Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYIL1SC4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a max supply voltage of 2.75V. Ideal for applications requiring high-resolution imaging at a frame rate of 15 fps, such as surveillance systems or industrial cameras.
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Vyrian
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$105.770
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$116.347
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UHIMA Technologies
Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for applications where detailed imaging is required.
Higher maximum supply voltage provides flexibility in power supply options and can handle fluctuations in voltage without compromising performance.
High master clock frequency ensures fast data readout and processing, making this image sensor suitable for applications requiring real-time imaging.
Compact body width allows for easy integration into various devices and systems without taking up much space.
CMOS image sensors offer low power consumption, high sensitivity, and excellent image quality, making them a popular choice for imaging applications.
Low body height enables slim and compact design, making this image sensor suitable for applications where space is limited.
Square package shape allows for easy mounting and alignment in systems, ensuring proper positioning for optimal image capture.
Lower minimum supply voltage helps in reducing power consumption and extends battery life in portable devices using this image sensor.
High maximum operating temperature range makes this image sensor suitable for use in harsh environments or outdoor applications where temperature fluctuations can occur.
High horizontal pixel count provides detailed and high-resolution images, making this image sensor ideal for applications requiring precise image capture.
Wide output voltage range allows for flexibility in signal processing and compatibility with a variety of systems and devices.
Digital output simplifies signal processing and transmission, making the data collected by this image sensor easily accessible and compatible with digital systems.
Low minimum operating temperature ensures reliable performance even in cold environments, making this image sensor suitable for use in various temperature conditions.
Moderate maximum operating current ensures low power consumption and prevents overheating, making this image sensor energy-efficient and reliable.
Ceramic housing provides durability and protection to the image sensor, making it resistant to temperature changes, moisture, and physical damage.
High dynamic range allows for capturing both bright and dark areas in an image with detail, making this image sensor suitable for applications requiring high contrast imaging.
High vertical pixel count enhances image resolution and detail, making this image sensor ideal for applications requiring precise vertical image capture.
Compact body length allows for easy integration and mounting, making this image sensor suitable for applications where space is limited.
Solder termination provides a reliable and secure connection, ensuring proper functioning and longevity of the image sensor in various operating conditions.
3-wire interface simplifies connection and communication with external devices, making integration and data transfer efficient and straightforward.
Moderate frame rate enables smooth and fluid image capture, making this image sensor suitable for applications requiring motion detection or video recording.
Full-frame array type allows for capturing complete images in a single shot, making this image sensor ideal for applications requiring fast and simultaneous image capture.
High sensitivity value ensures detailed and accurate image capture even in low light conditions, making this image sensor suitable for applications requiring high sensitivity imaging.
Through-hole mounting feature provides secure and stable mounting, ensuring proper alignment and functionality of the image sensor in various devices and systems.
Image Sensors CYIL1SC4000AA-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Frontier Electronics
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WT
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720AI-CP-TR
Microchip Technology
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Semitronics
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
Tak Cheong Electronics Holdings
LM358AN
Fairchild Semiconductor
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
KAI-2001M
Onsemi
Image Sensors;
NOIX2SN9400B-LTI1
NOIX2SN9400B-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 3072 horizontal pixels. It operates b/w -40 to 85 °C and outputs digital voltage via I2C/SPI interface. Ideal for applications requiring high-resolution imaging at a fast frame rate like surveillance systems or industrial cameras.
KAI-2020-AAA-CR-BA
The Onsemi KAI-2020-AAA-CR-BA is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 14.5V, providing a dynamic range of 60 dB. This rectangular CCD sensor with analog voltage output is ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V138C12STC-DP
MT9V138C12STC-DP by Onsemi is a 5.60x5.60 um CMOS image sensor with 680H x 512V pixels, operating at 30 fps. It has a max supply voltage of 1.9V and a dynamic range of 74.8 dB, suitable for digital imaging applications in various industries.
MT9M413C36STM
The Onsemi MT9M413C36STM is a 12x12 um CMOS image sensor with 1280H x 1024V pixels. Operating at 66 MHz, it has a max supply voltage of 3.6 V and frame rate of 500 fps. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
TC210-M
Texas Instruments
TC210-M by Texas Instruments is an image sensor with 192x165 pixels, 13.8X16 um size, and operates at -10 to 45 °C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
MT9M031I12STMZ-DRBR
MT9M031I12STMZ-DRBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and frame rate of 60fps. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high sensitivity and compact square package design.
AR0134CSSM00SUEA0-DPBR1
The Onsemi AR0134CSSM00SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. This sensor is commonly used in applications such as digital cameras, surveillance systems, and automotive imaging.
KAI-4021M
The Onsemi KAI-4021M is a CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at supply voltages b/w 14.5V to 15.5V and outputs analog voltage signals at a data rate of 40Mbps. Ideal for high-resolution imaging applications in industrial and scientific fields due to its superior performance specifications.
KAI-02150-CBA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
KAI-0340-AAA-CP-AA
KAI-0340-AAA-CP-AA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640 horizontal pixels, and 480 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 62 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAF-8300-AXC-CD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Housing: CERAMIC;
NOIV2SN1300A-QDC
NOIV2SN1300A-QDC by Onsemi features 4.80X4.80 um pixel size, 62 MHz master clock, and 1280x1024 resolution. Ideal for image sensing applications due to its CMOS sensor type and 1/2 inch optical format, with a frame rate of 37 fps.
KAI-47051-FXA-JD-B1
KAI-47051-FXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
AS0260HQSC28SUD20
AS0260HQSC28SUD20 by Onsemi is a CMOS image sensor with 1920x1080 pixels, 1.4um pixel size, and 54MHz master clock. It operates b/w -30 to 70 °C and has a dynamic range of 65dB. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity and frame rate of 120fps.
AR0138AT3R00XUEA0-DPBR
Onsemi's AR0138AT3R00XUEA0-DPBR is a 1/2.6 inch CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications in cameras, offering high-quality imaging capabilities for various visual sensing needs.
KAI-16000-CXA-JD-B1
The Onsemi KAI-16000-CXA-JD-B1 is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It is used in applications requiring high-resolution imaging such as industrial machine vision systems and scientific cameras.
NOIV1SN1300A-QDC
NOIV1SN1300A-QDC by Onsemi is an image sensor with 1280x1024 resolution, 4.80x4.80 um pixel size, and 62 MHz master clock. Ideal for applications requiring high-speed imaging such as machine vision systems or industrial cameras due to its 150 fps frame rate and CMOS sensor technology.
AR0134CSSC00SUEA0-DPBR
AR0134CSSC00SUEA0-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a frame rate of 60fps. Ideal for applications requiring high-quality digital imaging in compact devices.
AS0142ATSC00XUSM0-DRBR-E
Onsemi's AS0142ATSC00XUSM0-DRBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at a max supply voltage of 1.89V, has a master clock of 27 MHz, and offers a dynamic range of 93 dB. Ideal for applications requiring high-resolution imaging in compact devices.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CYIL1SC1300AA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Data Rate: 40 Mbps;
CYIL1SE0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 3.3 V; Housing: CERAMIC;
CYIL1SE3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 31 mm;
CYIL1SM0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Additional Features: ELECTRONIC SNAPSHOT SHUTTER;
CYIL1SM0300AA-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC SNAPSHOT SHUTTER; Array Type: FULL FRAME;
CYIL1SM1300AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Maximum Operating Current: 50 mA;
CYIL1SM4000AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 60 Cel; Additional Features: ELECTRONIC ROLLING SHUTTER;
CYIL1SM4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Maximum Supply Voltage: 2.75 V;
CYIL1SM4000AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Master Clock: 33 MHz;
CYIL1SN3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 3.465 V; Array Type: FULL FRAME;
CYIL2SC1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1280; Output Interface Type: 3-WIRE INTERFACE;
CYIL2SM1300AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Master Clock: 315 MHz; Horizontal Pixel: 1280;
CYIL2SM1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1; Body Length/Diameter: 35.5 mm;
CYIL1SE3000AA-BDCES
Infineon Technologies
Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Power Supplies (V): 2.5; Horizontal Pixel: 1696; Maximum Operating Temperature: 60 Cel;
CYIL1SN3000AA-BDCES
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: 0 Cel; Pixel Size (um): 8X8; Maximum Operating Temperature: 60 Cel; Power Supplies (V): 2.5;
CYIL2SM1300AA-GZWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Pixel Size (um): 14X14; Power Supplies (V): 2.5; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1024;
CYIL1SC4000AA-GDC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Body Height: 3.25 mm;
Supply Digital Components
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12,000 In-Stock
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