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KAE-02150-ABB-SD-FA

Onsemi

KAE-02150-ABB-SD-FA by Onsemi

KAE-02150-ABB-SD-FA by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, offering a dynamic range of 68 dB. Operating b/w -40 to 40 °C, it has a max supply voltage of 6V and min of 4.5V. Ideal for applications requiring high-resolution imaging at up to 60 fps.

Median Price

$1,695.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 80 parts In-Stock

1+ parts

$1,695.980

100+ parts

$1,651.920

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80

$1,695.980

$1,651.920

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Verical

USA . 80 parts In-Stock

1+ parts

$1,695.980

100+ parts

$1,651.920

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80

$1,695.980

$1,651.920

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Distributors (In-Stock)

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Digiode

USA . 1,276 parts In-Stock

1+ parts

$1,611.181

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1,276

$1,611.181

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Vyrian

USA . 6,428 parts In-Stock

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6,428

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Distributors (Availability)

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Corphita

USA . 772 parts In-Stock

1+ parts

$1,526.382

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772

$1,526.382

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Corohmni

South Africa . 406 parts In-Stock

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$1,695.980

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406

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SupplyDigital Components

Austria . 8,270 parts In-Stock

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8,270

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TANS Electronics

Latvia . 8,022 parts In-Stock

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8,022

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Kulean Microsystems

USA . 5,793 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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845

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Problanco Electronics

Mexico . 536 parts In-Stock

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536

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Overview

Experience exceptional image quality and performance with the KAE-02150-ABB-SD-FA by Onsemi. As a leader in the industry, Onsemi delivers top-of-the-line image sensors that offer unmatched precision and reliability. Ideal for a wide range of applications, this CCD image sensor provides crystal-clear imaging with a high dynamic range of 68 dB. From surveillance systems to medical imaging, this product boasts a maximum supply voltage of 6V and a minimum operating temperature of -40 °C, ensuring optimal functionality in any environment. Upgrade your imaging solutions today with the KAE-02150-ABB-SD-FA and discover the difference Onsemi can make for you.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images to be captured with fine details, making this product suitable for applications requiring high image quality.

Maximum Supply Voltage: 6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Body Width: 29.97 inch

The compact body width enables easy integration into different devices or systems without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

The use of CCD imaging technology ensures high sensitivity and low noise performance, making this product ideal for imaging applications where image quality is paramount.

Body Height: 4.61 mm

The low body height allows for a slim profile, making this sensor suitable for applications with space constraints.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides easy mounting and alignment options for seamless integration into different designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions, making this sensor suitable for outdoor or industrial applications.

Horizontal Pixel: 1920

The high horizontal pixel count provides sharp images with excellent clarity, making this sensor suitable for high-resolution imaging.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making this product suitable for a wide range of applications.

Housing: ALUMINIUM

The use of aluminum housing provides durability, lightweight construction, and good thermal conductivity, ensuring reliable performance and longevity of the sensor.

Dynamic Range: 68 dB

The high dynamic range allows for capturing both bright and dark areas in a scene with good detail, making this sensor suitable for high-contrast imaging.

Vertical Pixel: 1080

The high vertical pixel count enhances image resolution and quality, making this sensor ideal for applications requiring detailed vertical image capture.

Body Length/Diameter: 33 mm

The compact body length/diameter enables easy installation and integration into different systems or devices.

Optical Format (inch): 2/3

The 2/3 inch optical format is a standard size in the industry, ensuring compatibility with a wide range of lenses and optical components.

Termination Type: SOLDER

The solder termination type provides a secure and reliable connection, ensuring stable operation and long-term performance.

Frame Rate: 60 fps

The high frame rate of 60 frames per second allows for capturing fast-moving objects with smooth motion, making this sensor suitable for dynamic imaging applications.

Array Type: INTERLINE

The use of interline array technology reduces image lag and improves overall image quality, making this sensor suitable for fast-paced imaging applications.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature allows for secure and reliable attachment to the PCB or mounting surface, ensuring stability during operation.

Technical Specifications

Image Sensors KAE-02150-ABB-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB

Array Type:

INTERLINE

Body Width:

29.97 inch

Body Height:

4.61 mm

Body Length/Diameter:

33 mm

Dynamic Range:

68 dB

Frame Rate:

60 fps

Horizontal Pixel:

1920

Housing:

ALUMINIUM

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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