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ASX340AT2C00XPED0-DRBR1

Onsemi

ASX340AT2C00XPED0-DRBR1 by Onsemi

ASX340AT2C00XPED0-DRBR1 by Onsemi is a 5600x5600 pixel CMOS image sensor with a 27 MHz master clock and 1/4 inch optical format. It operates b/w -40 to 85 °C, has a dynamic range of 87 dB, and outputs digital voltage in the range of 0.84-1.96V. Ideal for applications requiring high-resolution imaging at up to 60 fps with a sensitivity of 16.5 V/lx.s.

Median Price

$16.515

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 532 parts In-Stock

1+ parts

-

100+ parts

$14.680

1k+ parts

$13.130

10k+ parts

$12.360

532

-

$14.680

$13.130

$12.360

Verical

USA . 451 parts In-Stock

1+ parts

-

100+ parts

$18.350

1k+ parts

$16.413

10k+ parts

$15.450

451

-

$18.350

$16.413

$15.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,121 parts In-Stock

1+ parts

$15.532

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1,121

$15.532

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Vyrian

USA . 6,249 parts In-Stock

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6,249

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Flip Electronics

USA . 260 parts In-Stock

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260

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Distributors (Availability)

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AZTECH Wire

Italy . 1,133 parts In-Stock

1+ parts

$14.300

100+ parts

-

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1,133

$14.300

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Corphita

USA . 343 parts In-Stock

1+ parts

$14.715

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343

$14.715

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Corohmni

South Africa . 372 parts In-Stock

1+ parts

$16.350

100+ parts

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372

$16.350

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Native Components

USA . 264 parts In-Stock

1+ parts

$37,733.941

100+ parts

$36,979.263

1k+ parts

$36,601.923

10k+ parts

$36,224.584

264

$37,733.941

$36,979.263

$36,601.923

$36,224.584

Northwest PG Solutions

USA . 497 parts In-Stock

1+ parts

$41,507.336

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497

$41,507.336

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Kulean Microsystems

USA . 5,296 parts In-Stock

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5,296

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Problanco Electronics

Mexico . 5,258 parts In-Stock

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5,258

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SupplyDigital Components

Austria . 3,211 parts In-Stock

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3,211

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TANS Electronics

Latvia . 2,973 parts In-Stock

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2,973

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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318

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Overview

Capture the beauty of the world with the ASX340AT2C00XPED0-DRBR1 Image Sensor by Onsemi. Crafted with precision and innovation, this sensor offers unparalleled quality and reliability for a wide range of applications. Experience stunning clarity and detail in every image captured, thanks to its advanced technology. Unlock endless possibilities and elevate your projects with the value and benefits that only Onsemi can provide. Join the future of imaging today with the ASX340AT2C00XPED0-DRBR1.

Feature Benefit Bullets

Pixel Size (um) 5600X5600

High resolution with a large pixel size allows for detailed and sharp images to be captured.

Maximum Supply Voltage 1.95 V

Operates efficiently with a low maximum supply voltage, reducing power consumption.

Master Clock 27 MHz

Fast master clock speed enables rapid data processing and image capturing.

Body Width 7.5 inch

Compact body width makes the sensor easy to integrate into various devices.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS sensor technology ensures high image quality and low power consumption.

Body Height 1.28 mm

Low body height allows for slim and compact design applications.

Package Shape or Style SQUARE

Square package shape provides a symmetrical and efficient layout for integration.

Minimum Supply Voltage 1.7 V

Wide operating voltage range allows for flexibility in power supply options.

Maximum Operating Temperature 85 °C

High maximum operating temperature ensures reliable performance in various environments.

Horizontal Pixel 728

Good horizontal pixel count for capturing detailed and wide-angle images.

Output Range 0.84-1.96V

Wide output voltage range allows for compatibility with different signal processing circuits.

Output Type DIGITAL VOLTAGE

Digital output voltage provides stable and interference-free signal transmission.

Minimum Operating Temperature -40 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

Quality terminal finish materials for durability and long product life.

Maximum Operating Current 50 mA

Low maximum operating current for energy-efficient operation.

Housing PLASTIC

Lightweight plastic housing for easy integration and reduced weight in end-products.

Dynamic Range 87 dB

Wide dynamic range allows for capturing both bright and dark areas with good detail.

Vertical Pixel 560

Good vertical pixel count for capturing detailed images in portrait orientation.

Body Length/Diameter 7.5 mm

Compact body length or diameter for space-efficient integration.

Optical Format (inch) 1/4

Standard optical format for compatibility with various lenses and imaging systems.

Data Rate 27 Mbps

High data rate allows for fast image transmission and processing.

Termination Type SOLDER

Robust solder termination for secure connection in devices.

Output Interface Type 2-WIRE INTERFACE

Efficient 2-wire interface for easy connectivity and communication with other devices.

Frame Rate 60 fps

High frame rate for capturing smooth and high-quality video footage.

Array Type FRAME

Frame array type allows for sequential and organized image capture for processing.

Sensitivity (V/lx.s) 16.5 V/lx.s

High sensitivity allows for efficient light capture and optimal image quality.

Mounting Feature SURFACE MOUNT

Surface mounting feature for easy and secure installation on circuit boards.

Technical Specifications

Image Sensors ASX340AT2C00XPED0-DRBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5600X5600

Sensitivity (V/lx.s):

16.5 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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