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MT9M001C12STM-DR

Onsemi

MT9M001C12STM-DR by Onsemi

The Onsemi MT9M001C12STM-DR image sensor features 5.2x5.2 um pixel size, 48 MHz master clock, and 1280x1024 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high-quality image output and compact square package design.

Median Price

$19.073

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$19.073

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10

$19.073

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Vyrian

USA . 2,747 parts In-Stock

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2,747

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Digiode

USA . 1,931 parts In-Stock

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1,931

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Chip Stock

USA . 1,085 parts In-Stock

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1,085

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Cyclops Electronics Ltd

UK . 53 parts In-Stock

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53

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,270 parts In-Stock

1+ parts

$3.240

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-

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4,270

$3.240

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Ampacity Inc.

Singapore . 304 parts In-Stock

1+ parts

$4.750

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304

$4.750

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AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$16.752

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624

$16.752

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Corohmni

South Africa . 151 parts In-Stock

1+ parts

$18.317

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151

$18.317

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Continental Prestige Electronics

USA . 1,601 parts In-Stock

1+ parts

$19.073

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$18.691

1,601

$19.073

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$18.691

Semicontronic

India . 687 parts In-Stock

1+ parts

$34.750

100+ parts

$33.881

1k+ parts

$33.708

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687

$34.750

$33.881

$33.708

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Kulean Microsystems

USA . 6,605 parts In-Stock

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6,605

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Perfect Parts

USA . 5,372 parts In-Stock

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Futuretech Components

Singapore . 2,880 parts In-Stock

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2,880

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SupplyDigital Components

Austria . 2,772 parts In-Stock

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Lixinc

USA . 2,392 parts In-Stock

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TANS Electronics

Latvia . 2,267 parts In-Stock

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Corphita

USA . 1,914 parts In-Stock

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1,914

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Problanco Electronics

Mexico . 1,597 parts In-Stock

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1,597

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Argo Parts USA

USA . 1,050 parts In-Stock

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1,050

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$18.691

1k+ parts

$18.119

10k+ parts

$17.737

100

-

$18.691

$18.119

$17.737

UHIMA Technologies

Türkiye . 62 parts In-Stock

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62

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Overview

Elevate your imaging capabilities with the MT9M001C12STM-DR Image Sensor by Onsemi. Renowned for their high-quality products, Onsemi delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this image sensor offers unmatched value and performance. Enhance your projects with crystal-clear images and precise digital outputs, all while benefiting from the reliability and innovation that Onsemi is known for. Upgrade to the MT9M001C12STM-DR and experience the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 5.2X5.2

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 3.6 V

Allows for efficient power usage and compatibility with various systems.

Master Clock: 48 MHz

High master clock frequency enables fast data processing and image capture.

Body Width: 14.22 inch

Compact body size for easy integration into different devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high image quality.

Body Height: 2.21 mm

Slim body design for versatile mounting options.

Package Shape or Style: SQUARE

Square package shape allows for efficient use of space and easy alignment during assembly.

Minimum Supply Voltage: 3 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for use in various environments.

Horizontal Pixel: 1280

High horizontal pixel count for detailed and sharp images.

Output Type: DIGITAL VOLTAGE

Digital voltage output for convenient data processing and transmission.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature for reliable performance in cold conditions.

Maximum Operating Current: 110 mA

Efficient operating current consumption for extended battery life.

Housing: CERAMIC

Durable ceramic housing for robust protection of internal components.

Dynamic Range: 68.2 dB

High dynamic range for capturing both bright and dark areas in a scene.

Vertical Pixel: 1024

Vertical pixel count for capturing detailed images with depth.

Body Length/Diameter: 14.22 mm

Compact body size for easy integration into different devices.

Optical Format (inch): 1/2

Optical format size suitable for a wide range of imaging applications.

Termination Type: SOLDER

Solder termination for secure and reliable electrical connections.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface for easy connection to external devices.

Frame Rate: 30 fps

High frame rate for smooth and fluid motion capture.

Array Type: FRAME

Frame array type for efficient image capture and processing.

Mounting Feature: SURFACE MOUNT

Surface mount option for easy and secure installation in devices.

Technical Specifications

Image Sensors MT9M001C12STM-DR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

2.21 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

68.2 dB

Frame Rate:

30 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

48 MHz

Mounting Feature:

Maximum Operating Current:

110 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1/2

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

5.2X5.2

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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