Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYIL1SN3000AA-GZDC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 3.465 V and master clock at 206 MHz. Ideal for applications requiring high-resolution imaging, it offers a frame rate of 485 fps, full-frame array type, and a dynamic range of 80 dB.
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With a small pixel size of 8X8 um, this image sensor can capture detailed images with high resolution.
The high maximum supply voltage ensures stable and reliable operation of the image sensor.
The high master clock frequency of 206 MHz allows for fast and efficient processing of image data.
The compact body width of 27 inches makes this image sensor suitable for applications where space is limited.
Being a CMOS image sensor type ensures low power consumption and high sensitivity to light, making it ideal for a wide range of imaging applications.
The slim body height of 4.3 mm allows for easy integration into various devices without adding unnecessary bulk.
The rectangular package shape provides ease of mounting and handling during assembly.
The low minimum supply voltage ensures efficient power usage and extends the lifespan of the image sensor.
With a high maximum operating temperature of 60 °C, this image sensor can function reliably in a variety of environmental conditions.
The high horizontal pixel count of 1696 contributes to producing sharp and detailed images with accurate color reproduction.
The digital output type simplifies the integration of the image sensor with digital systems for seamless data processing.
The low minimum operating temperature of 0 °C ensures that the image sensor remains operational even in cold environments.
The ceramic housing provides high durability and resistance to temperature fluctuations, ensuring the longevity of the image sensor.
The high dynamic range of 80 dB allows the image sensor to capture a wide range of light intensities, resulting in well-exposed and balanced images.
The high vertical pixel count of 1710 contributes to better image resolution and clarity.
The moderate body length/diameter of 31 mm offers a balance between compactness and functionality in various applications.
The solder termination type ensures secure and reliable connections during installation and usage.
With a high frame rate of 485 frames per second, this image sensor can capture fast-moving objects with smooth motion and minimal blur.
The full-frame array type maximizes the sensor's light-gathering capacity, resulting in high-quality images with excellent clarity and detail.
The through-hole mounting feature provides secure and stable mounting of the image sensor on circuit boards or other surfaces.
Image Sensors CYIL1SN3000AA-GZDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
Vicor
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Semicoa
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
B340A-13-F
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
KAI-1020-ABB-JP-AE
KAI-1020-ABB-JP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000x1000 resolution, and 60 dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-2020-CBA-CD-AE
KAI-2020-CBA-CD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage data at a rate of 40 Mbps. This rectangular CCD sensor is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP3SE5000A-QTI
NOIP3SE5000A-QTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592x2048 pixels, 60 dB dynamic range, and 45 fps frame rate. It operates b/w -40 to 85 °C and has a spectral response of 400-1000 nm. Ideal for applications requiring high-resolution imaging in various lighting conditions.
AR0238CSSC12SHRA0-DP1
Onsemi's AR0238CSSC12SHRA0-DP1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at 48 MHz master clock, it has a digital current output interface and supports frame rates up to 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
MT9V113M02
The Onsemi MT9V113M02 is a CMOS image sensor with 2.2x2.2 um pixel size, offering 640x480 resolution and 67 dB dynamic range. It operates b/w -15 to 40 °C, with digital output via a 2-wire interface, making it ideal for applications requiring high-quality imaging in compact devices.
MT9V032C12STM-DR
Onsemi's MT9V032C12STM-DR is a 1/3 inch CMOS image sensor with 6x6 um pixel size. It operates at 26.6 MHz master clock, offering 752 (H) x 480 (V) resolution for applications like digital cameras and surveillance systems. With a dynamic range of 54.4 dB, it supports frame rates up to 60 fps in a compact ceramic housing suitable for surface mount installations.
KAI-0330S
The Onsemi KAI-0330S is a CCD image sensor with 9x9 um pixel size, offering 648 (H) x 484 (V) resolution. It operates b/w -20 to 40 °C, with a dynamic range of 58 dB. Ideal for applications requiring analog voltage output in industrial imaging systems.
KAI-16050-CXA-JD-B1
The Onsemi KAI-16050-CXA-JD-B1 is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-4011-ABA-CD-AE
KAI-4011-ABA-CD-AE by Onsemi is a rectangular CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates b/w -50 °C to 70°C, has a data rate of 40 Mbps, and is suitable for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-02150-ABA-JD-BA
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
MT9V032C12STC-TP
Onsemi's MT9V032C12STC-TP is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a pixel size of 6x6 um. It operates at a max supply voltage of 3.6V and has a master clock of 26.6 MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems due to its compact square package design and digital current output interface.
NOIP1FN5000A-QTI
NOIP1FN5000A-QTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592H x 2048V pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of up to 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
TCD1254GFG(8Z,AA)
Toshiba
Toshiba TCD1254GFG(8Z,AA) Image Sensor features 5.25X64 um pixel size, 1.5-3.0V digital voltage output range, and 52.04 dB dynamic range. Ideal for applications requiring high sensitivity (103 V/lx.s), such as surface mount linear array CCD sensors in imaging systems with spectral response of 400-1100 nm.
NOIP1SN1300A-QTI
NOIP1SN1300A-QTI by Onsemi features 4.80x4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. Ideal for image sensing applications with a frame rate of 210 fps, this CMOS sensor operates at temperatures ranging from -40 to 85 °C.
AR0134CSSM00SUEA0-DPBR
The Onsemi AR0134CSSM00SUEA0-DPBR image sensor features 3.75um pixel size, 1.95V max supply voltage, and 50MHz master clock. Ideal for applications requiring high-resolution imaging with a 1280x960 pixel array, such as surveillance cameras or industrial machine vision systems.
MT9V131C12STC-TR
MT9V131C12STC-TR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 27 MHz master clock. Ideal for digital cameras, it offers a dynamic range of 60 dB and operates at temperatures ranging from -20 to 70 °C.
KAI-2001-AAA-CP-AE
IMAGE SENSOR,CCD;
KAI-0340-FBA-CB-AE-SINGLE
KAI-0340-FBA-CB-AE-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor such as industrial cameras or medical devices.
MT9V024IA7XTC-DR1
MT9V024IA7XTC-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications, it features Tin/Silver/Copper terminal finish and is suitable for various imaging tasks.
KAF-31600-CXA-DD-AA
The Onsemi KAF-31600-CXA-DD-AA is a CCD image sensor with 6.8X6.8 um pixel size, offering a max supply voltage of 15.5 V and a master clock of 24 MHz. With a full-frame array type, it is ideal for high-resolution imaging applications requiring a dynamic range of 70.5 dB and spectral response from 400-700 nm.
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CYIL1SC1300AA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Data Rate: 40 Mbps;
CYIL1SC4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Minimum Supply Voltage: 2.25 V;
CYIL1SE0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 3.3 V; Housing: CERAMIC;
CYIL1SE3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 31 mm;
CYIL1SM0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Additional Features: ELECTRONIC SNAPSHOT SHUTTER;
CYIL1SM0300AA-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC SNAPSHOT SHUTTER; Array Type: FULL FRAME;
CYIL1SM1300AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Maximum Operating Current: 50 mA;
CYIL1SM4000AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 60 Cel; Additional Features: ELECTRONIC ROLLING SHUTTER;
CYIL1SM4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Maximum Supply Voltage: 2.75 V;
CYIL1SM4000AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Master Clock: 33 MHz;
CYIL2SC1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1280; Output Interface Type: 3-WIRE INTERFACE;
CYIL2SM1300AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Master Clock: 315 MHz; Horizontal Pixel: 1280;
CYIL2SM1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1; Body Length/Diameter: 35.5 mm;
CYIL1SE3000AA-BDCES
Infineon Technologies
Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Power Supplies (V): 2.5; Horizontal Pixel: 1696; Maximum Operating Temperature: 60 Cel;
CYIL1SN3000AA-BDCES
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: 0 Cel; Pixel Size (um): 8X8; Maximum Operating Temperature: 60 Cel; Power Supplies (V): 2.5;
CYIL2SM1300AA-GZWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Pixel Size (um): 14X14; Power Supplies (V): 2.5; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1024;
CYIL1SN3000AA-GZDC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1696; Pixel Size (um): 8X8;
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