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CYIL1SM4000AA-GWCES

Onsemi

CYIL1SM4000AA-GWCES by Onsemi

CYIL1SM4000AA-GWCES by Onsemi is an Image Sensor with 2048x2048 resolution, 12x12 um pixel size, and 33 MHz master clock. Ideal for applications requiring high-quality digital imaging in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,398 parts In-Stock

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Digiode

USA . 277 parts In-Stock

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SupplyDigital Components

Austria . 6,300 parts In-Stock

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Kulean Microsystems

USA . 5,595 parts In-Stock

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TANS Electronics

Latvia . 5,108 parts In-Stock

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Problanco Electronics

Mexico . 2,240 parts In-Stock

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Corphita

USA . 2,170 parts In-Stock

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Northwest PG Solutions

USA . 1,761 parts In-Stock

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Native Components

USA . 353 parts In-Stock

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Corohmni

South Africa . 202 parts In-Stock

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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Overview

Experience the unparalleled image quality and precision with the CYIL1SM4000AA-GWCES by Onsemi. As a leading manufacturer of image sensors, Onsemi brings cutting-edge technology to your fingertips. Ideal for a wide range of applications, this sensor offers unmatched clarity and accuracy, making it perfect for industries such as security, automotive, and medical imaging. Elevate your projects with the reliability and performance that only Onsemi can deliver. Choose excellence, choose CYIL1SM4000AA-GWCES.

Feature Benefit Bullets

Pixel Size (um): 12X12

Small pixel size allows for high resolution images with sharp details

Maximum Supply Voltage: 2.75 V

Low voltage requirement makes it energy efficient and reduces power consumption

Master Clock: 33 MHz

High master clock speed enables fast data processing and high frame rates

Body Width: 42 inch

Compact design makes it suitable for various applications without taking up much space

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology provides high quality, low noise images with low power consumption

Array Type: FULL FRAME

Full frame array type ensures capture of complete image without cropping or distortion

Frame Rate: 15 fps

Decent frame rate for capturing smooth video footage

Output Range: -0.50-3.80V

Wide output range provides flexibility in signal processing and compatibility with various systems

Dynamic Range: 66 dB

High dynamic range allows for accurate representation of both dark and bright areas in the image

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and allows for easy integration into electronic devices

Technical Specifications

Image Sensors CYIL1SM4000AA-GWCES attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

FULL FRAME

Body Width:

42 inch

Body Height:

3.25 mm

Body Length/Diameter:

42 mm

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2048

Housing:

CERAMIC

Master Clock:

33 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

12X12

Sensitivity (V/lx.s):

11.61 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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