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KAI-16050-FXA-JD-B2

Onsemi

KAI-16050-FXA-JD-B2 by Onsemi

KAI-16050-FXA-JD-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 4964 horizontal pixels, and 3332 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various industries.

Median Price

$5,636.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$2,232.890

100+ parts

$2,098.920

1k+ parts

$1,964.940

10k+ parts

-

2

$2,232.890

$2,098.920

$1,964.940

-

DigiKey

USA . 2 parts In-Stock

1+ parts

$2,703.080

100+ parts

$2,703.080

1k+ parts

$2,703.080

10k+ parts

$2,703.080

2

$2,703.080

$2,703.080

$2,703.080

$2,703.080

Arrow

USA . 13 parts In-Stock

1+ parts

$8,569.880

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$8,569.880

-

-

-

Verical

USA . 13 parts In-Stock

1+ parts

$8,569.880

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$8,569.880

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 412 parts In-Stock

1+ parts

$2,469.164

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$2,469.164

-

-

-

Vyrian

USA . 3,018 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,018

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$2,206.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$2,206.000

-

-

-

Corphita

USA . 1,466 parts In-Stock

1+ parts

$2,339.208

100+ parts

-

1k+ parts

-

10k+ parts

-

1,466

$2,339.208

-

-

-

Corohmni

South Africa . 82 parts In-Stock

1+ parts

$2,599.120

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$2,599.120

-

-

-

Problanco Electronics

Mexico . 8,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,380

-

-

-

-

TANS Electronics

Latvia . 7,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,843

-

-

-

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Kulean Microsystems

USA . 3,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,745

-

-

-

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SupplyDigital Components

Austria . 1,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,443

-

-

-

-

UHIMA Technologies

Türkiye . 242 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

242

-

-

-

-

Overview

Elevate your imaging experience with the KAI-16050-FXA-JD-B2 by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers exceptional quality and reliability in every product. This advanced CCD image sensor offers unparalleled performance in a compact package, making it ideal for a wide range of applications. From industrial inspections to medical imaging, this sensor ensures crisp, clear images with a dynamic range of 64 dB. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Pixel Size (um) 5.5X5.5

The small pixel size allows for capturing high-resolution images with accurate details.

Maximum Supply Voltage 15.5 V

Capable of operating at a high supply voltage ensures efficient performance in various applications.

Body Width 45.34 inch

Compact body width makes it suitable for integration into different devices without taking up too much space.

Power Supplies (V) 15

Optimal power supply voltage for reliable and stable operation of the image sensor.

Package Shape or Style RECTANGULAR

Rectangular packaging provides easy mounting and integration into electronic systems.

Minimum Supply Voltage 14.5 V

The ability to operate at a low supply voltage increases energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature 70 °C

High maximum operating temperature ensures the sensor can perform reliably in various environments.

Horizontal Pixel 4964

High pixel count horizontally allows for detailed and sharp image capture.

Minimum Operating Temperature -50 °C

Low minimum operating temperature makes the sensor suitable for use in extreme cold conditions.

Dynamic Range 64 dB

Wide dynamic range enables the sensor to capture both bright and dark areas accurately in the same image.

Vertical Pixel 3332

High pixel count vertically allows for capturing images with fine details and high resolution.

Body Length/Diameter 47.24 mm

Compact body length/diameter makes the sensor easy to handle and mount in different applications.

Termination Type SOLDER

Solder termination type ensures secure and reliable connections for consistent performance.

Array Type INTERLINE

Interline array type provides faster readout speeds and reduced image lag for seamless image capture.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature allows for easy and secure installation of the sensor on PCBs or other surfaces.

Technical Specifications

Image Sensors KAI-16050-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Length/Diameter:

47.24 mm

Dynamic Range:

64 dB

Horizontal Pixel:

4964

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3332

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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