Loading...

KAI-0340-CBA-CB-AE

Onsemi

KAI-0340-CBA-CB-AE by Onsemi

KAI-0340-CBA-CB-AE by Onsemi is a 640x480 CCD image sensor with 7.4um pixel size and 62dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.75V to 15.25V. Ideal for applications requiring high-quality analog voltage output in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

664

-

-

-

-

Vyrian

USA . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

206

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 3,177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,177

-

-

-

-

Problanco Electronics

Mexico . 2,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,933

-

-

-

-

TANS Electronics

Latvia . 2,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,379

-

-

-

-

Corphita

USA . 911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

911

-

-

-

-

Kulean Microsystems

USA . 421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

421

-

-

-

-

Corohmni

South Africa . 379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

379

-

-

-

-

UHIMA Technologies

Türkiye . 176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

176

-

-

-

-

Overview

Capture stunning images with the KAI-0340-CBA-CB-AE by Onsemi, a top-of-the-line image sensor that delivers unparalleled quality and performance. Manufactured by industry leader Onsemi, this CCD image sensor boasts a wide range of applications, from professional photography to security systems. With its exceptional pixel size and impressive dynamic range, this sensor ensures crystal-clear images in any environment. Trust Onsemi's reputation for excellence and invest in the KAI-0340-CBA-CB-AE for unmatched value, benefits, and advantages that will elevate your imaging experience to the next level.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size allows for high resolution imaging, making this product suitable for applications where detailed image capture is necessary.

Maximum Supply Voltage: 15.25 V

The high maximum supply voltage ensures optimal performance and reliability in various operating conditions, making this product a versatile choice.

Body Width: 12.45 inch

The compact body width enables easy integration into different systems and devices, making this product space-efficient and convenient to use.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The use of CCD image sensor technology ensures high-quality image capture with low noise, making this product ideal for demanding imaging applications.

Body Height: 5.15 mm

The low body height allows for a slim profile design, making this product suitable for applications where space constraints are a concern.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides easy mounting and alignment, making this product user-friendly and suitable for various installation requirements.

Minimum Supply Voltage: 14.75 V

The low minimum supply voltage ensures energy efficiency and power savings, making this product cost-effective and environmentally friendly.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in extreme environments, making this product suitable for a wide range of applications.

Horizontal Pixel: 640

The high horizontal pixel count enables high-resolution image capture, making this product suitable for detailed imaging applications requiring fine detail.

Output Type: ANALOG VOLTAGE

The analog voltage output provides compatibility with a wide range of systems and devices, making this product versatile and easy to integrate into existing setups.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature range ensures reliable operation in cold environments, making this product suitable for outdoor or low-temperature applications.

Maximum Operating Current: 2.5 mA

The low maximum operating current ensures energy efficiency and minimal power consumption, making this product cost-effective and environmentally friendly.

Housing: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed housing provides durability and protection for internal components, making this product robust and suitable for rugged environments.

Dynamic Range: 62 dB

The high dynamic range allows for accurate capture of both bright and dark areas in an image, making this product suitable for high-contrast imaging applications.

Vertical Pixel: 480

The vertical pixel count enables high-resolution image capture, making this product suitable for applications requiring detailed vertical image information.

Body Length/Diameter: 15.87 mm

The compact body length/diameter allows for easy integration and mounting, making this product suitable for space-constrained applications.

Optical Format (inch): 1/3

The 1/3 inch optical format provides compatibility with various lens options, making this product versatile and suitable for different field of view requirements.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections, making this product suitable for high-vibration environments and long-term use.

Array Type: INTERLINE

The interline array type allows for fast readout and low noise performance, making this product suitable for high-speed imaging applications with minimal distortion.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides secure and stable installation, making this product suitable for applications where robust mounting is required.

Technical Specifications

Image Sensors KAI-0340-CBA-CB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

12.45 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

62 dB

Horizontal Pixel:

640

Housing:

CERAMIC, GLASS-SEALED

Mounting Feature:

Maximum Operating Current:

2.5 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20