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KLI-2104-DAA-EB-AE

Onsemi

KLI-2104-DAA-EB-AE by Onsemi

The Onsemi KLI-2104-DAA-EB-AE is a CCD image sensor with 14X7 um pixel size. It offers a dynamic range of 80 dB and operates b/w -25 to 80 °C. Ideal for applications requiring high-quality imaging in environments with varying temperatures, housed in ceramic package with through hole mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,009 parts In-Stock

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Digiode

USA . 505 parts In-Stock

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505

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TANS Electronics

Latvia . 7,580 parts In-Stock

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7,580

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Problanco Electronics

Mexico . 3,139 parts In-Stock

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Kulean Microsystems

USA . 2,070 parts In-Stock

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Corphita

USA . 835 parts In-Stock

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835

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SupplyDigital Components

Austria . 693 parts In-Stock

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Corohmni

South Africa . 494 parts In-Stock

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UHIMA Technologies

Türkiye . 192 parts In-Stock

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Overview

Capture every detail with precision and clarity using the KLI-2104-DAA-EB-AE by Onsemi. As a leading manufacturer of image sensors, Onsemi ensures top-notch quality and reliability in every product. Ideal for a wide range of applications, this CCD image sensor offers exceptional value and benefits to customers. Whether you're in the medical, industrial, or automotive industry, this sensor provides superior performance and versatility. Elevate your imaging experience with the KLI-2104-DAA-EB-AE and discover a world of possibilities.

Feature Benefit Bullets

Pixel Size (um): 14X7

Smaller pixel size allows for higher resolution images to be captured, ideal for applications requiring fine details.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality images and low noise levels, providing accurate and clear imaging results.

Package Shape or Style: RECTANGULAR

Rectangular package shape is commonly used and easily fits into various electronic devices or systems.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this image sensor can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The wide range of operating temperatures allows for reliable operation in both extremely cold and hot environments.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability, ensuring the sensor's longevity and performance under varying conditions.

Dynamic Range: 80 dB

High dynamic range enables the sensor to capture both bright and dark areas in the image with details, resulting in enhanced image quality.

Termination Type: SOLDER

Solder termination type facilitates easy and secure connection to other electronic components or circuits for seamless integration.

Array Type: LINEAR

Linear array type is suitable for applications requiring continuous and precise imaging, such as line scanning for industrial inspection.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting simplifies the installation process and provides a secure and stable connection to the PCB or mounting surface.

Technical Specifications

Image Sensors KLI-2104-DAA-EB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 12 MICRO VOLT PER ELECTRON

Array Type:

LINEAR

Dynamic Range:

80 dB

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Package Shape or Style:

Pixel Size (um):

14X7

Sensors or Transducers Type:

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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