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KAF-3200-ABA-CP-B2

Onsemi

KAF-3200-ABA-CP-B2 by Onsemi

The Onsemi KAF-3200-ABA-CP-B2 is a CCD image sensor with 6.8X6.8 um pixel size, offering a dynamic range of 78 dB and a spectral response of 200-1100 nm. It has 2184 horizontal pixels and 1472 vertical pixels, suitable for applications requiring high-quality imaging in industrial or scientific settings.

Median Price

$4,241.936

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66 parts In-Stock

1+ parts

$3,770.610

100+ parts

$3,544.370

1k+ parts

$3,318.140

10k+ parts

-

66

$3,770.610

$3,544.370

$3,318.140

-

Verical

USA . 50 parts In-Stock

1+ parts

$4,713.262

100+ parts

$4,430.462

1k+ parts

$4,147.675

10k+ parts

-

50

$4,713.262

$4,430.462

$4,147.675

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 256 parts In-Stock

1+ parts

$4,169.607

100+ parts

-

1k+ parts

-

10k+ parts

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256

$4,169.607

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-

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Vyrian

USA . 3,276 parts In-Stock

1+ parts

-

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-

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-

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3,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 67 parts In-Stock

1+ parts

$3,726.000

100+ parts

-

1k+ parts

-

10k+ parts

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67

$3,726.000

-

-

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Corphita

USA . 1,199 parts In-Stock

1+ parts

$3,950.154

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

$3,950.154

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-

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Corohmni

South Africa . 195 parts In-Stock

1+ parts

$4,389.060

100+ parts

-

1k+ parts

-

10k+ parts

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195

$4,389.060

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-

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TANS Electronics

Latvia . 5,119 parts In-Stock

1+ parts

-

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5,119

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Kulean Microsystems

USA . 4,718 parts In-Stock

1+ parts

-

100+ parts

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4,718

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Problanco Electronics

Mexico . 1,663 parts In-Stock

1+ parts

-

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1,663

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SupplyDigital Components

Austria . 1,641 parts In-Stock

1+ parts

-

100+ parts

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1,641

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UHIMA Technologies

Türkiye . 696 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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696

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Overview

Unlock the power of high-quality imaging with the KAF-3200-ABA-CP-B2 by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch technology that surpasses industry standards. The KAF-3200-ABA-CP-B2 is perfect for applications where superior image quality is essential, offering a wide dynamic range and exceptional performance. Whether you're capturing detailed landscapes or precise scientific images, this CCD image sensor provides unmatched value, benefits, and advantages to elevate your projects to new heights. Choose Onsemi for reliability, excellence, and innovation in imaging technology.

Feature Benefit Bullets

Pixel Size (um): 6.8X6.8

The small pixel size allows for high resolution images to be captured, making this image sensor suitable for applications where detail is important.

Maximum Supply Voltage: 15.25 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, allowing for flexible integration into different systems.

Body Width: 20.19 inch

The compact body width makes this image sensor easy to fit into different devices or installations without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

Being a CCD image sensor, it offers high-quality image output with low noise, making it ideal for applications where image clarity is crucial.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy alignment and placement during assembly, ensuring smooth integration into final products.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage helps in reducing power consumption and extends the battery life of devices using this image sensor.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions, making it suitable for outdoor or industrial applications.

Horizontal Pixel: 2184

The high horizontal pixel count allows for wide-angle image capture without sacrificing image quality, making it versatile for different viewing angles.

Minimum Operating Temperature: -60 °C

The low minimum operating temperature range means this image sensor can function in extreme cold environments, expanding its usability in diverse settings.

Housing: CERAMIC

The ceramic housing provides durability and thermal stability, protecting the image sensor from external elements and ensuring long-term performance.

Dynamic Range: 78 dB

The high dynamic range allows the image sensor to capture both bright and dark areas in a scene accurately, making it suitable for high-contrast imaging applications.

Vertical Pixel: 1472

The vertical pixel count contributes to the overall image resolution, ensuring detailed and sharp images are produced by this sensor.

Body Length/Diameter: 34.54 mm

The compact body length/diameter makes this image sensor easy to handle and install, facilitating seamless integration into different devices or systems.

Spectral Response (nm): 200-1100

The wide spectral response range enables this image sensor to capture a broad range of colors and wavelengths, making it versatile for various imaging applications.

Data Rate: 15 Mbps

The high data rate ensures fast and smooth transmission of image data, allowing for real-time monitoring or high-speed image capture applications.

Termination Type: SOLDER

The solder termination type makes it easy to connect this image sensor to other components or circuit boards, simplifying the assembly process.

Array Type: FULL FRAME

Being a full-frame array type, this image sensor can capture the entire image field without any cropping or distortion, ensuring accurate and comprehensive image capture.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and stable installation of this image sensor onto PCBs or mounting surfaces, ensuring reliable performance in various applications.

Technical Specifications

Image Sensors KAF-3200-ABA-CP-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 12 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

20.19 inch

Body Length/Diameter:

34.54 mm

Data Rate:

15 Mbps

Dynamic Range:

78 dB

Horizontal Pixel:

2184

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-60 Cel

Package Shape or Style:

Pixel Size (um):

6.8X6.8

Sensors or Transducers Type:

Spectral Response (nm):

200-1100

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1472

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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