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ASX340AT2C00XPED0-DRBR

Onsemi

ASX340AT2C00XPED0-DRBR by Onsemi

ASX340AT2C00XPED0-DRBR by Onsemi is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and operating at temperatures from -40 to 105°C. It has a digital voltage output interface, operates at a max supply voltage of 1.95V, and features a frame rate of 60 fps, making it suitable for applications requiring high-quality imaging in various environments.

Median Price

$10.425

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 15 parts In-Stock

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$12.690

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15

$12.690

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Rochester

USA . 1,799 parts In-Stock

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-

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$8.160

1k+ parts

$7.300

10k+ parts

$6.870

1,799

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$8.160

$7.300

$6.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,596 parts In-Stock

1+ parts

$8.626

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1,596

$8.626

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Nova Conductors

Japan . 56 parts In-Stock

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$9.481

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56

$9.481

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Cyclops Electronics Ltd

UK . 26,000 parts In-Stock

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26,000

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Vyrian

USA . 2,644 parts In-Stock

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2,644

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VNN

France . 500 parts In-Stock

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500

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,175 parts In-Stock

1+ parts

$2.590

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2,175

$2.590

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Ampacity Inc.

Singapore . 919 parts In-Stock

1+ parts

$7.720

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919

$7.720

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Corphita

USA . 1,598 parts In-Stock

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$8.172

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1,598

$8.172

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Corohmni

South Africa . 238 parts In-Stock

1+ parts

$9.080

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238

$9.080

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Continental Prestige Electronics

USA . 346 parts In-Stock

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$9.481

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$9.291

346

$9.481

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$9.291

Bastille Electronics

Australia . 15 parts In-Stock

1+ parts

$9.481

100+ parts

$9.007

1k+ parts

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10k+ parts

$8.438

15

$9.481

$9.007

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$8.438

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Lixinc

USA . 6,291 parts In-Stock

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6,291

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,809 parts In-Stock

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4,809

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GreenTree Electronics

Israel . 4,680 parts In-Stock

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4,680

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Problanco Electronics

Mexico . 2,592 parts In-Stock

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2,592

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TANS Electronics

Latvia . 2,537 parts In-Stock

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2,537

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Kulean Microsystems

USA . 2,085 parts In-Stock

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2,085

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SupplyDigital Components

Austria . 1,528 parts In-Stock

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1,528

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UHIMA Technologies

Türkiye . 240 parts In-Stock

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240

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Overview

Enhance your imaging projects with the ASX340AT2C00XPED0-DRBR image sensor by Onsemi. Known for its superior quality and cutting-edge technology, Onsemi delivers exceptional performance in the field of image sensors. Ideal for a wide range of applications, this sensor provides high-resolution images with a dynamic range of 87 dB, ensuring stunning clarity and detail. Experience seamless integration with its 2-WIRE INTERFACE output interface type and achieve smooth operation with a frame rate of 60 fps. Elevate your projects to the next level with the ASX340AT2C00XPED0-DRBR and unlock endless possibilities in the world of imaging.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

Small pixel size allows for higher resolution images with more details.

Maximum Supply Voltage: 1.95 V

Allows for efficient power usage and protection of the sensor.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high frame rates.

Body Width: 7.5 inch

Compact body width makes the sensor suitable for various applications with limited space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high sensitivity, and fast data readout.

Body Height: 1.28 mm

Low body height allows for easy integration into slim devices.

Package Shape or Style: SQUARE

Square package shape facilitates easy mounting and positioning within a device.

Minimum Supply Voltage: 1.7 V

Operates at a lower voltage for energy efficiency.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes the sensor suitable for various environments.

Horizontal Pixel: 728

High horizontal pixel count provides detailed images with clear resolution.

Output Range: 0.84-1.96V

Wide output range allows for flexibility in signal processing and compatibility with different systems.

Output Type: DIGITAL VOLTAGE

Digital output simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures without issues.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides reliable terminal finish for stable connections.

Maximum Operating Current: 50 mA

Low operating current ensures minimal power consumption.

Housing: PLASTIC

Plastic housing offers lightweight yet durable protection for the sensor.

Dynamic Range: 87 dB

High dynamic range captures both bright and dark areas accurately in the image.

Vertical Pixel: 560

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 7.5 mm

Compact body length or diameter for easy integration and space-saving design.

Optical Format (inch): 1/4

Standard optical format for compatibility with various lenses and optical systems.

Data Rate: 27 Mbps

High data rate ensures fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination provides secure and durable connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies communication and integration with other devices.

Frame Rate: 60 fps

High frame rate enables smooth and clear video recording or streaming.

Array Type: FRAME

Frame array type allows for simultaneous capture of multiple image frames for processing.

Mounting Feature: SURFACE MOUNT

Surface mount capability provides easy and secure attachment to PCBs or other surfaces.

Technical Specifications

Image Sensors ASX340AT2C00XPED0-DRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.66-2.94 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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