GTI for your imaging needs.

Feature Benefit Bullets

Pixel Size (um): 4.5X4.5

Smaller pixel size allows for higher resolution images and better detail.

Maximum Supply Voltage: 2 V

Allows for flexibility in power supply options and compatibility with various systems.

Master Clock: 310 MHz

High master clock frequency enables fast data readout and processing speeds.

Body Width: 36.1 inch

Compact body width makes it suitable for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high sensitivity and low noise performance.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration into various devices and systems.

Minimum Supply Voltage: 1.6 V

Low minimum supply voltage helps in reducing power consumption and operating costs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Horizontal Pixel: 5120

High horizontal pixel count enables high-resolution and detailed image capture.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme cold conditions.

Maximum Operating Current: 775 mA

High maximum operating current ensures performance under heavy load and high-speed operations.

Housing: CERAMIC

Ceramic housing provides durability, thermal stability, and protection for the sensor.

Dynamic Range: 59.6 dB

High dynamic range allows for capturing a wide range of light intensities with accurate details.

Vertical Pixel: 5120

High vertical pixel count ensures sharp and detailed image capture in both horizontal and vertical directions.

Body Length/Diameter: 43.1 mm

Compact body length/diameter for easy integration and space-saving design.

Spectral Response (nm): 400-1000

Wide spectral response range covers a broad range of wavelengths for versatile imaging applications.

Optical Format (inch): 1.37

Optical format size allows for compatibility with various lenses and optical systems.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections for uninterrupted data transmission.

Output Interface Type: 4-WIRE INTERFACE

4-wire interface for easy connectivity and high-speed data transfer.

Frame Rate: 53 fps

High frame rate allows for capturing fast-moving objects or rapid scene changes with smooth motion.

Array Type: FRAME

Frame array type for capturing full-frame images with maximum detail and clarity.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature for secure and stable integration into devices or systems.

Technical Specifications

Image Sensors NOIV1SE025KA-GTI attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3 TO 3.6 V SUPPLY VOLTAGE, GLOBAL SHUTTER, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

36.1 inch

Body Length/Diameter:

43.1 mm

Dynamic Range:

59.6 dB

Frame Rate:

53 fps

Horizontal Pixel:

5120

Housing:

CERAMIC

Master Clock:

310 MHz

Mounting Feature:

Maximum Operating Current:

775 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1.37

Output Interface Type:

4-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.5X4.5

Sensors or Transducers Type:

Spectral Response (nm):

400-1000

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.6 V

Termination Type:

SOLDER

Vertical Pixel:

5120

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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