Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAE-02150-FBB-JP-FA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial settings or surveillance systems due to its superior performance and reliability at a max supply voltage of 6V.
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AZTECH Wire
$21.540
TANS Electronics
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Kulean Microsystems
Corphita
Problanco Electronics
UHIMA Technologies
Corohmni
Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for detailed imaging applications.
Higher maximum supply voltage allows for enhanced performance and flexibility in powering the image sensor.
Compact body width makes the image sensor suitable for integration into various types of devices without taking up too much space.
Higher power supply voltage provides sufficient power for the image sensor to operate effectively and capture high-quality images.
CCD sensors are known for their high-quality image capture capabilities, making this image sensor a reliable choice for professional imaging applications.
Low body height allows for slim and compact device designs when integrating this image sensor.
Rectangular package shape provides versatility in mounting options and compatibility with various device designs.
Lower minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.
Higher maximum operating temperature range enables the image sensor to be used in diverse environmental conditions without any performance degradation.
High horizontal pixel count results in detailed and high-resolution images, suitable for applications requiring precise imaging.
Low minimum operating temperature allows the image sensor to function reliably in extreme cold conditions without any malfunctions.
Aluminum housing provides durability and heat dissipation capabilities, ensuring the longevity and consistent performance of the image sensor.
High dynamic range allows the image sensor to capture a wide range of light intensities, resulting in balanced and detailed images.
High vertical pixel count contributes to the image sensor's ability to capture detailed and high-resolution images, making it suitable for demanding imaging tasks.
Moderate body length/diameter provides a good balance between compact size and ease of integration into devices.
2/3-inch optical format is a common standard in image sensors, ensuring compatibility with various optics and imaging systems.
Solder termination type provides a secure connection method for integrating the image sensor into devices, ensuring reliability and longevity.
High frame rate allows the image sensor to capture fast-moving subjects with clarity and smoothness, making it ideal for dynamic imaging applications.
Interline array type enables faster readout speeds and reduces image lag, ensuring real-time image capture capabilities for various applications.
Through hole mounting feature provides a secure and stable attachment method for the image sensor, ensuring reliable operation in various environments.
Image Sensors KAE-02150-FBB-JP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 18/Sep/2019
PCN Design/Specification - Datasheet Update 09/Apr/2015 KAE-02150 Datasheet Update 15/Mar/2018
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
Frontier Electronics
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
FDLL4148
National Semiconductor
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Sensitron Semiconductor
Excel (Suzhou) Semiconductor
Transys Electronics
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
AR0220AT3R00XUEA0-DPBR
The Onsemi AR0220AT3R00XUEA0-DPBR image sensor operates at 1.14-1.26V, with a 27 MHz master clock and 1828x948 resolution. Ideal for digital cameras, surveillance systems, and automotive applications due to its high dynamic range of 120 dB and frame rate of 60 fps.
AR0144CSSC00SUKA0-CPBR
The Onsemi AR0144CSSC00SUKA0-CPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. It features a rectangular package shape for surface mount applications.
AR0330CM1C12SHAA0-DP1
The Onsemi AR0330CM1C12SHAA0-DP1 is a 2.2x2.2 um CMOS image sensor with 2304 horizontal pixels and 1536 vertical pixels. It operates at a max supply voltage of 1.9V, has a master clock of 27 MHz, and offers a dynamic range of 69.5 dB. Ideal for applications requiring high-resolution imaging with digital output interface and surface mounting feature at temperatures ranging from -30 to 70 °C.
AR0233ATSC17XUEA1-DPBR-E
Onsemi's AR0233ATSC17XUEA1-DPBR-E is a CMOS image sensor with 2048x1280 resolution, 140 dB dynamic range, and 1/2.5-inch optical format. It operates at 45 fps and is suitable for applications requiring high-quality imaging such as surveillance cameras or industrial machine vision systems.
KAI-08050-CBA-JB-B2
The Onsemi KAI-08050-CBA-JB-B2 is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Operating b/w -50 °C to 70°C, it requires a 15V power supply and has an optical format of 4/3 inch. Ideal for applications requiring high-resolution imaging in various environments.
NOIP1SN0500A-QTI
NOIP1SN0500A-QTI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital imaging applications requiring high frame rates up to 545 fps in a compact SQUARE package suitable for SURFACE mounting.
MT9V127IA3XTC-DP
MT9V127IA3XTC-DP by Onsemi features 5.6x5.6um pixel size, 27 MHz master clock, and 1/4 inch optical format. Ideal for image sensing applications with a frame rate of 60 fps, this CMOS sensor offers a dynamic range of 74.8 dB and operates b/w -40 to 105 °C temperature range.
KAI-50140-AXB-JD-B2
KAI-50140-AXB-JD-B2 by Onsemi is an image sensor with 4.5X4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a dynamic range of 60 dB. Ideal for digital output applications requiring high-resolution imaging in various industries.
MT9D112D00STCK15AC1
Image Sensors;
KAE-08151-FBA-SP-FA
KAE-08151-FBA-SP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2856 horizontal and vertical pixels, and a dynamic range of 66 dB. It operates b/w -40 to 40 °C with a supply voltage range of 14.7V to 15.3V. Ideal for applications requiring high-resolution imaging in industrial cameras or surveillance systems due to its superior performance specifications.
MT9V024IA7XTC
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-3V; Additional Features: GLOBAL SHUTTER;
KAI-50140-AXB-JD-AE
KAI-50140-AXB-JD-AE by Onsemi is an image sensor with 4.5x4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a dynamic range of 60 dB. Ideal for digital output applications in various industries due to its high performance and reliability.
MT9V022IA7ATC
MT9V022IA7ATC by Onsemi is an image sensor with 6x6 um pixel size, 26.6 MHz master clock, and 752 horizontal pixels. Ideal for applications requiring a digital current output interface, such as frame arrays in cameras or surveillance systems.
KAI-02050-CBA-FD-AE
Onsemi's KAI-02050-CBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1684H x 1264V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it has a square ceramic housing and requires a supply voltage of 14.5-15.5 V. Ideal for applications requiring high-quality imaging in industrial and scientific fields.
AR0238CSSC12SPRA0-DR
Onsemi's AR0238CSSC12SPRA0-DR image sensor features 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging with a frame rate of 30 fps in a compact square package.
MT9P001I12STC-B-DR
The Onsemi MT9P001I12STC-B-DR image sensor features 2.20x2.20 um pixel size, 48 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 15 fps in a compact 1/2.5-inch optical format.
NOIP1SE2000A-LTI
NOIP1SE2000A-LTI by Onsemi features 4.8X4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. Ideal for image sensing applications with a spectral response of 400-1000 nm and frame rate of 230 fps.
AR0237CSSC00PRA0-DR
Onsemi's AR0237CSSC00PRA0-DR is a 1/2.7 inch CMOS image sensor with 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. It operates at -30 to 85 °C, with a max supply voltage of 1.95V and output range of 0.4-1.5V. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate.
AR0220AT3B00XUEA0-DPBR-E
The Onsemi AR0220AT3B00XUEA0-DPBR-E is an image sensor with 4.2x4.2 um pixel size, 50 MHz master clock, and 120 dB dynamic range. Ideal for applications requiring high-resolution imaging such as surveillance cameras, drones, and industrial machine vision systems.
AR0135CS2C19SUEA0-DRBR
The Onsemi AR0135CS2C19SUEA0-DRBR is a 1/3 inch CMOS image sensor with a square package style. It features dimensions of 9mm x 9mm x 1.55mm and uses Tin/Silver/Copper terminal finish for soldering. Ideal for surface mount applications, this sensor offers high-quality imaging capabilities in a compact form factor.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAE-04471-ABA-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2096; Frame Rate: 30 fps;
KAE-01093-QBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 30 inch; Maximum Operating Temperature: 60 Cel;
KAE-02150-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33 mm; Termination Type: SOLDER; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-02150-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 86 DB; Maximum Operating Temperature: 40 Cel;
KAE-02150-FBB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1920; Array Type: INTERLINE; Power Supplies (V): 15;
KAE-02150-ABB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 15; Optical Format (inch): 2/3; Minimum Operating Temperature: -70 Cel;
KAE-02150-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Minimum Operating Temperature: -40 Cel; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-01093-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Horizontal Pixel: 1024;
KAE-01093-QBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 33 mm;
KAE-02150-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Housing: ALUMINIUM; Optical Format (inch): 2/3;
KAE-02150-ABB-SP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.61 mm; Body Length/Diameter: 33 mm; Horizontal Pixel: 1920;
KAE-02150-FBA-JP-FE
IMAGE SENSOR,CCD;
KAE-02150-ABA-JP-FE
KAE-01093-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-SP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 29.97 inch; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Termination Type: SOLDER; Maximum Operating Temperature: 40 Cel;
KAE-01093-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Frame Rate: 91 fps;
KAE-01093-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Minimum Operating Temperature: -50 Cel;
KAE-02150-ABA-JP-FA
IMAGE SENSOR,CCD; Array Type: INTERLINE; Vertical Pixel: 1080; Additional Features: IT ALSO HAVE DYNAMIC RANGE 86 DB; IT HAS SENSITIVITY OF 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; Horizontal Pixel: 1920; Dynamic Range: 68 dB;
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