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AR1820HSSC00SHEA0-DP1

Onsemi

AR1820HSSC00SHEA0-DP1 by Onsemi

Onsemi's AR1820HSSC00SHEA0-DP1 is a 1/2.3" CMOS image sensor with 1.25um pixel size, offering 24 fps frame rate. It features Tin/Silver/Copper terminal finish and is ideal for applications requiring high-quality imaging in consumer electronics and industrial devices.

Median Price

$32.880

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

AR1820HSSC00SHEA0-DP1 by Onsemi
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,121 parts In-Stock

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$53.350

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$53.350

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$53.350

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$53.350

$53.350

Flip Electronics (Authorized)

USA . 1,121 parts In-Stock

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Arrow

USA . 140 parts In-Stock

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$32.880

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140

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Verical

USA . 140 parts In-Stock

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$32.880

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Distributors (In-Stock)

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Vyrian

USA . 2,309 parts In-Stock

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$35.900

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Chip Stock

USA . 2,700 parts In-Stock

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VNN

France . 1,416 parts In-Stock

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USA . 1,121 parts In-Stock

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Digiode

USA . 993 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 283 parts In-Stock

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$35.900

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Ampacity Inc.

Singapore . 487 parts In-Stock

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$66.420

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487

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SupplyDigital Components

Austria . 7,622 parts In-Stock

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Kulean Microsystems

USA . 6,664 parts In-Stock

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Continental Prestige Electronics

USA . 4,082 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Problanco Electronics

Mexico . 1,046 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 450 parts In-Stock

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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310

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TANS Electronics

Latvia . 244 parts In-Stock

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Argo Parts USA

USA . 211 parts In-Stock

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Overview

Capture stunning images with the AR1820HSSC00SHEA0-DP1 by Onsemi, a top-tier manufacturer known for delivering high-quality image sensors. Ideal for a wide range of applications, this CMOS image sensor offers exceptional performance and reliability. With a pixel size of 1.25 um and an optical format of 1/2.3 inch, this sensor provides sharp and detailed imaging at a frame rate of 24 fps. Whether you're a professional photographer or a hobbyist, this sensor will elevate your photography game to new heights. Unlock endless creative possibilities with the AR1820HSSC00SHEA0-DP1 and experience superior image quality like never before.

Feature Benefit Bullets

Pixel Size (um): 1.25

Smaller pixel size allows for higher resolution images to be captured, making this image sensor ideal for applications requiring detailed image quality.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption, making this image sensor energy efficient and suitable for portable devices or applications where power efficiency is important.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper in the terminal finish enhances the durability and conductivity of the image sensor, ensuring reliable performance over time.

Optical Format (inch): 1/2.3

The 1/2.3 inch optical format allows for a wide field of view, making this image sensor suitable for capturing a larger area in a single frame.

Frame Rate: 24 fps

A frame rate of 24 fps ensures smooth and high-quality video recording, making this image sensor ideal for applications that require capturing fast-moving objects or scenes.

Array Type: FRAME

The frame array type ensures efficient image capture and processing, allowing for seamless integration into imaging systems and devices.

Technical Specifications

Image Sensors AR1820HSSC00SHEA0-DP1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Frame Rate:

24 fps

JESD-609 Code:

e1

Optical Format (inch):

1/2.3

Pixel Size (um):

1.25

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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