Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAE-02150-FBB-JP-FA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial settings or surveillance systems due to its superior performance and reliability at a max supply voltage of 6V.
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Vyrian
Digiode
AZTECH Wire
$21.540
TANS Electronics
SupplyDigital Components
Kulean Microsystems
Corphita
Problanco Electronics
UHIMA Technologies
Corohmni
Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for detailed imaging applications.
Higher maximum supply voltage allows for enhanced performance and flexibility in powering the image sensor.
Compact body width makes the image sensor suitable for integration into various types of devices without taking up too much space.
Higher power supply voltage provides sufficient power for the image sensor to operate effectively and capture high-quality images.
CCD sensors are known for their high-quality image capture capabilities, making this image sensor a reliable choice for professional imaging applications.
Low body height allows for slim and compact device designs when integrating this image sensor.
Rectangular package shape provides versatility in mounting options and compatibility with various device designs.
Lower minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.
Higher maximum operating temperature range enables the image sensor to be used in diverse environmental conditions without any performance degradation.
High horizontal pixel count results in detailed and high-resolution images, suitable for applications requiring precise imaging.
Low minimum operating temperature allows the image sensor to function reliably in extreme cold conditions without any malfunctions.
Aluminum housing provides durability and heat dissipation capabilities, ensuring the longevity and consistent performance of the image sensor.
High dynamic range allows the image sensor to capture a wide range of light intensities, resulting in balanced and detailed images.
High vertical pixel count contributes to the image sensor's ability to capture detailed and high-resolution images, making it suitable for demanding imaging tasks.
Moderate body length/diameter provides a good balance between compact size and ease of integration into devices.
2/3-inch optical format is a common standard in image sensors, ensuring compatibility with various optics and imaging systems.
Solder termination type provides a secure connection method for integrating the image sensor into devices, ensuring reliability and longevity.
High frame rate allows the image sensor to capture fast-moving subjects with clarity and smoothness, making it ideal for dynamic imaging applications.
Interline array type enables faster readout speeds and reduces image lag, ensuring real-time image capture capabilities for various applications.
Through hole mounting feature provides a secure and stable attachment method for the image sensor, ensuring reliable operation in various environments.
Image Sensors KAE-02150-FBB-JP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 18/Sep/2019
PCN Design/Specification - Datasheet Update 09/Apr/2015 KAE-02150 Datasheet Update 15/Mar/2018
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Weitronic Enterprise
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
Gulf Semiconductor
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
Hy Electronic
Comset Semiconductors
First Components International
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
MT9V022IA7ATM-DP
MT9V022IA7ATM-DP by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a max supply voltage of 3.6V and operating temperature range from -40 to 85°C. With a frame rate of 60 fps, this sensor is ideal for digital current output applications requiring high dynamic range and precise imaging capabilities.
KAI-01150-CBA-JD-AE
The Onsemi KAI-01150-CBA-JD-AE is a 5.5x5.5 um CCD image sensor with 1280H x 720V pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V. Ideal for applications requiring digital voltage output in an optical format of 1/2 inch, such as industrial imaging systems.
AR0138AT2C00XUD20-E
Onsemi's AR0138AT2C00XUD20-E is a 1/2.6 inch CMOS image sensor with 4.2um pixel size, offering 1288x968 resolution and 115dB dynamic range. Operating at -40 to 110 °C, it has a max supply voltage of 1.26V and outputs digital voltage in the range of 0.40-2.50V. Ideal for applications requiring high-resolution imaging with low power consumption and wide temperature range capabilities at up to 69 fps frame rate using a two-wire interface.
MT9M031I12STC-DPBR
MT9M031I12STC-DPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 50MHz master clock. Ideal for applications requiring high-quality digital imaging at up to 45fps with a dynamic range of 64dB.
AMIS710401-A4
Image Sensors; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel; Horizontal Pixel: 3456;
MT9V032C12STM-TP
Onsemi's MT9V032C12STM-TP is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 752H x 480V resolution. Operating at up to 26.6 MHz master clock, it provides a dynamic range of 54.4 dB and supports digital current output interface. Ideal for applications requiring high-quality imaging at temperatures ranging from -30°C to 70°C.
KAI-16000-AXA-JP-AE
KAI-16000-AXA-JP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 65 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields.
OVM9724-RADA
Omnivision Technologies
Omnivision Technologies' OVM9724-RADA is a CMOS image sensor with 1.4X1.4 um pixel size and 70.4 dB dynamic range. It operates b/w -30 to 70 °C, offering 30 fps frame rate for applications requiring high sensitivity at 0.74 V/lx.s, such as surveillance cameras and automotive vision systems.
AMIS-720442-A
Image Sensors; Power Supplies (V): 5; Vertical Pixel: 1; Horizontal Pixel: 128; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
AR0234CSSC28SUKA0-CP
AR0234CSSC28SUKA0-CP by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, or industrial settings.
KAI-4021-ABA-CR-AE
KAI-4021-ABA-CR-AE by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting, offering a data rate of 40 Mbps.
MT9J003I12STMU-DP
MT9J003I12STMU-DP by Onsemi is a 1/2.3" CMOS image sensor with 3856x2764 pixels, 65.2 dB dynamic range, and 60 fps frame rate. It operates at -30 to 70 °C, with a supply voltage of 1.7-1.9V, making it ideal for high-resolution imaging applications in various industries.
AR0220AT4C00XUEA2-DRBR
Onsemi's AR0220AT4C00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output at 60 fps. Ideal for frame array applications, it features a rectangular package style suitable for surface mount installation.
CYII4SM6600AB-QDC
Onsemi's CYII4SM6600AB-QDC is a 3.5x3.5 um CMOS image sensor with 2210H x 3002V pixels, operating at 40 MHz clock speed. It offers a digital voltage output range of 0.50-2.80V and features a full-frame array design, suitable for applications requiring high sensitivity and dynamic range in imaging systems.
AR0234CSSC28SUKA0-CR
AR0234CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive, surveillance, and industrial systems.
KAI-2020-ABA-CD-BA
The Onsemi KAI-2020-ABA-CD-BA is a 7.4x7.4 um CCD image sensor with 1600H x 1200V pixels, offering a dynamic range of 60 dB. It operates at supply voltages b/w 14.5V to 15.5V and has an output type of analog voltage, making it suitable for high-resolution imaging applications in industrial and scientific fields.
AMIS-720639
Image Sensors; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5; Maximum Operating Temperature: 50 Cel; Horizontal Pixel: 192; Vertical Pixel: 1;
KAI-16000-AXA-JD-BX
KAI-16000-AXA-JD-BX by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It operates b/w -50 to 70 °C and has a data rate of 30 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
TSL1401CL
Ams-taos Usa
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.60-2.40V; Array Type: LINEAR;
AR0147ATSC00XUEA0-TPBR
Onsemi's AR0147ATSC00XUEA0-TPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and uses a digital output interface. Ideal for applications requiring high-resolution imaging with low light sensitivity.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAE-04471-ABA-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2096; Frame Rate: 30 fps;
KAE-01093-QBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 30 inch; Maximum Operating Temperature: 60 Cel;
KAE-02150-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33 mm; Termination Type: SOLDER; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-02150-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 86 DB; Maximum Operating Temperature: 40 Cel;
KAE-02150-FBB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1920; Array Type: INTERLINE; Power Supplies (V): 15;
KAE-02150-ABB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 15; Optical Format (inch): 2/3; Minimum Operating Temperature: -70 Cel;
KAE-02150-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Minimum Operating Temperature: -40 Cel; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-01093-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Horizontal Pixel: 1024;
KAE-01093-QBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 33 mm;
KAE-02150-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Housing: ALUMINIUM; Optical Format (inch): 2/3;
KAE-02150-ABB-SP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.61 mm; Body Length/Diameter: 33 mm; Horizontal Pixel: 1920;
KAE-02150-FBA-JP-FE
IMAGE SENSOR,CCD;
KAE-02150-ABA-JP-FE
KAE-01093-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-SP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 29.97 inch; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Termination Type: SOLDER; Maximum Operating Temperature: 40 Cel;
KAE-01093-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Frame Rate: 91 fps;
KAE-01093-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Minimum Operating Temperature: -50 Cel;
KAE-02150-ABA-JP-FA
IMAGE SENSOR,CCD; Array Type: INTERLINE; Vertical Pixel: 1080; Additional Features: IT ALSO HAVE DYNAMIC RANGE 86 DB; IT HAS SENSITIVITY OF 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; Horizontal Pixel: 1920; Dynamic Range: 68 dB;
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