Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYIL1SN3000AA-GZDC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 3.465 V and master clock at 206 MHz. Ideal for applications requiring high-resolution imaging, it offers a frame rate of 485 fps, full-frame array type, and a dynamic range of 80 dB.
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With a small pixel size of 8X8 um, this image sensor can capture detailed images with high resolution.
The high maximum supply voltage ensures stable and reliable operation of the image sensor.
The high master clock frequency of 206 MHz allows for fast and efficient processing of image data.
The compact body width of 27 inches makes this image sensor suitable for applications where space is limited.
Being a CMOS image sensor type ensures low power consumption and high sensitivity to light, making it ideal for a wide range of imaging applications.
The slim body height of 4.3 mm allows for easy integration into various devices without adding unnecessary bulk.
The rectangular package shape provides ease of mounting and handling during assembly.
The low minimum supply voltage ensures efficient power usage and extends the lifespan of the image sensor.
With a high maximum operating temperature of 60 °C, this image sensor can function reliably in a variety of environmental conditions.
The high horizontal pixel count of 1696 contributes to producing sharp and detailed images with accurate color reproduction.
The digital output type simplifies the integration of the image sensor with digital systems for seamless data processing.
The low minimum operating temperature of 0 °C ensures that the image sensor remains operational even in cold environments.
The ceramic housing provides high durability and resistance to temperature fluctuations, ensuring the longevity of the image sensor.
The high dynamic range of 80 dB allows the image sensor to capture a wide range of light intensities, resulting in well-exposed and balanced images.
The high vertical pixel count of 1710 contributes to better image resolution and clarity.
The moderate body length/diameter of 31 mm offers a balance between compactness and functionality in various applications.
The solder termination type ensures secure and reliable connections during installation and usage.
With a high frame rate of 485 frames per second, this image sensor can capture fast-moving objects with smooth motion and minimal blur.
The full-frame array type maximizes the sensor's light-gathering capacity, resulting in high-quality images with excellent clarity and detail.
The through-hole mounting feature provides secure and stable mounting of the image sensor on circuit boards or other surfaces.
Image Sensors CYIL1SN3000AA-GZDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
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Pixel Size (um):
Sensors or Transducers Type:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDD5614P
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
2N2222A
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
Gec Plessey Semiconductors
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EU2B-YS3303C
Idec
ROTARY SWITCH;
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
11KAI-04070-FBA-JD-AE
The Onsemi 11KAI-04070-FBA-JD-AE is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. It operates b/w -50 to 70 °C and has a max supply voltage of 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KLI-8023-AAA-ER-AA
KLI-8023-AAA-ER-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0 to 70 °C, with a dynamic range of 84 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIX2SN8000B-LTI
NOIX2SN8000B-LTI by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 1/1.1 inch optical format. Ideal for applications requiring high-resolution imaging at a max operating temperature of 85 °C, offering a dynamic range of 68 dB and I2C/SPI interface for digital voltage output.
KAI-0330-AAA-CP-BA-DUALOUTPUT
KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 12V. Ideal for applications requiring high-quality imaging in a compact form factor.
NOIP1SN0300A-QTI
NOIP1SN0300A-QTI by Onsemi features 4.80x4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. Ideal for digital imaging applications requiring high frame rates and a wide dynamic range.
MT9J003I12STCU-DP
Onsemi's MT9J003I12STCU-DP image sensor features 3856x2764 pixels, 1.67um pixel size, and a 48MHz master clock. Ideal for high-resolution imaging applications in industries like surveillance, automotive, and machine vision due to its high frame rate of 60fps and digital output interface.
AR0330CS1C12SPKA0-CP
The Onsemi AR0330CS1C12SPKA0-CP is a 1/3 inch CMOS image sensor with 2304x1296 pixels. It operates at 27 MHz with a dynamic range of 69.5 dB and outputs digital voltage from 0.40-1.40V. Ideal for applications requiring high-resolution imaging and fast frame rates up to 60 fps, it features a compact square package suitable for surface mounting.
MT9T031C12STC-DR
Onsemi's MT9T031C12STC-DR is a 3.20x3.20 um CMOS image sensor with 2048H x 1536V pixels, offering a dynamic range of 61 dB and operating at a max clock speed of 48 MHz. It has a digital voltage output interface, suitable for frame array applications in devices requiring high-resolution imaging capabilities.
KAI-02050-ABA-JP-AE
Onsemi's KAI-02050-ABA-JP-AE is a 5.5x5.5 um CCD image sensor with 1684H x 1264V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a supply voltage range of 14.5V to 15.5V and comes in a rectangular package style. Ideal for applications requiring high-quality imaging in industrial and scientific fields.
KAE-08151-ABA-JP-FA
The Onsemi KAE-08151-ABA-JP-FA is an image sensor with 5.5x5.5 um pixel size, 2856 horizontal and vertical pixels, and 86 dB dynamic range. It operates b/w -70 to 40 °C with a supply voltage range of 14.7V to 15V. Ideal for applications requiring high-resolution imaging in industrial cameras or surveillance systems due to its CCD sensor technology and rectangular package style.
KAI-4021-CBA-CD-BA
KAI-4021-CBA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
KAF-50100-CAA-JD-AA
The Onsemi KAF-50100-CAA-JD-AA is a CCD image sensor with 6x6 um pixel size, offering a dynamic range of 70.2 dB. With a resolution of 8176x6132 pixels, it operates b/w 0-60 °C and supports data rates up to 18 Mbps. Ideal for high-resolution imaging applications in various industries.
AR0231AT7C00XUEA0-DRBR-E
Onsemi's AR0231AT7C00XUEA0-DRBR-E is a CMOS image sensor with 3um pixel size, 27 MHz master clock, and 120dB dynamic range. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and fast frame rate of 60fps.
KAF-16803-ABA-DD-AE
The Onsemi KAF-16803-ABA-DD-AE is a CCD image sensor with 4096x4096 pixels, 9x9 um pixel size, and 80 dB dynamic range. It operates b/w -60 to 60 °C, has a spectral response of 300-1100 nm, and data rate of 10 Mbps. Ideal for high-resolution imaging applications in astronomy, microscopy, and scientific research.
AR1335CSSC11SMD20
Onsemi's AR1335CSSC11SMD20 is a 1/3.2-inch CMOS image sensor with 4208x3120 pixels, offering a pixel size of 1.1μm and a max supply voltage of 1.3V. With a master clock of 48MHz, it provides digital voltage output via a 2-wire interface, making it ideal for applications requiring high-resolution imaging at up to 30fps.
KAF-40000-CXA-JD-AE
The Onsemi KAF-40000-CXA-JD-AE is a CCD image sensor with 6x6 um pixel size, 7304 horizontal pixels, and 5478 vertical pixels. It operates b/w 0-60 °C with a dynamic range of 70.2 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
AR0238CSSC12SHRA0-DP
Onsemi's AR0238CSSC12SHRA0-DP image sensor features 3x3 um pixel size, 48 MHz master clock, and 1/2.7 inch optical format. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in a compact square package suitable for surface mounting.
NOIP1SE1300A-QTI
NOIP1SE1300A-QTI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-speed digital imaging with a frame rate of 210 fps.
KAI-08052-FBA-JD-BA
KAI-08052-FBA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAE-04471-ABA-SP-EE
The Onsemi KAE-04471-ABA-SP-EE is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, outputs voltage, and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.
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CYIL1SC1300AA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Data Rate: 40 Mbps;
CYIL1SC4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Minimum Supply Voltage: 2.25 V;
CYIL1SE0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 3.3 V; Housing: CERAMIC;
CYIL1SE3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 31 mm;
CYIL1SM0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Additional Features: ELECTRONIC SNAPSHOT SHUTTER;
CYIL1SM0300AA-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC SNAPSHOT SHUTTER; Array Type: FULL FRAME;
CYIL1SM1300AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Maximum Operating Current: 50 mA;
CYIL1SM4000AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 60 Cel; Additional Features: ELECTRONIC ROLLING SHUTTER;
CYIL1SM4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Maximum Supply Voltage: 2.75 V;
CYIL1SM4000AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Master Clock: 33 MHz;
CYIL2SC1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1280; Output Interface Type: 3-WIRE INTERFACE;
CYIL2SM1300AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Master Clock: 315 MHz; Horizontal Pixel: 1280;
CYIL2SM1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1; Body Length/Diameter: 35.5 mm;
CYIL1SE3000AA-BDCES
Infineon Technologies
Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Power Supplies (V): 2.5; Horizontal Pixel: 1696; Maximum Operating Temperature: 60 Cel;
CYIL1SN3000AA-BDCES
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: 0 Cel; Pixel Size (um): 8X8; Maximum Operating Temperature: 60 Cel; Power Supplies (V): 2.5;
CYIL2SM1300AA-GZWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Pixel Size (um): 14X14; Power Supplies (V): 2.5; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1024;
CYIL1SN3000AA-GZDC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1696; Pixel Size (um): 8X8;
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