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AR0220AT4B00XUEA2-DPBR-E

Onsemi

AR0220AT4B00XUEA2-DPBR-E by Onsemi

The Onsemi AR0220AT4B00XUEA2-DPBR-E is a 1/1.8 inch CMOS image sensor with 1828x948 resolution, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in devices requiring high-quality imaging capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

AR0220AT4B00XUEA2-DPBR-E by Onsemi
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Vyrian

USA . 957 parts In-Stock

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Digiode

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Kulean Microsystems

USA . 7,560 parts In-Stock

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Problanco Electronics

Mexico . 7,189 parts In-Stock

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SupplyDigital Components

Austria . 2,749 parts In-Stock

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TANS Electronics

Latvia . 1,463 parts In-Stock

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Northwest PG Solutions

USA . 1,368 parts In-Stock

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Native Components

USA . 931 parts In-Stock

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Corphita

USA . 364 parts In-Stock

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Corohmni

South Africa . 284 parts In-Stock

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UHIMA Technologies

Türkiye . 266 parts In-Stock

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Overview

Capture crystal-clear images with the AR0220AT4B00XUEA2-DPBR-E Image Sensor by Onsemi. Known for their superior quality and cutting-edge technology, Onsemi delivers top-of-the-line sensors that are perfect for a wide range of applications. Whether you're looking to enhance your security system, upgrade your automotive camera, or improve your drone's imaging capabilities, this image sensor provides unparalleled value, benefits, and advantages. Trust Onsemi to provide you with the best in image sensor technology.

Feature Benefit Bullets

Body Width: 9 inch

Larger body width allows for more space for components, potentially leading to better functionality and performance.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image capture, making this product energy-efficient and reliable.

Body Height: 1.7 mm

Low body height enables a sleek and compact design, perfect for applications where space is limited.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration into various devices and systems, enhancing versatility.

Horizontal Pixel: 1828

High horizontal pixel count ensures detailed and sharp images, making this product perfect for high-resolution imaging tasks.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transmission, providing reliable and efficient communication with other devices.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Diverse terminal finish options ensure compatibility with a wide range of circuitry, enhancing flexibility in device design.

Vertical Pixel: 948

Vertical pixel count contributes to image clarity and quality, ensuring excellent performance in capturing vertical details.

Body Length/Diameter: 12 mm

Moderate body length allows for a good balance between size and functionality, making this product suitable for various applications.

Optical Format (inch): 1/1.8

Optical format indicates the sensor's compatibility with different lens sizes, offering flexibility in image capture and customization.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection, ensuring stable performance in diverse operating conditions.

Output Interface Type: 2-WIRE INTERFACE

2-Wire interface simplifies connections and data transfer, enhancing compatibility with different systems and devices.

Frame Rate: 60 fps

High frame rate ensures smooth and fluid image capture, ideal for applications requiring real-time imaging or motion analysis.

Array Type: FRAME

Frame array design enables efficient image capture and processing, offering high-quality output in a structured and organized manner.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies installation and integration, making this product easy to use and suitable for various mounting configurations.

Technical Specifications

Image Sensors AR0220AT4B00XUEA2-DPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.7 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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