Loading...

MT9V022I77ATM

Onsemi

MT9V022I77ATM by Onsemi

The Onsemi MT9V022I77ATM is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 54.4 dB. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate in a compact square package suitable for surface mounting.

Median Price

$19.718

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,081 parts In-Stock

1+ parts

$19.718

100+ parts

-

1k+ parts

-

10k+ parts

-

4,081

$19.718

-

-

-

Chip Stock

USA . 12,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,600

-

-

-

-

Digiode

USA . 2,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,478

-

-

-

-

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54

-

-

-

-

ComSIT Distribution GmbH

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,688

-

-

-

-

Problanco Electronics

Mexico . 5,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,761

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,132

-

-

-

-

Corphita

USA . 3,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,928

-

-

-

-

Authorized Procurement Solutions

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

TANS Electronics

Latvia . 1,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

-

-

-

-

Kulean Microsystems

USA . 928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

928

-

-

-

-

Perfect Parts

USA . 833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

833

-

-

-

-

UHIMA Technologies

Türkiye . 539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

539

-

-

-

-

Corohmni

South Africa . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Kepictronics

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Enhance your imaging system with the MT9V022I77ATM by Onsemi, a top-tier manufacturer known for producing high-quality image sensors. This cutting-edge sensor boasts a pixel size of 6X6 um and a maximum supply voltage of 3.6 V, making it ideal for a wide range of applications. From surveillance cameras to medical imaging devices, this versatile sensor delivers exceptional performance and reliability. Elevate your projects with the value and benefits that only Onsemi can provide, and experience the advantages of superior image capture technology.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high-resolution image capture, resulting in sharp and detailed images.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for efficient power usage and improved performance of the image sensor.

Master Clock: 26.6 MHz

The high master clock frequency ensures fast and accurate data processing, enabling high-speed image capture and output.

Body Width: 9 inch

The compact body width makes the sensor suitable for space-constrained applications and easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS sensor type ensures low power consumption, high sensitivity, and excellent image quality, making it a reliable choice for imaging applications.

Body Height: 1.3 mm

The slim body height allows for a streamlined design and ease of installation in compact devices.

Package Shape or Style: SQUARE

The square package shape provides a stable and secure mounting option for the sensor, ensuring reliability in operation.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage offers flexibility in power requirements while maintaining stable sensor performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in a variety of environmental conditions, enhancing the sensor's durability.

Horizontal Pixel: 752

The high horizontal pixel count provides detailed image resolution and clarity, making it suitable for applications requiring precise image capture.

Output Range: -9-9mA

The wide output range enables accurate and versatile signal processing, ensuring compatibility with various systems and devices.

Output Type: DIGITAL CURRENT

The digital current output type delivers stable and reliable signals for efficient data transmission and processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold conditions, making the sensor suitable for a wide range of applications.

Maximum Operating Current: 60 mA

The moderate maximum operating current ensures efficient power consumption and optimal performance of the image sensor in various operating conditions.

Dynamic Range: 54.4 dB

The high dynamic range allows the sensor to capture a wide range of light intensities accurately, producing high-quality images with enhanced contrast and detail.

Vertical Pixel: 480

The vertical pixel count contributes to the overall image resolution and quality, making the sensor suitable for applications requiring precise image capture.

Body Length/Diameter: 9 mm

The compact body length offers a versatile and flexible form factor for easy integration and installation in various devices and systems.

Optical Format (inch): 1/3

The 1/3-inch optical format provides a good balance between sensor size and image quality, making it ideal for a wide range of imaging applications.

Termination Type: SOLDER

The solder termination type ensures secure connection and reliable signal transfer, minimizing the risk of signal loss or distortion.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface type allows for easy and efficient communication with external devices, simplifying integration and compatibility with various systems.

Frame Rate: 60 fps

The high frame rate enables smooth and fluid video capture, making the sensor suitable for applications requiring real-time imaging or video recording.

Array Type: FRAME

The frame array type offers efficient image capture and processing capabilities, ensuring high-quality output and reliable performance.

Mounting Feature: SURFACE MOUNT

The surface-mounting feature allows for easy and secure installation on PCBs or other surfaces, ensuring stability and reliability in operation.

Technical Specifications

Image Sensors MT9V022I77ATM attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 3-3.60 V, IT ALSO HAVE DYNAMIC RANGE 80DB-100DB IN HIDY MODE

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.3 mm

Body Length/Diameter:

9 mm

Dynamic Range:

54.4 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Master Clock:

26.6 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20