Loading...

KAI-1003-ABA-CD-B2

Onsemi

KAI-1003-ABA-CD-B2 by Onsemi

KAI-1003-ABA-CD-B2 by Onsemi is an image sensor with 12.8X12.8 um pixel size, 1024 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w 0 to 40 °C and has a supply voltage range of 14.5V to 15.5V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

-

-

-

-

Digiode

USA . 634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

634

-

-

-

-

Flip Electronics

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,445

-

-

-

-

SupplyDigital Components

Austria . 2,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,320

-

-

-

-

Kulean Microsystems

USA . 1,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,778

-

-

-

-

Corphita

USA . 1,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,479

-

-

-

-

TANS Electronics

Latvia . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

439

-

-

-

-

Corohmni

South Africa . 207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

207

-

-

-

-

UHIMA Technologies

Türkiye . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76

-

-

-

-

Overview

Capture every moment in stunning detail with the KAI-1003-ABA-CD-B2 image sensor by Onsemi. Renowned for their superior quality and innovation, Onsemi has crafted a sensor that delivers unrivaled performance in a compact package. Ideal for a wide range of applications, this sensor offers unparalleled value and benefits to customers looking to elevate their imaging capabilities. From industrial to medical, the KAI-1003-ABA-CD-B2 excels in capturing crystal-clear images with exceptional dynamic range and precision. Trust Onsemi to bring your vision to life with the KAI-1003-ABA-CD-B2 image sensor.

Feature Benefit Bullets

Pixel Size (um): 12.8X12.8

High resolution pixel size ensures quality images with great detail.

Maximum Supply Voltage: 15.5 V

Allows for reliable and stable operation at higher voltage levels.

Body Width: 25.4 inch

Compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality images with low noise levels.

Body Height: 4.45 mm

Low profile design for versatile mounting options.

Package Shape or Style: RECTANGULAR

Standard rectangular shape for easy installation and compatibility.

Minimum Supply Voltage: 14.5 V

Operates efficiently at lower voltage levels, saving power.

Maximum Operating Temperature: 40 °C

Can withstand high operating temperatures for extended use.

Horizontal Pixel: 1024

High horizontal resolution for detailed and clear images.

Minimum Operating Temperature: 0 °C

Works in cold temperatures without compromising performance.

Housing: CERAMIC

Durable ceramic housing ensures product longevity and stability.

Dynamic Range: 72 dB

High dynamic range results in accurate color representation.

Vertical Pixel: 1024

Vertical resolution matches horizontal resolution for balanced images.

Body Length/Diameter: 40.13 mm

Compact body size for easy integration and space-saving.

Termination Type: SOLDER

Solder termination for secure and reliable connections.

Array Type: INTERLINE

Interline array design allows for faster image capture and processing.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting ensures stable and secure attachment.

Technical Specifications

Image Sensors KAI-1003-ABA-CD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

25.4 inch

Body Height:

4.45 mm

Body Length/Diameter:

40.13 mm

Dynamic Range:

72 dB

Horizontal Pixel:

1024

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

12.8X12.8

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20