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ASX340AT3C00XPED0-TRBR

Onsemi

ASX340AT3C00XPED0-TRBR by Onsemi

ASX340AT3C00XPED0-TRBR by Onsemi is an image sensor with 5.6x5.6 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a digital voltage output range of 0.84-1.96V. Ideal for applications requiring a frame rate of 60 fps in a surface mount housing setup.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,221 parts In-Stock

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Digiode

USA . 728 parts In-Stock

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728

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Distributors (Availability)

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Native Components

USA . 569 parts In-Stock

1+ parts

$3,682.200

100+ parts

$3,608.556

1k+ parts

$3,571.734

10k+ parts

$3,534.912

569

$3,682.200

$3,608.556

$3,571.734

$3,534.912

Northwest PG Solutions

USA . 1,707 parts In-Stock

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$4,050.420

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$4,050.420

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Kulean Microsystems

USA . 7,346 parts In-Stock

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SupplyDigital Components

Austria . 5,984 parts In-Stock

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TANS Electronics

Latvia . 4,700 parts In-Stock

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Problanco Electronics

Mexico . 2,338 parts In-Stock

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UHIMA Technologies

Türkiye . 562 parts In-Stock

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Corphita

USA . 490 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Overview

Capture every moment with the ASX340AT3C00XPED0-TRBR by Onsemi, a top-of-the-line image sensor that delivers exceptional quality and performance. Manufactured by Onsemi, a renowned industry leader, this sensor is perfect for a wide range of applications. With its advanced technology and precision engineering, this product offers unparalleled value, benefits, and advantages to customers looking for high-quality imaging solutions. Elevate your projects with the ASX340AT3C00XPED0-TRBR and unlock endless possibilities in image capturing.

Feature Benefit Bullets

Pixel Size (um): 5.6X5.6

The small pixel size allows for high resolution and detailed images to be captured.

Maximum Supply Voltage: 1.95 V

Operating within this voltage range ensures the safety and optimal performance of the image sensor.

Master Clock: 27 MHz

A high master clock frequency of 27 MHz enables fast data processing and image capture.

Body Width: 7.5 inch

The compact size of the image sensor makes it suitable for various applications and easy to integrate into different devices.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption and high performance, making them a popular choice in image sensor technology.

Package Shape or Style: SQUARE

The square package shape provides a uniform and stable design for the image sensor.

Minimum Supply Voltage: 1.7 V

Having a low minimum supply voltage allows for energy-efficient operation of the image sensor.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the image sensor can withstand harsh environmental conditions.

Horizontal Pixel: 728

A high horizontal pixel count results in wider image capture and more detailed pictures.

Output Range: 0.84-1.96V

The wide output range provides flexibility in signal processing and compatibility with different devices.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies interfacing and ensures accurate data transmission.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the image sensor to function in cold environments without issues.

Maximum Operating Current: 50 mA

A moderate operating current ensures efficient power consumption while maintaining optimal performance.

Housing: PLASTIC

Plastic housing offers lightweight and durable protection for the image sensor.

Dynamic Range: 87 dB

A high dynamic range allows the image sensor to capture a wide range of light intensities without loss of detail.

Vertical Pixel: 560

A high vertical pixel count contributes to sharper and more detailed image quality.

Body Length/Diameter: 7.5 mm

The compact body length/diameter makes the image sensor suitable for small and slim device designs.

Optical Format (inch): 1/4

The 1/4 inch optical format is commonly used in image sensors for its balance of size and performance.

Data Rate: 27 Mbps

A high data rate of 27 Mbps enables fast and seamless data transfer for real-time image processing.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for the image sensor.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices.

Frame Rate: 60 fps

A high frame rate of 60 fps ensures smooth and detailed video recording and playback.

Array Type: FRAME

The frame array design allows for efficient image capture with minimal distortion or noise.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables easy and secure attachment of the image sensor to circuit boards.

Technical Specifications

Image Sensors ASX340AT3C00XPED0-TRBR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.66-2.94 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1.28 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

560

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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