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KAI-01050-ABA-FD-BA

Onsemi

KAI-01050-ABA-FD-BA by Onsemi

KAI-01050-ABA-FD-BA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1024x1024 resolution, and 64 dB dynamic range. It operates b/w -50 to 70 °C and is ideal for digital voltage output applications in cameras or imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 165 parts In-Stock

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USA . 165 parts In-Stock

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Vyrian

USA . 5,483 parts In-Stock

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Digiode

USA . 2,299 parts In-Stock

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USA . 3 parts In-Stock

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SupplyDigital Components

Austria . 7,546 parts In-Stock

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TANS Electronics

Latvia . 5,712 parts In-Stock

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Kulean Microsystems

USA . 2,721 parts In-Stock

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Corphita

USA . 698 parts In-Stock

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UHIMA Technologies

Türkiye . 305 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Problanco Electronics

Mexico . 4 parts In-Stock

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Overview

Elevate your imaging experience with the KAI-01050-ABA-FD-BA by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers superior quality and reliability in every product. Perfect for a wide range of applications, this image sensor offers exceptional value and benefits to customers. Capture stunning images with ease and precision, thanks to the advanced technology and innovation packed into this powerful device. Trust Onsemi to provide you with the tools you need to take your imaging projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for high resolution images with fine details.

Maximum Supply Voltage: 15.5 V

Wide range of supply voltage ensures compatibility with various power sources.

Body Width: 18.29 inch

Compact size makes it suitable for integration in small devices or systems.

Power Supplies (V): 15

Efficient power supply requirement for optimal performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high-quality image capture with low noise levels.

Body Height: 2.94 mm

Low profile design for flexibility in mounting options.

Package Shape or Style: SQUARE

Square shape allows for easy integration and alignment in imaging systems.

Minimum Supply Voltage: 14.5 V

Reliable operation even with low power supply voltage.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for use in various environments.

Horizontal Pixel: 1024

High horizontal pixel count for detailed and sharp images.

Output Type: DIGITAL VOLTAGE

Digital output simplifies interface with other digital devices.

Minimum Operating Temperature: -50 °C

Operational at low temperatures for use in extreme conditions.

Housing: CERAMIC

Durable ceramic housing for protection and long-term reliability.

Dynamic Range: 64 dB

Good dynamic range for capturing details in both bright and dark areas of the image.

Vertical Pixel: 1024

High vertical pixel count for detailed and clear images.

Body Length/Diameter: 18.29 mm

Compact size and shape for versatile mounting options.

Optical Format (inch): 1/2

Standard optical format for compatibility with various lenses.

Termination Type: SOLDER

Solder termination for secure and reliable connections.

Array Type: INTERLINE

Interline array for efficient image capture and processing.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy and secure installation in devices or systems.

Technical Specifications

Image Sensors KAI-01050-ABA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.94 mm

Body Length/Diameter:

18.29 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1024

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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