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KAE-01093-ABB-SD-EE

Onsemi

KAE-01093-ABB-SD-EE by Onsemi

KAE-01093-ABB-SD-EE by Onsemi is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a digital voltage output. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 593 parts In-Stock

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Digiode

USA . 448 parts In-Stock

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SupplyDigital Components

Austria . 7,807 parts In-Stock

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Kulean Microsystems

USA . 7,122 parts In-Stock

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TANS Electronics

Latvia . 5,393 parts In-Stock

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Problanco Electronics

Mexico . 4,464 parts In-Stock

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Corphita

USA . 1,228 parts In-Stock

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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Overview

Unlock the next level of imaging with the KAE-01093-ABB-SD-EE by Onsemi. Crafted with precision and cutting-edge technology, this image sensor boasts unparalleled quality and performance. From capturing stunning visuals to enhancing security systems, this sensor is a versatile powerhouse. With a wide range of applications and impressive features, such as high dynamic range and fast frame rate, this product offers exceptional value and benefits to customers looking for top-notch imaging solutions. Elevate your projects with the KAE-01093-ABB-SD-EE and experience the difference that quality makes.

Feature Benefit Bullets

Pixel Size (um): 9X9

The small pixel size allows for higher resolution images to be captured, resulting in clearer and more detailed images.

Maximum Supply Voltage: 6 V

The high maximum supply voltage ensures reliable and stable performance of the image sensor under varying input voltage conditions.

Body Width: 30 inch

The compact size of the image sensor makes it suitable for integration into various electronic devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image output and low noise performance, making them ideal for applications where image quality is paramount.

Body Height: 5.49 mm

The low body height allows for easy integration of the image sensor into devices with space constraints.

Package Shape or Style: RECTANGULAR

The rectangular package shape makes it easier to mount and secure the image sensor in place within electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage helps in reducing power consumption and extending the battery life of devices using this image sensor.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature range ensures that the image sensor can be used in a variety of environmental conditions without risking damage due to overheating.

Horizontal Pixel: 1024

The high number of horizontal pixels allows for wide image capture with more detail and clarity, especially for applications requiring high-resolution images.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies integration with digital processing systems and ensures reliable data transmission for further processing.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature allows for the image sensor to function effectively even in extremely cold environments.

Dynamic Range: 95 dB

The high dynamic range ensures that the image sensor can capture a wide range of light intensities accurately, resulting in high-quality images with good contrast.

Vertical Pixel: 1024

The high number of vertical pixels complements the high horizontal pixel count, resulting in a detailed and comprehensive image capture capability.

Body Length/Diameter: 33 mm

The moderate body length allows for easy mounting and secure placement of the image sensor within electronic devices.

Data Rate: 40 Mbps

The high data rate allows for fast and efficient transfer of image data, ensuring real-time image processing and feedback for various applications.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable electrical connection for the image sensor, preventing signal loss or interference during operation.

Frame Rate: 91 fps

The high frame rate enables the image sensor to capture fast-moving objects or scenes accurately, making it suitable for applications requiring high-speed image capture.

Array Type: INTERLINE

The interline array type allows for faster readout speeds and reduced image lag, improving the overall performance of the image sensor in capturing moving objects.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature offers secure and stable placement of the image sensor within electronic devices, ensuring reliable operation even under mechanical stress.

Technical Specifications

Image Sensors KAE-01093-ABB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE SUPPLY VOLTAGE FROM 14.7 TO 15.3V, ELECTRONIC SHUTTER, GLOBAL SHUTTER

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

5.49 mm

Body Length/Diameter:

33 mm

Data Rate:

40 Mbps

Dynamic Range:

95 dB

Frame Rate:

91 fps

Horizontal Pixel:

1024

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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