Loading...

CYIL1SC4000AA-GDC

Onsemi

CYIL1SC4000AA-GDC by Onsemi

CYIL1SC4000AA-GDC by Onsemi is an image sensor with 2048x2048 pixels, 12x12 um pixel size, and a max supply voltage of 2.75V. Ideal for applications requiring high-resolution imaging at a frame rate of 15 fps, such as surveillance systems or industrial cameras.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,256

-

-

-

-

Digiode

USA . 914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 545 parts In-Stock

1+ parts

$105.770

100+ parts

-

1k+ parts

-

10k+ parts

$101.539

545

$105.770

-

-

$101.539

Northwest PG Solutions

USA . 1,198 parts In-Stock

1+ parts

$116.347

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

$116.347

-

-

-

Kulean Microsystems

USA . 8,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,184

-

-

-

-

Problanco Electronics

Mexico . 6,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,234

-

-

-

-

TANS Electronics

Latvia . 6,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,209

-

-

-

-

SupplyDigital Components

Austria . 780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

780

-

-

-

-

Corohmni

South Africa . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

497

-

-

-

-

Corphita

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

490

-

-

-

-

UHIMA Technologies

Türkiye . 286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

286

-

-

-

-

Overview

Elevate your imaging capabilities with the CYIL1SC4000AA-GDC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that redefine visual experiences. Ideal for applications such as surveillance systems, automotive cameras, and industrial imaging, this sensor offers exceptional value through its high sensitivity, wide dynamic range, and precise output interface. Trust Onsemi to provide cutting-edge technology that ensures superior performance and reliability in every project. Immerse yourself in the world of advanced imaging with the CYIL1SC4000AA-GDC.

Feature Benefit Bullets

Pixel Size (um): 12X12

Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for applications where detailed imaging is required.

Maximum Supply Voltage: 2.75 V

Higher maximum supply voltage provides flexibility in power supply options and can handle fluctuations in voltage without compromising performance.

Master Clock: 33 MHz

High master clock frequency ensures fast data readout and processing, making this image sensor suitable for applications requiring real-time imaging.

Body Width: 42 inch

Compact body width allows for easy integration into various devices and systems without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors offer low power consumption, high sensitivity, and excellent image quality, making them a popular choice for imaging applications.

Body Height: 3.25 mm

Low body height enables slim and compact design, making this image sensor suitable for applications where space is limited.

Package Shape or Style: SQUARE

Square package shape allows for easy mounting and alignment in systems, ensuring proper positioning for optimal image capture.

Minimum Supply Voltage: 2.25 V

Lower minimum supply voltage helps in reducing power consumption and extends battery life in portable devices using this image sensor.

Maximum Operating Temperature: 60 °C

High maximum operating temperature range makes this image sensor suitable for use in harsh environments or outdoor applications where temperature fluctuations can occur.

Horizontal Pixel: 2048

High horizontal pixel count provides detailed and high-resolution images, making this image sensor ideal for applications requiring precise image capture.

Output Range: -0.50-3.80V

Wide output voltage range allows for flexibility in signal processing and compatibility with a variety of systems and devices.

Output Type: DIGITAL VOLTAGE

Digital output simplifies signal processing and transmission, making the data collected by this image sensor easily accessible and compatible with digital systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments, making this image sensor suitable for use in various temperature conditions.

Maximum Operating Current: 50 mA

Moderate maximum operating current ensures low power consumption and prevents overheating, making this image sensor energy-efficient and reliable.

Housing: CERAMIC

Ceramic housing provides durability and protection to the image sensor, making it resistant to temperature changes, moisture, and physical damage.

Dynamic Range: 66 dB

High dynamic range allows for capturing both bright and dark areas in an image with detail, making this image sensor suitable for applications requiring high contrast imaging.

Vertical Pixel: 2048

High vertical pixel count enhances image resolution and detail, making this image sensor ideal for applications requiring precise vertical image capture.

Body Length/Diameter: 42 mm

Compact body length allows for easy integration and mounting, making this image sensor suitable for applications where space is limited.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection, ensuring proper functioning and longevity of the image sensor in various operating conditions.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface simplifies connection and communication with external devices, making integration and data transfer efficient and straightforward.

Frame Rate: 15 fps

Moderate frame rate enables smooth and fluid image capture, making this image sensor suitable for applications requiring motion detection or video recording.

Array Type: FULL FRAME

Full-frame array type allows for capturing complete images in a single shot, making this image sensor ideal for applications requiring fast and simultaneous image capture.

Sensitivity (V/lx.s): 11.61 V/lx.s

High sensitivity value ensures detailed and accurate image capture even in low light conditions, making this image sensor suitable for applications requiring high sensitivity imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides secure and stable mounting, ensuring proper alignment and functionality of the image sensor in various devices and systems.

Technical Specifications

Image Sensors CYIL1SC4000AA-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

FULL FRAME

Body Width:

42 inch

Body Height:

3.25 mm

Body Length/Diameter:

42 mm

Dynamic Range:

66 dB

Frame Rate:

15 fps

Horizontal Pixel:

2048

Housing:

CERAMIC

Master Clock:

33 MHz

Mounting Feature:

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

12X12

Sensitivity (V/lx.s):

11.61 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Termination Type:

SOLDER

Vertical Pixel:

2048

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17