Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Power Supplies (V): 2.5; Horizontal Pixel: 1696; Maximum Operating Temperature: 60 Cel;
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Image Sensors CYIL1SE3000AA-BDCES attributes and parameters. Explore more Image Sensors devices from Infineon Technologies
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Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
Continental Device India
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AR0330CSSC12SPBA0-DR
AR0330CSSC12SPBA0-DR by Onsemi is a 1/3 inch CMOS image sensor with 2304x1536 pixels, offering a pixel size of 2.2x2.2 um and a max supply voltage of 1.9V. With an output range of 0.40-2.40V and frame rate of 60 fps, it is ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
AR0135CS2M00SUEA0-DPBR2
Onsemi's AR0135CS2M00SUEA0-DPBR2 is a 1/3 inch CMOS image sensor with a 9mm square package. It features solder termination, frame array type, and surface mounting feature. Ideal for applications requiring high-quality imaging in compact spaces like mobile devices and security cameras.
KAE-04472-ABA-SD-FA
KAE-04472-ABA-SD-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C and outputs current at a rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0331SRSC00SUCA0-DPBR
Onsemi's AR0331SRSC00SUCA0-DPBR is a 2.2x2.2 um CMOS image sensor with 2048 (H) x 1536 (V) pixels and a 1/3 inch optical format. It operates at a max supply voltage of 1.95V, has a master clock of 48 MHz, and offers a dynamic range of 100 dB. Ideal for applications requiring high-resolution imaging at up to 60 fps in automotive cameras and surveillance systems.
AS0149ATSC00XUEA0-DRBR-E
IMAGE SENSOR,CMOS;
MT9P401I12STC
The Onsemi MT9P401I12STC is a 2.2x2.2um image sensor with 2592H x 1944V pixels, operating at -30 to 70 °C. It requires a 2.8V power supply and features surface mounting, making it ideal for high-resolution imaging applications in various industries.
KAI-11002-CAA-CD-AE
KAI-11002-CAA-CD-AE by Onsemi is an image sensor with 9x9 um pixel size, 4008 horizontal pixels, and 2672 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for digital imaging applications requiring high-resolution and low-light performance.
KAI-1003-AAA-CR-AE
KAI-1003-AAA-CR-AE by Onsemi is an image sensor with 1024x1024 pixels, 12.8um pixel size, and 72dB dynamic range. It operates b/w 0 to 40 °C, suitable for industrial imaging applications requiring high-resolution and sensitivity. The rectangular CCD sensor has a ceramic housing and through-hole mounting feature for robust performance.
TC241-10
Texas Instruments
TC241-10 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5X27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various environments.
CMV4000-3E5M1PP
Ams Ag
CMV4000-3E5M1PP by Ams Ag is an IMAGE SENSOR with a 60 dB dynamic range and 37 fps frame rate. It operates b/w -30°C to 70°C, featuring SPI INTERFACE output and THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high sensitivity at 5.56 V/lx.s, such as industrial imaging systems.
KAI-02150-QBA-FD-BA
Onsemi's KAI-02150-QBA-FD-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, suitable for surface mount applications in various imaging systems.
VSP7502ZWVR
VSP7502ZWVR by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 1.65-1.95V, operating temperature from -25 to 85°C, and digital output voltage of 1.50-2.10V. Ideal for applications requiring precise imaging in compact devices due to its small form factor and surface mounting feature.
KAI-16000-CXA-JD-AE
KAI-16000-CXA-JD-AE by Onsemi is an image sensor with 7.4um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates at a max supply voltage of 15.5V and has a dynamic range of 65dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP3FN1300A-QDI
NOIP3FN1300A-QDI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 1.9V max supply voltage, and 72 MHz master clock. Ideal for applications requiring high-speed digital imaging with a resolution of 1280x1024 pixels at a frame rate of 210 fps.
KAI-16070-AXA-JD-B2
KAI-16070-AXA-JD-B2 by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 15.5 V max supply voltage. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or medical imaging equipment due to its impressive technical specifications.
MT9V111D00STC
The Onsemi MT9V111D00STC image sensor features a pixel size of 5.60x5.60 um, operates at a max supply voltage of 3.05 V, and has a master clock of 27 MHz. This CMOS sensor is commonly used in applications requiring digital voltage output interfaces, with an optical format of 1/4 inch and a frame rate of 15 fps.
KAE-08151-FBA-SD-EE
KAE-08151-FBA-SD-EE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 66 dB dynamic range, and 2856 horizontal and vertical pixels. It operates b/w -40 to 40 °C with a supply voltage range of 14.7V to 15.3V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings due to its superior technical specifications.
KLI-4104-RAA-CB-AE
KLI-4104-RAA-CB-AE by Onsemi is an Image Sensor with 10x10 um pixel size, 60 dB dynamic range, and voltage output. It operates b/w 0 to 70 °C and has a data rate of 30 Mbps. Ideal for applications requiring high-quality imaging in industrial settings.
MT9P031I12STC-TP
Onsemi's MT9P031I12STC-TP is a 2.2x2.2 um CMOS image sensor with 2592 (H) x 1944 (V) pixels, offering a dynamic range of 70.1 dB and operating at temperatures from -30 to 70°C. It features a digital voltage output interface, operates on supply voltages b/w 1.7-1.9V, and has a max frame rate of 14 fps, making it ideal for applications requiring high-quality imaging in various environmental conditions.
TC281
TC281 by Texas Instruments is an image sensor with 8x8 um pixel size, 13V power supply, and max operating temp of 45°C. With 1010 horizontal pixels and 1030 vertical pixels, it's ideal for THROUGH HOLE MOUNT applications in various industries.
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CYIL1SC1300AA-GAC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Data Rate: 40 Mbps;
CYIL1SC4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Minimum Supply Voltage: 2.25 V;
CYIL1SE0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 3.3 V; Housing: CERAMIC;
CYIL1SE3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 31 mm;
CYIL1SM0300AA-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Termination Type: SOLDER; Additional Features: ELECTRONIC SNAPSHOT SHUTTER;
CYIL1SM0300AA-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Additional Features: ELECTRONIC SNAPSHOT SHUTTER; Array Type: FULL FRAME;
CYIL1SM1300AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 5V; Maximum Operating Current: 50 mA;
CYIL1SM4000AA-GBC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 60 Cel; Additional Features: ELECTRONIC ROLLING SHUTTER;
CYIL1SM4000AA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Maximum Supply Voltage: 2.75 V;
CYIL1SM4000AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: -0.50-3.80V; Master Clock: 33 MHz;
CYIL1SN3000AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 3.465 V; Array Type: FULL FRAME;
CYIL2SC1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1280; Output Interface Type: 3-WIRE INTERFACE;
CYIL2SM1300AA-GWCES
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Master Clock: 315 MHz; Horizontal Pixel: 1280;
CYIL2SM1300AA-GZDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1; Body Length/Diameter: 35.5 mm;
CYIL1SN3000AA-BDCES
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: 0 Cel; Pixel Size (um): 8X8; Maximum Operating Temperature: 60 Cel; Power Supplies (V): 2.5;
CYIL2SM1300AA-GZWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Pixel Size (um): 14X14; Power Supplies (V): 2.5; Maximum Operating Temperature: 70 Cel; Vertical Pixel: 1024;
CYIL1SE3000AA-BDCES
Cypress Semiconductor
Image Sensors; Mounting Feature: SURFACE MOUNT; Vertical Pixel: 1710; Minimum Operating Temperature: 0 Cel; Horizontal Pixel: 1696; Power Supplies (V): 2.5;
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Minimum Operating Temperature: 0 Cel;
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