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KAE-01093-QBB-SD-FA

Onsemi

KAE-01093-QBB-SD-FA by Onsemi

The Onsemi KAE-01093-QBB-SD-FA is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,986 parts In-Stock

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1,986

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Digiode

USA . 613 parts In-Stock

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613

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,779 parts In-Stock

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7,779

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TANS Electronics

Latvia . 5,516 parts In-Stock

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5,516

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Kulean Microsystems

USA . 4,620 parts In-Stock

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4,620

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Corphita

USA . 2,174 parts In-Stock

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2,174

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UHIMA Technologies

Türkiye . 483 parts In-Stock

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483

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SupplyDigital Components

Austria . 400 parts In-Stock

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400

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Corohmni

South Africa . 269 parts In-Stock

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Overview

Capture every detail with the KAE-01093-QBB-SD-FA image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in every product they produce. This image sensor is perfect for applications requiring high-resolution imaging, offering unmatched clarity and precision. With its advanced features and cutting-edge technology, customers can expect exceptional performance and superior results. Upgrade your imaging experience today with the KAE-01093-QBB-SD-FA by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for capturing finer details and better image quality.

Maximum Supply Voltage: 6 V

Higher supply voltage allows for efficient power management and better performance.

Body Width: 30 inch

Compact body width makes it easier to integrate into various devices and applications.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors provide high-quality images with accurate color reproduction.

Body Height: 5.49 mm

Low body height allows for slim and sleek design options in products.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy placement and alignment in devices.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage helps in energy efficiency and reduces power consumption.

Maximum Operating Temperature: 60 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Horizontal Pixel: 1024

High horizontal pixel count provides detailed and clear images.

Output Type: DIGITAL VOLTAGE

Digital output type simplifies data processing and communication.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures functionality in extreme cold conditions.

Dynamic Range: 95 dB

High dynamic range allows the sensor to capture a wide range of light intensities accurately.

Vertical Pixel: 1024

High vertical pixel count ensures detailed images in both horizontal and vertical dimensions.

Body Length/Diameter: 33 mm

Moderate body length/diameter provides a balance between compact size and functionality.

Data Rate: 40 Mbps

High data rate enables fast and real-time data transfer for efficient imaging.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection for stable performance.

Frame Rate: 91 fps

High frame rate allows for smooth and fluid motion capture in videos or moving subjects.

Array Type: INTERLINE

Interline array type offers efficient image capture without the need for a mechanical shutter.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure attachment and stability in various applications.

Technical Specifications

Image Sensors KAE-01093-QBB-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE SUPPLY VOLTAGE FROM 14.7 TO 15.3V, ELECTRONIC SHUTTER, GLOBAL SHUTTER

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

5.49 mm

Body Length/Diameter:

33 mm

Data Rate:

40 Mbps

Dynamic Range:

95 dB

Frame Rate:

91 fps

Horizontal Pixel:

1024

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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