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KAI-01050-FBA-FD-BA

Onsemi

KAI-01050-FBA-FD-BA by Onsemi

KAI-01050-FBA-FD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as surveillance cameras or industrial machine vision systems.

Median Price

$351.574

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$312.510

100+ parts

$293.760

1k+ parts

$265.630

10k+ parts

-

1

$312.510

$293.760

$265.630

-

Verical

USA . 1 parts In-Stock

1+ parts

$390.637

100+ parts

$367.200

1k+ parts

$332.038

10k+ parts

-

1

$390.637

$367.200

$332.038

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,065 parts In-Stock

1+ parts

$296.884

100+ parts

-

1k+ parts

-

10k+ parts

-

1,065

$296.884

-

-

-

Vyrian

USA . 6,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,951

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 84 parts In-Stock

1+ parts

$20.390

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$20.390

-

-

-

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$265.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$265.280

-

-

-

Corphita

USA . 1,720 parts In-Stock

1+ parts

$281.259

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$281.259

-

-

-

Corohmni

South Africa . 500 parts In-Stock

1+ parts

$312.510

100+ parts

-

1k+ parts

-

10k+ parts

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500

$312.510

-

-

-

Problanco Electronics

Mexico . 8,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,050

-

-

-

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TANS Electronics

Latvia . 5,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,637

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-

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SupplyDigital Components

Austria . 5,126 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,126

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-

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Kulean Microsystems

USA . 4,977 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,977

-

-

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UHIMA Technologies

Türkiye . 111 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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111

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Overview

Experience the exceptional imaging quality and reliability of the KAI-01050-FBA-FD-BA by Onsemi, a leading manufacturer in the field of image sensors. Ideal for a wide range of applications, this innovative product offers unmatched performance and precision. With its advanced features and cutting-edge technology, customers can expect superior results and seamless integration. Elevate your projects with the KAI-01050-FBA-FD-BA and discover a world of possibilities in imaging solutions.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 15.5 V

Provides a wide range of operating voltage, making it suitable for various applications.

Body Width: 18.29 inch

Compact size makes it easy to integrate into different devices or systems.

Power Supplies (V): 15

Efficient power supply ensures reliable performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high-quality, low-noise image capture.

Body Height: 2.94 mm

Slim profile allows for sleek design and easy installation.

Package Shape or Style: SQUARE

Square shape simplifies mounting and alignment in devices.

Minimum Supply Voltage: 14.5 V

A low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

Wide temperature range ensures reliable operation in various environments.

Minimum Operating Temperature: -50 °C

Capable of functioning in extreme cold temperatures, expanding its usability.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor.

Dynamic Range: 64 dB

High dynamic range allows for capturing a wide range of light intensities with detail.

Vertical Pixel: 1024

Higher number of pixels vertically enhances image resolution and sharpness.

Body Length/Diameter: 18.29 mm

Compact size and shape make it suitable for compact devices and systems.

Optical Format (inch): 1/2

1/2 inch optical format is a common and versatile size for camera sensors.

Termination Type: SOLDER

Solder termination ensures secure electrical connections for reliable performance.

Array Type: INTERLINE

Interline array type provides fast readout and efficient image capture.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies installation and integration into devices.

Technical Specifications

Image Sensors KAI-01050-FBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.94 mm

Body Length/Diameter:

18.29 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1024

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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