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MT9V127IA3XTC-DP

Onsemi

MT9V127IA3XTC-DP by Onsemi

MT9V127IA3XTC-DP by Onsemi features 5.6x5.6um pixel size, 27 MHz master clock, and 1/4 inch optical format. Ideal for image sensing applications with a frame rate of 60 fps, this CMOS sensor offers a dynamic range of 74.8 dB and operates b/w -40 to 105 °C temperature range.

Median Price

$16.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.090

10k+ parts

$4.090

2,995

-

-

$4.090

$4.090

Flip Electronics (Authorized)

USA . 2,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,995

-

-

-

-

Rochester

USA . 45 parts In-Stock

1+ parts

-

100+ parts

$16.780

1k+ parts

$15.010

10k+ parts

$14.130

45

-

$16.780

$15.010

$14.130

Verical

USA . 45 parts In-Stock

1+ parts

-

100+ parts

$20.975

1k+ parts

$18.762

10k+ parts

$17.663

45

-

$20.975

$18.762

$17.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 595 parts In-Stock

1+ parts

$4.090

100+ parts

-

1k+ parts

-

10k+ parts

-

595

$4.090

-

-

-

Digiode

USA . 886 parts In-Stock

1+ parts

$17.765

100+ parts

-

1k+ parts

-

10k+ parts

-

886

$17.765

-

-

-

Flip Electronics

USA . 2,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,995

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 267 parts In-Stock

1+ parts

$4.090

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$4.090

-

-

-

Corphita

USA . 742 parts In-Stock

1+ parts

$16.830

100+ parts

-

1k+ parts

-

10k+ parts

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742

$16.830

-

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Problanco Electronics

Mexico . 5,491 parts In-Stock

1+ parts

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100+ parts

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5,491

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SupplyDigital Components

Austria . 2,983 parts In-Stock

1+ parts

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100+ parts

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2,983

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Kulean Microsystems

USA . 1,440 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,440

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UHIMA Technologies

Türkiye . 222 parts In-Stock

1+ parts

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222

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TANS Electronics

Latvia . 7 parts In-Stock

1+ parts

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7

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Overview

Experience stunning image quality like never before with the MT9V127IA3XTC-DP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior performance and reliability with their cutting-edge Image Sensors. Ideal for a wide range of applications, this sensor offers unmatched value and benefits to customers seeking high-quality images with exceptional clarity and precision. Enhance your projects with the MT9V127IA3XTC-DP and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 5.60X5.60

The small pixel size allows for high resolution images and better quality output.

Maximum Supply Voltage: 1.9 V

This higher supply voltage ensures stable operation and performance.

Master Clock: 27 MHz

The high master clock frequency enables fast data processing and image capture.

Body Width: 9 inch

The compact body width makes it easy to integrate into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS image sensor type provides high sensitivity and low noise for better image quality.

Package Shape or Style: SQUARE

The square package shape allows for easy placement and soldering onto circuit boards.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures energy efficiency and prolongs battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance even in hot conditions.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies integration with digital systems and reduces signal interference.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold environments without issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish provides good conductivity and corrosion resistance for longer product lifespan.

Maximum Operating Current: 50 mA

The low maximum operating current helps in reducing power consumption and heat generation.

Housing: PLASTIC

The plastic housing is lightweight, durable, and cost-effective for mass production.

Dynamic Range: 74.8 dB

The high dynamic range allows for capturing a wide range of light intensities accurately in the image.

Body Length/Diameter: 9 mm

The small body length/diameter size makes it suitable for compact devices and applications.

Optical Format (inch): 1/4

The 1/4 inch optical format is compatible with many lenses and allows for versatile imaging options.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections for stable performance.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connectivity and communication with other devices or systems.

Frame Rate: 60 fps

The high frame rate of 60 frames per second enables smooth and clear motion capture in videos or images.

Array Type: FRAME

The frame array type allows for capturing images in frames, ensuring precise and detailed output.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and saves space in the device design.

Technical Specifications

Image Sensors MT9V127IA3XTC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.66-2.94 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.35 mm

Body Length/Diameter:

9 mm

Dynamic Range:

74.8 dB

Frame Rate:

60 fps

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.60X5.60

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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