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KAI-02150-ABA-JD-BA

Onsemi

KAI-02150-ABA-JD-BA by Onsemi

Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.

Median Price

$1,934.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$730.740

100+ parts

$716.190

1k+ parts

$701.580

10k+ parts

-

3

$730.740

$716.190

$701.580

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Arrow

USA . 18 parts In-Stock

1+ parts

$1,934.000

100+ parts

-

1k+ parts

-

10k+ parts

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18

$1,934.000

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-

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Verical

USA . 18 parts In-Stock

1+ parts

$1,934.000

100+ parts

-

1k+ parts

-

10k+ parts

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18

$1,934.000

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 110 parts In-Stock

1+ parts

$390.906

100+ parts

-

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-

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110

$390.906

-

-

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Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$549.461

100+ parts

-

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31

$549.461

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Vyrian

USA . 6,699 parts In-Stock

1+ parts

-

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6,699

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Euro-Tech

UK . 2 parts In-Stock

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-

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$5.363

100+ parts

-

1k+ parts

-

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683

$5.363

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Corphita

USA . 796 parts In-Stock

1+ parts

$370.332

100+ parts

-

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796

$370.332

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-

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Corohmni

South Africa . 223 parts In-Stock

1+ parts

$411.480

100+ parts

-

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223

$411.480

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Continental Prestige Electronics

USA . 3 parts In-Stock

1+ parts

$411.480

100+ parts

-

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3

$411.480

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$538.471

100+ parts

-

1k+ parts

$516.932

10k+ parts

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500

$538.471

-

$516.932

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Argo Parts USA

USA . 4,192 parts In-Stock

1+ parts

$549.461

100+ parts

$543.966

1k+ parts

$538.471

10k+ parts

$532.977

4,192

$549.461

$543.966

$538.471

$532.977

Semicontronic

India . 18 parts In-Stock

1+ parts

$3,577.900

100+ parts

$3,488.452

1k+ parts

$3,470.563

10k+ parts

-

18

$3,577.900

$3,488.452

$3,470.563

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Problanco Electronics

Mexico . 7,750 parts In-Stock

1+ parts

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7,750

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SupplyDigital Components

Austria . 5,427 parts In-Stock

1+ parts

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5,427

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Kulean Microsystems

USA . 5,042 parts In-Stock

1+ parts

-

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5,042

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-

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TANS Electronics

Latvia . 1,679 parts In-Stock

1+ parts

-

100+ parts

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1,679

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UHIMA Technologies

Türkiye . 738 parts In-Stock

1+ parts

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738

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Overview

Unlock a world of stunning visual possibilities with the KAI-02150-ABA-JD-BA by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch quality and reliability. This CCD image sensor boasts a 2/3-inch optical format and a dynamic range of 64 dB, making it perfect for applications in industrial imaging, surveillance, and medical equipment. With a wide operating temperature range and easy through-hole mounting feature, this sensor offers exceptional value and performance to meet all your imaging needs. Upgrade your projects with the power of Onsemi today.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution and detailed images, making it ideal for capturing clear and sharp visuals.

Maximum Supply Voltage: 15.5 V

With a high maximum supply voltage, this image sensor can handle power surges without risking damage, ensuring reliability in operation.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The CCD sensor type provides high-quality images with low noise, making it perfect for applications where image clarity is essential.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy integration into various systems and designs, providing flexibility in installation.

Minimum Supply Voltage: 14.5 V

Even with a low minimum supply voltage, this image sensor can still maintain optimal performance, offering efficiency in power consumption.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this image sensor can withstand harsh environments without compromising functionality, ensuring durability.

Horizontal Pixel: 1920

The high horizontal pixel count allows for detailed and wide-angle images, making it suitable for capturing extensive scenes with clarity.

Minimum Operating Temperature: -50 °C

Even in extreme cold conditions, this image sensor can still function effectively, ensuring reliability in various environmental settings.

Dynamic Range: 64 dB

The wide dynamic range enables this image sensor to capture both bright and dark areas accurately, resulting in well-balanced and realistic images.

Vertical Pixel: 1080

The high vertical pixel count allows for sharp and detailed images, making it optimal for applications where image quality is crucial.

Optical Format (inch): 2/3

The 2/3 inch optical format provides a good balance between sensor size and image quality, offering versatility in various imaging applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections, reducing the risk of signal loss or interference, enhancing overall performance.

Array Type: INTERLINE

The interline array type offers fast readout speeds and low noise levels, making it suitable for applications that require rapid image capture with high clarity.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mount feature simplifies the installation process, providing ease of use and convenience in incorporating this image sensor into different setups.

Technical Specifications

Image Sensors KAI-02150-ABA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

1920

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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