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ASX340AT3C00XPED0-DRBR-E

Onsemi

ASX340AT3C00XPED0-DRBR-E by Onsemi

Onsemi's ASX340AT3C00XPED0-DRBR-E is a 5.6x5.6 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 87 dB and operating at temperatures from -40 to 85 °C. It features a digital voltage output interface, operates at a max supply voltage of 1.95 V, and has a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in compact devices like smartphones and surveillance cameras.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

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SupplyDigital Components

Austria . 7,822 parts In-Stock

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Kulean Microsystems

USA . 4,089 parts In-Stock

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Problanco Electronics

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Native Components

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Northwest PG Solutions

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UHIMA Technologies

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TANS Electronics

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Overview

Elevate your imaging experience with the ASX340AT3C00XPED0-DRBR-E by Onsemi, a cutting-edge image sensor that delivers unparalleled quality and performance. Manufactured by the trusted brand Onsemi, known for their innovative technology and reliability, this sensor offers a wide range of applications in various industries. Capture vivid images with precision and clarity, thanks to its advanced features and design. Experience the value and benefits of this product firsthand, and unlock a world of possibilities in imaging technology. Choose Onsemi for superior quality and exceptional results.

Feature Benefit Bullets

Pixel Size (um) 5.6X5.6

This small pixel size allows for high resolution images to be captured with clarity and detail.

Maximum Supply Voltage 1.95 V

Low power consumption with a maximum supply voltage of 1.95 V makes this sensor efficient and ideal for portable devices.

Master Clock 27 MHz

A fast master clock speed of 27 MHz ensures quick processing of image data for smooth operation.

Body Width 7.5 inch

The compact body width of 7.5 inches allows for easy integration into various devices and systems.

Sensors or Transducers Type IMAGE SENSOR,CMOS

The CMOS image sensor type provides high sensitivity and low noise for high-quality image capture.

Body Height 1 mm

The slim body height of 1 mm enables the sensor to be used in thin devices or applications with limited space.

Package Shape or Style SQUARE

The square package shape is easy to mount and align, making installation simple and efficient.

Minimum Supply Voltage 1.7 V

With a minimum supply voltage of 1.7 V, the sensor can operate efficiently even at low power levels.

Maximum Operating Temperature 85 °C

The high maximum operating temperature of 85 °C ensures the sensor can withstand demanding environmental conditions.

Horizontal Pixel 728

A high horizontal pixel count of 728 results in sharp and detailed images with excellent clarity.

Output Range 0.84-1.96V

The wide output voltage range allows for flexible signal processing and compatibility with various systems.

Output Type DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and ensures reliable data transmission.

Minimum Operating Temperature -40 °C

The low minimum operating temperature of -40 °C makes the sensor suitable for use in cold environments.

Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of Tin/Silver/Copper provides good conductivity and corrosion resistance for long-lasting performance.

Housing PLASTIC

The plastic housing is lightweight, durable, and cost-effective, making the sensor ideal for mass production.

Dynamic Range 87 dB

A high dynamic range of 87 dB allows the sensor to capture images with a wide range of light intensities, resulting in balanced exposure.

Vertical Pixel 560

With a vertical pixel count of 560, the sensor can capture images in high resolution with accurate detail.

Body Length/Diameter 7.5 mm

The compact body length/diameter of 7.5 mm contributes to the overall slim profile of the sensor for easy integration.

Optical Format (inch) 1/4

The 1/4 inch optical format is a common standard, ensuring compatibility with a wide range of optical systems and lenses.

Data Rate 27 Mbps

The high data rate of 27 Mbps enables fast and efficient transfer of image data for real-time processing.

Termination Type SOLDER

Solder termination provides a secure and reliable connection for stable signal transmission.

Output Interface Type 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices for seamless integration.

Frame Rate 60 fps

A high frame rate of 60 fps allows the sensor to capture smooth and fluid motion in videos and fast-moving scenes.

Array Type FRAME

The frame array type ensures efficient image capture and processing for high-quality output.

Mounting Feature SURFACE MOUNT

The surface mounting feature allows for easy installation on PCBs or other surfaces, saving space and simplifying assembly.

Technical Specifications

Image Sensors ASX340AT3C00XPED0-DRBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

7.5 inch

Body Height:

1 mm

Body Length/Diameter:

7.5 mm

Data Rate:

27 Mbps

Dynamic Range:

87 dB

Frame Rate:

60 fps

Horizontal Pixel:

728

Housing:

PLASTIC

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

5.6X5.6

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

560

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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