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KAI-01150-ABA-JD-BA

Onsemi

KAI-01150-ABA-JD-BA by Onsemi

KAI-01150-ABA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1280 horizontal pixels, and 720 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring digital voltage output in CCD imaging systems.

Median Price

$176.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$149.160

100+ parts

$140.210

1k+ parts

$131.260

10k+ parts

-

2

$149.160

$140.210

$131.260

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DigiKey

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Verical

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$204.000

1k+ parts

$184.475

10k+ parts

-

2

-

$204.000

$184.475

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 996 parts In-Stock

1+ parts

$164.939

100+ parts

-

1k+ parts

-

10k+ parts

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996

$164.939

-

-

-

Vyrian

USA . 8,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,636

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4 parts In-Stock

1+ parts

$147.370

100+ parts

-

1k+ parts

-

10k+ parts

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4

$147.370

-

-

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Corphita

USA . 1,817 parts In-Stock

1+ parts

$156.258

100+ parts

-

1k+ parts

-

10k+ parts

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1,817

$156.258

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-

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Corohmni

South Africa . 164 parts In-Stock

1+ parts

$173.620

100+ parts

-

1k+ parts

-

10k+ parts

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164

$173.620

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-

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Problanco Electronics

Mexico . 6,032 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,032

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-

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SupplyDigital Components

Austria . 5,402 parts In-Stock

1+ parts

-

100+ parts

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5,402

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Kulean Microsystems

USA . 1,583 parts In-Stock

1+ parts

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1,583

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-

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TANS Electronics

Latvia . 1,523 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,523

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-

-

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UHIMA Technologies

Türkiye . 614 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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614

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Overview

Unleash the power of cutting-edge imaging technology with the KAI-01150-ABA-JD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that are perfect for a wide range of applications. From security cameras to medical imaging devices, this product offers unparalleled value, benefits, and advantages to customers. Experience superior image quality, reliability, and performance with the KAI-01150-ABA-JD-BA, setting a new standard in imaging technology.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Small pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for more flexibility in power supply options.

Body Width: 20.07 inch

Compact body width makes it easier to integrate into different systems or devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality image capture with low noise levels.

Body Height: 3.33 mm

Low body height allows for compact and slim design options.

Package Shape or Style: RECTANGULAR

Rectangular package shape is easily mountable and compatible with various setups.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for usage in various environments.

Horizontal Pixel: 1280

High horizontal pixel count provides detailed images with sharp resolution.

Output Type: DIGITAL VOLTAGE

Digital voltage output is easy to interface with other digital systems.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Dynamic Range: 64 dB

Good dynamic range allows for capturing both bright and dark details in an image.

Vertical Pixel: 720

Vertical pixel count contributes to capturing high-quality images with good depth.

Body Length/Diameter: 33.02 mm

Moderate body length/diameter ensures a balance between compactness and functionality.

Optical Format (inch): 1/2

1/2 inch optical format provides a standard size for compatibility with various lenses.

Termination Type: SOLDER

Solder termination offers a secure and reliable connection during installation.

Array Type: INTERLINE

Interline array type helps in reducing image smear and improving image quality.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides strong and stable installation options.

Technical Specifications

Image Sensors KAI-01150-ABA-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Height:

3.33 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1280

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/2

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

720

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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