Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-01050-ABA-FD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It operates b/w -50 to 70 °C and is ideal for digital voltage output applications in cameras or imaging systems.
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Small pixel size allows for high resolution images with fine details.
Wide range of supply voltage ensures compatibility with various power sources.
Compact size makes it suitable for integration in small devices or systems.
Efficient power supply requirement for optimal performance.
CCD sensors offer high-quality image capture with low noise levels.
Low profile design for flexibility in mounting options.
Square shape allows for easy integration and alignment in imaging systems.
Reliable operation even with low power supply voltage.
Wide operating temperature range for use in various environments.
High horizontal pixel count for detailed and sharp images.
Digital output simplifies interface with other digital devices.
Operational at low temperatures for use in extreme conditions.
Durable ceramic housing for protection and long-term reliability.
Good dynamic range for capturing details in both bright and dark areas of the image.
High vertical pixel count for detailed and clear images.
Compact size and shape for versatile mounting options.
Standard optical format for compatibility with various lenses.
Solder termination for secure and reliable connections.
Interline array for efficient image capture and processing.
Surface mount design for easy and secure installation in devices or systems.
Image Sensors KAI-01050-ABA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi
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Maximum Operating Temperature:
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Optical Format (inch):
Output Type:
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Power Supplies (V):
Sensors or Transducers Type:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
ISO1050DUBR
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
Secos
Nexperia
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
Micro Commercial Components
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
KAI-0340-CBA-CB-AE
KAI-0340-CBA-CB-AE by Onsemi is a 640x480 CCD image sensor with 7.4um pixel size and 62dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.75V to 15.25V. Ideal for applications requiring high-quality analog voltage output in a compact rectangular package.
NOIS1SM1000A-HHC
NOIS1SM1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. Operating temperature ranges from -40 to 85 °C, with analog voltage output and 11 fps frame rate. Ideal for applications requiring high-resolution imaging in a compact square package.
AR0221SR2C00SUEA0-DPBR1
Onsemi's AR0221SR2C00SUEA0-DPBR1 is a 1928x1088 CMOS image sensor with 1/1.7" optical format, offering 60 fps frame rate. Ideal for surface mount applications, it features a 2-wire interface and solder termination type.
TX253SPD-30
TX253SPD-30 by Texas Instruments is an image sensor with 7.4x7.4um pixel size, 680H x 500V resolution, and operates at -10 to 45°C. It requires a 12V power supply and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in varying temperature environments.
KAF-1001E
The Onsemi KAF-1001E is a CCD image sensor with 1024x1024 pixels, 24x24 um pixel size, and 87 dB dynamic range. It operates b/w -50 to 50 °C and has a spectral response of 350-1100 nm. Ideal for high-resolution imaging applications in industrial and scientific fields.
MT9P006I12STCU-DP
MT9P006I12STCU-DP by Onsemi is an image sensor with 2.2x2.2 um pixel size, 96 MHz master clock, and 2592 horizontal pixels. It is ideal for applications requiring a digital voltage output interface, such as surveillance cameras or industrial imaging systems.
NOIS1SM0250S-HHC
NOIS1SM0250S-HHC by Onsemi is a 25x25 um CMOS image sensor with 512x512 pixels, offering an 8 MHz master clock and 74 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 29 fps, it operates b/w 0-65 °C temperature range and outputs analog voltage in the range of 1-4.25V.
KAI-0340-AAA-CP-AA
KAI-0340-AAA-CP-AA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640 horizontal pixels, and 480 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 62 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
AR1820HSSC12SHEA0-DP
AR1820HSSC12SHEA0-DP by Onsemi is a 1/2.3 inch CMOS image sensor with 1.25um pixel size and 24 fps frame rate. It features Tin/Silver/Copper terminal finish, ideal for high-quality imaging applications in consumer electronics, security cameras, and industrial automation systems.
NOIP3SE1300A-QDI
NOIP3SE1300A-QDI by Onsemi is an Image Sensor with 4.80x4.80 um Pixel Size, 1.7-1.9 V Supply Voltage range, and 72 MHz Master Clock. Ideal for applications requiring high-speed image capture like surveillance systems or industrial cameras due to its 1280x1024 resolution and 210 fps Frame Rate.
KAF-0261-AAA-CD-AE
The Onsemi KAF-0261-AAA-CD-AE is a CCD image sensor with 512x512 pixels, 20x20 um pixel size, and 87 dB dynamic range. It operates b/w -70 to 50 °C, suitable for full-frame imaging applications. With a spectral response of 400-1000 nm, it offers high-quality image capture at data rates up to 5 Mbps.
KAI-0340-FBA-CB-AA-SINGLE
KAI-0340-FBA-CB-AA-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
AR0331SRSC00SUCA0-DRBR1
The Onsemi AR0331SRSC00SUCA0-DRBR1 is a 2.2x2.2 um CMOS image sensor with 2048 (H) x 1536 (V) pixels, offering a dynamic range of 100 dB and sensitivity of 1.9 V/lx.s. It operates at temperatures ranging from -30 to 85 °C, with a max supply voltage of 1.95 V and frame rate of 60 fps, making it ideal for high-resolution imaging applications.
TCD132D
Toshiba
Toshiba TCD132D is a 1024H CCD image sensor with 14x14um pixel size. Operating at -25 to 60°C, it requires a 15V power supply. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
KAI-0340-AAA-CP-AE-DUAL
The Onsemi KAI-0340-AAA-CP-AE-DUAL is a 640x480 CCD image sensor with 7.4um pixel size, offering a dynamic range of 69dB. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying conditions. The rectangular package style and through-hole mounting feature make it easy to integrate into systems.
AR0239ATSC00XUEA0-DPBR
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
KAI-16070-FXA-JD-AE
KAI-16070-FXA-JD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.5 V and operating temperatures ranging from -50 to 70 °C.
AR023ZCSC00SUEA0-DRBR
Onsemi's AR023ZCSC00SUEA0-DRBR is a 3x3 um CMOS image sensor with 1928H x 1088V pixels. It operates at 48 MHz master clock, offers 105 dB dynamic range, and has a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in a compact form factor.
KAI-02150-CBA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
CYIWOSC3000AA
CYIWOSC3000AA by Onsemi is an image sensor with 2.54X2.54 um pixel size, 100 MHz master clock, and 55 dB dynamic range. Ideal for applications requiring a full-frame array, it operates b/w -30 to 70 °C and outputs digital voltage via I2C interface at 14 fps.
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IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -50 Cel; Minimum Supply Voltage: 14.5 V;
KAI-02150-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAI-02150-AAA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel; Dynamic Range: 64 dB;
KAI-01150-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Dynamic Range: 64 dB; Array Type: INTERLINE;
KAI-01050-FBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Width: 18.29 inch; Housing: CERAMIC; Horizontal Pixel: 1024;
KAI-01150-CBA-JB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Array Type: INTERLINE;
KAI-01150-ABA-JD-BA
KAI-01050-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Maximum Operating Temperature: 70 Cel;
KAI-01150-CBA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Body Length/Diameter: 18.29 mm;
KAI-01050-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE;
KAI-01150-CBA-JB-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Optical Format (inch): 1/2;
KAI-01050-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel;
KAI-01050-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
KAI-01050-ABA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Vertical Pixel: 1024; Pixel Size (um): 5.5X5.5;
Supply Digital Components
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