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KAE-02150-ABB-SP-FA

Onsemi

KAE-02150-ABB-SP-FA by Onsemi

Onsemi's KAE-02150-ABB-SP-FA is a 2/3-inch CCD image sensor with 1920x1080 pixels, offering a pixel size of 5.5um. It operates b/w -40 to 40 °C, with a dynamic range of 68dB and supports up to 60fps frame rate. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$3.326

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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$3.326

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Digiode

USA . 982 parts In-Stock

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Vyrian

USA . 566 parts In-Stock

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TANS Electronics

Latvia . 5,890 parts In-Stock

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Kulean Microsystems

USA . 3,487 parts In-Stock

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Problanco Electronics

Mexico . 3,289 parts In-Stock

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Corphita

USA . 1,738 parts In-Stock

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SupplyDigital Components

Austria . 1,437 parts In-Stock

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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Corohmni

South Africa . 289 parts In-Stock

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Overview

Elevate your imaging experience with the KAE-02150-ABB-SP-FA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality image sensors that are ideal for a wide range of applications. From security and surveillance to medical imaging and industrial automation, this cutting-edge product offers unparalleled value, precision, and performance. Upgrade your imaging capabilities today with the KAE-02150-ABB-SP-FA and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images.

Maximum Supply Voltage: 6 V

Allows for flexibility in power supply options.

Body Width: 29.97 inch

Compact size enables easy integration into various systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality images with low noise levels.

Body Height: 4.61 mm

Low profile design for compact installations.

Package Shape or Style: RECTANGULAR

Standard shape for easy mounting and compatibility with existing systems.

Minimum Supply Voltage: 4.5 V

Can operate at lower power, saving energy.

Maximum Operating Temperature: 40 °C

High temperature resistance for use in various environments.

Horizontal Pixel: 1920

High pixel count for detailed images.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions.

Housing: ALUMINIUM

Provides durability and protection for the sensor.

Dynamic Range: 68 dB

Provides accurate representation of light and dark areas in images.

Vertical Pixel: 1080

High resolution for vertical detail.

Body Length/Diameter: 33 mm

Compact size for space-constrained applications.

Optical Format (inch): 2/3

Compatible with a wide range of lenses for different imaging applications.

Termination Type: SOLDER

Secure connection for reliable performance.

Frame Rate: 60 fps

High frame rate for capturing fast-moving subjects.

Array Type: INTERLINE

Efficient structure for image capture.

Mounting Feature: THROUGH HOLE MOUNT

Easy installation and secure mounting option.

Technical Specifications

Image Sensors KAE-02150-ABB-SP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB

Array Type:

INTERLINE

Body Width:

29.97 inch

Body Height:

4.61 mm

Body Length/Diameter:

33 mm

Dynamic Range:

68 dB

Frame Rate:

60 fps

Horizontal Pixel:

1920

Housing:

ALUMINIUM

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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