Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KLI-2104-DAA-EB-AE is a CCD image sensor with 14X7 um pixel size. It offers a dynamic range of 80 dB and operates b/w -25 to 80 °C. Ideal for applications requiring high-quality imaging in environments with varying temperatures, housed in ceramic package with through hole mounting.
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UHIMA Technologies
Smaller pixel size allows for higher resolution images to be captured, ideal for applications requiring fine details.
CCD image sensors are known for their high-quality images and low noise levels, providing accurate and clear imaging results.
Rectangular package shape is commonly used and easily fits into various electronic devices or systems.
With a high maximum operating temperature, this image sensor can withstand harsh environmental conditions without compromising performance.
The wide range of operating temperatures allows for reliable operation in both extremely cold and hot environments.
Ceramic housing provides durability and thermal stability, ensuring the sensor's longevity and performance under varying conditions.
High dynamic range enables the sensor to capture both bright and dark areas in the image with details, resulting in enhanced image quality.
Solder termination type facilitates easy and secure connection to other electronic components or circuits for seamless integration.
Linear array type is suitable for applications requiring continuous and precise imaging, such as line scanning for industrial inspection.
Through hole mounting simplifies the installation process and provides a secure and stable connection to the PCB or mounting surface.
Image Sensors KLI-2104-DAA-EB-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
STM32H743XIH6
STMicroelectronics
STM32H743XIH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 1085440 bytes of RAM, and offers connectivity options like CAN, I2C, USB. Ideal for industrial applications requiring high-performance processing and extensive peripheral support.
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BK,215
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Daco Semiconductor
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AR0238CSSC12SPRA0-DR1
Onsemi's AR0238CSSC12SPRA0-DR1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers a dynamic range of 96 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in automotive cameras and surveillance systems.
AR0220AT4B00XUEA2-DPBR-E
The Onsemi AR0220AT4B00XUEA2-DPBR-E is a 1/1.8 inch CMOS image sensor with 1828x948 resolution, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in devices requiring high-quality imaging capabilities.
AR0220AT3R00XUEA0-DRBR-E
The Onsemi AR0220AT3R00XUEA0-DRBR-E is a CMOS image sensor with 4.2x4.2 um pixel size, 120 dB dynamic range, and 50 MHz master clock. Ideal for applications requiring high-resolution imaging such as surveillance cameras, drones, and industrial machine vision systems.
MT9V023
The Onsemi MT9V023 is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 752 (H) x 480 (V) resolution and a dynamic range of 120 dB. Operating at up to 60 fps with a master clock of 26 MHz, it is ideal for applications requiring high-quality imaging in varying lighting conditions.
KAE-04472-FBA-SD-FA
KAE-04472-FBA-SD-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C, outputs current, and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0144CSSM00SUKA0-CRBR
Onsemi's AR0144CSSM00SUKA0-CRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution and 3x3 um pixel size. It offers a frame rate of 60 fps, suitable for applications requiring high-quality imaging in compact devices like smartphones and tablets. The sensor features a surface mount package style with solder termination, making it ideal for integration into various electronic products.
MT9V034C12STM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Maximum Operating Temperature: 70 Cel; Output Interface Type: 2-WIRE INTERFACE; Power Supplies (V): 3.3; Minimum Supply Voltage: 3 V;
KAI-01150-QBA-FD-BA
The Onsemi KAI-01150-QBA-FD-BA is a 5.5x5.5 um CCD image sensor with 1280 (H) x 720 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a square package style, suitable for surface mount applications in various imaging systems.
KAF-0261-AAA-CP-BA
The Onsemi KAF-0261-AAA-CP-BA is a CCD image sensor with 512x512 pixels, 20x20 um pixel size, and 87 dB dynamic range. It operates b/w -70 to 50 °C and has a spectral response of 400-1000 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
NOIV1SE025KA-GDC
NOIV1SE025KA-GDC by Onsemi is a CMOS image sensor with 4.50X4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 53 fps in an optical format of 1.37 inches.
NOIV1SN1300A-XXC
NOIV1SN1300A-XXC by Onsemi is a 1280x1024 CMOS image sensor with 4.80um pixel size and 62 MHz master clock. It operates b/w -40 to 85 °C, offering a dynamic range of 53 dB. Ideal for frame array applications in various industries due to its square package shape and 1/2 inch optical format.
AR0220AT4R00XUEA1-TPBM
Onsemi's AR0220AT4R00XUEA1-TPBM is a CMOS image sensor with 1828x948 resolution, 1/1.8" optical format, and 60 fps frame rate. It features digital output via a 2-wire interface and is ideal for applications requiring high-quality imaging in a compact form factor.
MT9V032C12STM
Image Sensors;
KAI-02050-AAA-JR-BA
Onsemi's KAI-02050-AAA-JR-BA is a 5.5x5.5 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and is ideal for digital imaging applications requiring high-quality output in a compact rectangular package.
KAI-0373-ABA-CB-AE
KAI-0373-ABA-CB-AE by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in industrial automation and surveillance systems due to its CCD technology and rectangular package style.
KAI-4021-CBA-CD-BA
KAI-4021-CBA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
KAI-08051-ABA-JD-BA
The Onsemi KAI-08051-ABA-JD-BA is an image sensor with 5.5x5.5 um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial cameras or surveillance systems.
KAI-0330S
The Onsemi KAI-0330S is a CCD image sensor with 9x9 um pixel size, offering 648 (H) x 484 (V) resolution. It operates b/w -20 to 40 °C, with a dynamic range of 58 dB. Ideal for applications requiring analog voltage output in industrial imaging systems.
AMIS-710650-A6
Image Sensors; Horizontal Pixel: 2408; Power Supplies (V): 3.3; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
MT9D115EB3STC-CR
MT9D115EB3STC-CR by Onsemi is an image sensor with 1.75x1.75 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 1.95 V and has a master clock of 85 MHz. This CMOS sensor with a dynamic range of 63.9 dB is ideal for digital imaging applications requiring a frame rate of up to 15 fps.
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KLI-2113-RAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 11.5 V; Array Type: LINEAR;
KLI-2104-DAA-EB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Temperature: 80 Cel; Horizontal Pixel: 2098;
KLI-2104-DAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 12; Array Type: LINEAR; Maximum Operating Temperature: 80 Cel;
KLI-2104-DAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Pixel Size (um): 14X7; Dynamic Range: 80 dB;
KLI-2113
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 2V; Horizontal Pixel: 2098;
KLI-2113-AAA-ER-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: LINEAR;
KLI-2113-AAA-ER-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 12.5 V; Horizontal Pixel: 2098;
KLI-2113-AAB-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 12;
KLI-2113-AAB-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Body Length/Diameter: 48 mm;
KLI-2113-DAA-ED-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 12.5 V; Body Length/Diameter: 48 mm;
KLI-2113-DAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 14.66 inch; Array Type: LINEAR;
KLI-2113-RAA-ED-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Termination Type: SOLDER;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Housing: CERAMIC; Minimum Operating Temperature: -25 Cel;
KLI-2104-DAA-EB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Pixel Size (um): 14X7; Array Type: LINEAR;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Maximum Operating Temperature: 80 Cel; Housing: CERAMIC;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 80 Cel; Dynamic Range: 80 dB; Minimum Operating Temperature: -25 Cel;
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