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KAE-02150-FBB-JP-FA

Onsemi

KAE-02150-FBB-JP-FA by Onsemi

KAE-02150-FBB-JP-FA by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. Ideal for applications requiring high-quality imaging in industrial settings or surveillance systems due to its superior performance and reliability at a max supply voltage of 6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,384 parts In-Stock

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Digiode

USA . 1,237 parts In-Stock

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AZTECH Wire

Italy . 1,139 parts In-Stock

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$21.540

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TANS Electronics

Latvia . 7,478 parts In-Stock

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SupplyDigital Components

Austria . 5,362 parts In-Stock

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Kulean Microsystems

USA . 2,799 parts In-Stock

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Corphita

USA . 2,215 parts In-Stock

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Problanco Electronics

Mexico . 1,445 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Corohmni

South Africa . 154 parts In-Stock

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Overview

Elevate your imaging experience with the KAE-02150-FBB-JP-FA by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers unparalleled quality and reliability in every product. This CCD image sensor boasts a wide range of applications, from security cameras to medical imaging equipment. With its superior pixel size and impressive dynamic range, the KAE-02150-FBB-JP-FA ensures crisp, clear images in any environment. Trust Onsemi to provide innovative solutions that exceed your expectations and bring your vision to life.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for detailed imaging applications.

Maximum Supply Voltage: 6 V

Higher maximum supply voltage allows for enhanced performance and flexibility in powering the image sensor.

Body Width: 30 inch

Compact body width makes the image sensor suitable for integration into various types of devices without taking up too much space.

Power Supplies (V): 15

Higher power supply voltage provides sufficient power for the image sensor to operate effectively and capture high-quality images.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for their high-quality image capture capabilities, making this image sensor a reliable choice for professional imaging applications.

Body Height: 2.53 mm

Low body height allows for slim and compact device designs when integrating this image sensor.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides versatility in mounting options and compatibility with various device designs.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 40 °C

Higher maximum operating temperature range enables the image sensor to be used in diverse environmental conditions without any performance degradation.

Horizontal Pixel: 1920

High horizontal pixel count results in detailed and high-resolution images, suitable for applications requiring precise imaging.

Minimum Operating Temperature: -70 °C

Low minimum operating temperature allows the image sensor to function reliably in extreme cold conditions without any malfunctions.

Housing: ALUMINIUM

Aluminum housing provides durability and heat dissipation capabilities, ensuring the longevity and consistent performance of the image sensor.

Dynamic Range: 68 dB

High dynamic range allows the image sensor to capture a wide range of light intensities, resulting in balanced and detailed images.

Vertical Pixel: 1080

High vertical pixel count contributes to the image sensor's ability to capture detailed and high-resolution images, making it suitable for demanding imaging tasks.

Body Length/Diameter: 33 mm

Moderate body length/diameter provides a good balance between compact size and ease of integration into devices.

Optical Format (inch): 2/3

2/3-inch optical format is a common standard in image sensors, ensuring compatibility with various optics and imaging systems.

Termination Type: SOLDER

Solder termination type provides a secure connection method for integrating the image sensor into devices, ensuring reliability and longevity.

Frame Rate: 60 fps

High frame rate allows the image sensor to capture fast-moving subjects with clarity and smoothness, making it ideal for dynamic imaging applications.

Array Type: INTERLINE

Interline array type enables faster readout speeds and reduces image lag, ensuring real-time image capture capabilities for various applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides a secure and stable attachment method for the image sensor, ensuring reliable operation in various environments.

Technical Specifications

Image Sensors KAE-02150-FBB-JP-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

2.53 mm

Body Length/Diameter:

33 mm

Dynamic Range:

68 dB

Frame Rate:

60 fps

Horizontal Pixel:

1920

Housing:

ALUMINIUM

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-70 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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