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KAF-3200E

Onsemi

KAF-3200E by Onsemi

The Onsemi KAF-3200E is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 (H) x 1472 (V) resolution and a dynamic range of 77 dB. With spectral response of 350-1100 nm, it operates at supply voltages b/w 14.5 V to 15.25 V, making it ideal for high-resolution imaging applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,162 parts In-Stock

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Vyrian

USA . 99 parts In-Stock

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TANS Electronics

Latvia . 6,771 parts In-Stock

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SupplyDigital Components

Austria . 3,845 parts In-Stock

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Corphita

USA . 2,475 parts In-Stock

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Problanco Electronics

Mexico . 1,292 parts In-Stock

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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Kulean Microsystems

USA . 148 parts In-Stock

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Corohmni

South Africa . 84 parts In-Stock

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Overview

Capture the beauty of every moment with the exceptional KAF-3200E Image Sensor by Onsemi. As a leader in manufacturing cutting-edge image sensors, Onsemi ensures top-notch quality and performance in every product. The KAF-3200E offers unparalleled value with its high dynamic range and impressive pixel size, making it perfect for a wide range of applications such as professional photography, scientific imaging, and industrial inspection. Elevate your visuals and capture stunning details with the KAF-3200E - the ultimate choice for those who demand excellence.

Feature Benefit Bullets

Pixel Size (um) 6.8X6.8

Small pixel size allows for high resolution images to be captured with fine details.

Maximum Supply Voltage 15.25 V

Higher voltage tolerance ensures stable performance and reliable operation.

Body Width 20.44 inch

Wide body width provides space for larger sensor array, capturing more data at once.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture and low noise levels.

Body Height 4.82 mm

Low profile design allows for easy integration into compact devices or systems.

Package Shape or Style RECTANGULAR

Rectangular shape provides easy mounting and alignment in various applications.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in reducing power consumption and heat generation.

Horizontal Pixel 2184

High horizontal pixel count enables wide field of view and detailed image capture.

Output Type ANALOG VOLTAGE

Analog voltage output allows for easy interfacing with signal processing circuits.

Dynamic Range 77 dB

High dynamic range ensures accurate representation of light and dark areas in the image.

Vertical Pixel 1472

Vertical pixel count contributes to the overall resolution and clarity of the captured image.

Body Length/Diameter 34.54 mm

Longer body length provides space for large sensor array while maintaining a compact design.

Spectral Response (nm) 350-1100

Wide spectral response range allows for capturing images in various lighting conditions.

Data Rate 45 Mbps

High data rate enables real-time image processing and transmission.

Termination Type SOLDER

Solder termination ensures secure and reliable electrical connections.

Array Type FULL FRAME

Full frame array captures complete image without cropping or distortion.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting provides secure attachment to PCBs and ensures stability during operation.

Technical Specifications

Image Sensors KAF-3200E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 20 UV/ELECTRON

Array Type:

FULL FRAME

Body Width:

20.44 inch

Body Height:

4.82 mm

Body Length/Diameter:

34.54 mm

Data Rate:

45 Mbps

Dynamic Range:

77 dB

Horizontal Pixel:

2184

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

6.8X6.8

Sensors or Transducers Type:

Spectral Response (nm):

350-1100

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1472

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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