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ASX340CS2C00SPED0-DPBR

Onsemi

ASX340CS2C00SPED0-DPBR by Onsemi

Onsemi's ASX340CS2C00SPED0-DPBR is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 74.8 dB and sensitivity of 16.5 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.95V and output range of 0.40-2.50V, making it ideal for digital imaging applications requiring high performance in a compact form factor.

Median Price

$9.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,020 parts In-Stock

1+ parts

-

100+ parts

$9.070

1k+ parts

$8.120

10k+ parts

$7.640

1,020

-

$9.070

$8.120

$7.640

Distributors (In-Stock)

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Digiode

USA . 147 parts In-Stock

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$9.604

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$9.604

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Vyrian

USA . 5,921 parts In-Stock

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Flip Electronics

USA . 29 parts In-Stock

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Corphita

USA . 1,477 parts In-Stock

1+ parts

$9.099

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1,477

$9.099

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Corohmni

South Africa . 63 parts In-Stock

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$10.110

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63

$10.110

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AZTECH Wire

Italy . 383 parts In-Stock

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$14.480

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383

$14.480

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TANS Electronics

Latvia . 6,815 parts In-Stock

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Perfect Parts

USA . 5,802 parts In-Stock

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Kulean Microsystems

USA . 2,923 parts In-Stock

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SupplyDigital Components

Austria . 2,443 parts In-Stock

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Problanco Electronics

Mexico . 909 parts In-Stock

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Northwest PG Solutions

USA . 872 parts In-Stock

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UHIMA Technologies

Türkiye . 374 parts In-Stock

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Native Components

USA . 298 parts In-Stock

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Overview

Capture the essence of every moment with the ASX340CS2C00SPED0-DPBR by Onsemi. Crafted with precision and expertise, this image sensor offers unparalleled quality and performance. Perfect for a wide range of applications, from security cameras to medical imaging, this cutting-edge technology provides exceptional value and benefits to customers. Experience crisp and clear images with the ASX340CS2C00SPED0-DPBR, where innovation meets reliability. Elevate your imaging experience with Onsemi.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Provides high resolution for capturing detailed images with clarity.

Maximum Supply Voltage: 1.95 V

Ensures stable and efficient power supply for optimal performance.

Master Clock: 27 MHz

Provides precise timing for capturing and processing images at high speed.

Body Width: 7.5 inch

Compact size for easy integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

Utilizes CMOS technology for low power consumption and high sensitivity in image capture.

Body Height: 1.22 mm

Slim profile for versatile mounting options in different applications.

Package Shape or Style: SQUARE

Provides a standard form factor for easy handling and installation.

Minimum Supply Voltage: 1.7 V

Allows for operation in low power environments while maintaining performance.

Maximum Operating Temperature: 70 °C

Suitable for use in various environmental conditions without performance degradation.

Horizontal Pixel: 728

High pixel count for capturing wide and detailed images.

Output Range: 0.40-2.50V

Provides a wide range of output voltages for flexibility in signal processing.

Output Type: DIGITAL VOLTAGE

Delivers digital output signals for easy processing and integration with other systems.

Minimum Operating Temperature: -30 °C

Maintains performance even in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish for long-lasting connectivity and reliability.

Maximum Operating Current: 50 mA

Efficient power usage for extended operation without draining the power source.

Housing: PLASTIC

Lightweight and durable housing material for protection and easy handling.

Dynamic Range: 74.8 dB

Provides a wide dynamic range for capturing both bright and dark areas in an image.

Vertical Pixel: 560

High pixel count for capturing vertical details in images.

Body Length/Diameter: 7.5 mm

Compact size for efficient use of space in a device or system.

Optical Format (inch): 1/4

Standard optical format for compatibility with various lenses and image formats.

Termination Type: SOLDER

Secure termination type for reliable connection and signal transmission.

Output Interface Type: 2-WIRE INTERFACE

Convenient interface for easy integration and communication with other devices.

Frame Rate: 60 fps

High frame rate for capturing fast-moving objects or scenes with smooth motion.

Array Type: FRAME

Organized pixel array for efficient image capture and processing.

Sensitivity (V/lx.s): 16.5 V/lx.s

High sensitivity for capturing clear images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Easy surface mounting for quick and secure installation in various devices or systems.

Technical Specifications

Image Sensors ASX340CS2C00SPED0-DPBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER; IT ALSO OPERATES AT 2.8 V ANALOG NOMINAL SUPPLY VOLTAGE

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.22 mm

Body Length/Diameter:

7.5 mm

Dynamic Range:

74.8 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensitivity (V/lx.s):

16.5 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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