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ASX340CS2C00SPED0-DRBR

Onsemi

ASX340CS2C00SPED0-DRBR by Onsemi

ASX340CS2C00SPED0-DRBR by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 74.8 dB and sensitivity of 16.5 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.95V and output range of 0.40-2.50V, suitable for frame array applications in various industries like automotive and surveillance systems due to its high performance capabilities.

Median Price

$9.630

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

$8.560

1k+ parts

$7.660

10k+ parts

$7.210

5,200

-

$8.560

$7.660

$7.210

Verical

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

$10.700

1k+ parts

$9.575

10k+ parts

$9.012

5,200

-

$10.700

$9.575

$9.012

Distributors (In-Stock)

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Digiode

USA . 545 parts In-Stock

1+ parts

$9.063

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545

$9.063

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Vyrian

USA . 7,080 parts In-Stock

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7,080

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VNN

France . 75 parts In-Stock

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75

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Nova Conductors

Japan . 72 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,833 parts In-Stock

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$8.110

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4,833

$8.110

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Corphita

USA . 1,777 parts In-Stock

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$8.586

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1,777

$8.586

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Corohmni

South Africa . 321 parts In-Stock

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$9.540

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321

$9.540

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AZTECH Wire

Italy . 997 parts In-Stock

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$19.690

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$19.690

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Perfect Parts

USA . 29,008 parts In-Stock

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SupplyDigital Components

Austria . 8,256 parts In-Stock

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Kulean Microsystems

USA . 8,242 parts In-Stock

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Lixinc

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Problanco Electronics

Mexico . 6,609 parts In-Stock

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Futuretech Components

Singapore . 5,200 parts In-Stock

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Authorized Procurement Solutions

USA . 5,200 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 2,662 parts In-Stock

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience the exceptional clarity and precision of the ASX340CS2C00SPED0-DRBR by Onsemi, a leading manufacturer of cutting-edge image sensors. This innovative product offers unparalleled image quality, making it perfect for a wide range of applications in industries such as automotive, security, and consumer electronics. With advanced features and reliable performance, this image sensor provides customers with unmatched value and reliability. Upgrade your imaging systems today with the ASX340CS2C00SPED0-DRBR and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Small pixel size allows for higher resolution images, making this product suitable for capturing detailed images.

Maximum Supply Voltage: 1.95 V

Low maximum supply voltage helps in reducing power consumption and increasing efficiency of the device.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high-speed image capture.

Body Width: 7.5 inch

Compact body width allows for easy integration into various devices without taking up much space.

Sensor Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption, high signal-to-noise ratio, and excellent image quality, making this product a reliable choice for imaging applications.

Package Shape or Style: SQUARE

Square package shape provides a standardized form factor for easy mounting and compatibility with existing systems.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures that the device can operate efficiently even with lower power input.

Maximum Operating Temperature: 70 °C

Wide temperature range allows for operation in various environmental conditions, increasing the versatility of this product.

Output Range: 0.40-2.50V

Wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies data processing and integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish ensures secure connections and longevity of the product.

Maximum Operating Current: 50 mA

Low operating current helps in reducing power consumption and heat generation.

Housing: PLASTIC

Plastic housing provides lightweight and durable protection for the sensor, making it suitable for portable devices.

Dynamic Range: 74.8 dB

High dynamic range allows for capturing a wide range of light intensities, leading to high-quality images with rich details.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external devices.

Frame Rate: 60 fps

High frame rate enables smooth and clear video capture, ideal for applications requiring real-time image processing.

Array Type: FRAME

Frame array type provides organized and structured image capture, enhancing image quality and data processing.

Sensitivity (V/lx.s): 16.5 V/lx.s

High sensitivity allows for accurate and detailed image capture even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes it easy to mount the sensor on PCBs, simplifying assembly and integration into electronic devices.

Technical Specifications

Image Sensors ASX340CS2C00SPED0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.22 mm

Body Length/Diameter:

7.5 mm

Dynamic Range:

74.8 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensitivity (V/lx.s):

16.5 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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