Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-4011-ABA-CD-AE by Onsemi is a rectangular CCD image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates b/w -50 °C to 70°C, has a data rate of 40 Mbps, and is suitable for applications requiring high-resolution imaging in industrial or scientific settings.
Median Price
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2
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1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Problanco Electronics
Kulean Microsystems
SupplyDigital Components
TANS Electronics
Corphita
Corohmni
UHIMA Technologies
Larger pixel size of 7.4um allows for better light sensitivity and higher image quality.
Compact body width of 25.4 inches allows for easier integration into various systems or devices.
CCD image sensor type offers high quality images with low noise levels, making it suitable for precise imaging applications.
Low body height of 4.95mm enables slim design options for the end product.
Rectangular package shape offers ease of mounting and compatibility with standard interfaces.
Wide maximum operating temperature range of 70 °C ensures reliable performance in various environments.
High horizontal pixel count of 2048 results in sharp and detailed images.
Low minimum operating temperature of -50 °C allows for use in extreme temperature conditions.
Ceramic housing provides durability and thermal stability for the image sensor.
Wide dynamic range of 60dB enables capturing of both bright and dark areas accurately in the image.
High vertical pixel count of 2048 ensures detailed image resolution in both horizontal and vertical directions.
Moderate body length/diameter of 35.56mm offers a balance between compact size and performance.
High data rate of 40 Mbps allows for quick transfer of image data, ideal for real-time imaging applications.
Solder termination type ensures secure and reliable connections for optimal performance.
Interline array type offers fast readout speeds and high sensitivity, suitable for high-speed imaging.
Through hole mount feature provides easy and secure installation onto circuit boards or mounting surfaces.
Image Sensors KAI-4011-ABA-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Horizontal Pixel:
Housing:
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Maximum Operating Temperature:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Electronic Transistors
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Kec
LM358MX
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
MT9V032C12STM-DP
Onsemi's MT9V032C12STM-DP is a 1/3-inch CMOS image sensor with 6x6 um pixel size. It operates at 26.6 MHz master clock, offering 752 (H) x 480 (V) resolution for applications requiring high-quality digital imaging at up to 60 fps frame rate. Ideal for surface mounting in devices needing -30 to 70 °C temperature range and a dynamic range of 54.4 dB.
KLI-4104-RAA-CB-AE
KLI-4104-RAA-CB-AE by Onsemi is an Image Sensor with 10x10 um pixel size, 60 dB dynamic range, and voltage output. It operates b/w 0 to 70 °C and has a data rate of 30 Mbps. Ideal for applications requiring high-quality imaging in industrial settings.
KAF-0402-AAA-CB-AE
The Onsemi KAF-0402-AAA-CB-AE is a CCD image sensor with 9x9 um pixel size, offering 768 horizontal and 512 vertical pixels. It operates at a supply voltage range of 14.75V to 15.5V, providing a dynamic range of 76 dB. This rectangular package sensor has a data rate of 10 Mbps and is suitable for full-frame imaging applications.
MT9P006I12STCU
The Onsemi MT9P006I12STCU image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.
TC285SPD-B0
Texas Instruments
TC285SPD-B0 by Texas Instruments is an 8x8 um Image Sensor with 1004 horizontal and 1002 vertical pixels. It operates at -10 to 55 °C, powered by a 14V supply. Ideal for THROUGH HOLE MOUNT applications in various industries.
NOIP1SE1300A-QTI
NOIP1SE1300A-QTI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 1/2 inch optical format. It operates b/w -40 to 85 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-speed digital imaging with a frame rate of 210 fps.
NOIX1SE8000B-LTI
NOIX1SE8000B-LTI by Onsemi is an Image Sensor with 3.2x3.2 um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for digital imaging applications requiring a high dynamic range of 68 dB and a frame rate of 128 fps in a compact rectangular package suitable for surface mounting.
VSP2590ZWVR
VSP2590ZWVR by Texas Instruments is an 8mm square CCD image sensor with a data rate of 42 Mbps. It operates b/w -25°C to 85°C, with supply voltage ranging from 2.7V to 3.3V. Ideal for applications requiring analog voltage output in plastic housing.
AR0220AT3C00XUEA0-DRBR-E
Onsemi's AR0220AT3C00XUEA0-DRBR-E is a CMOS image sensor with 4.2x4.2 um pixel size, 50 MHz master clock, and 120 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 60 fps in a compact rectangular package measuring 12mm x 9 inch x 1.65 mm.
KAI-0330D
The Onsemi KAI-0330D is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates b/w -20 to 40 °C, with output range of 12-15.5V and dynamic range of 58 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
KAI-08050-PBA-JD-AE
KAI-08050-PBA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. This rectangular package sensor in 4/3 inch optical format is ideal for applications requiring high-quality imaging such as industrial machine vision and surveillance systems.
KAI-04050-CBA-JB-B2
KAI-04050-CBA-JB-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 64 dB. This CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAF-8300-CXB-CB-AA
The Onsemi KAF-8300-CXB-CB-AA image sensor features 5.4x5.4 um pixel size, 3448 horizontal pixels, and 2574 vertical pixels. With a max supply voltage of 15.5 V, it is ideal for high-resolution imaging applications in industries such as astronomy and microscopy.
KAI-16050-FXA-JD-B2
KAI-16050-FXA-JD-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 4964 horizontal pixels, and 3332 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in various industries.
AR0141CS2C00SUEA0-DR
The Onsemi AR0141CS2C00SUEA0-DR is a CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 50 MHz master clock. It operates b/w -30 to 70 °C and has a dynamic range of 79 dB. Ideal for applications requiring high-resolution imaging at fast frame rates like surveillance cameras or industrial machine vision systems.
NOIX1SE016KB-LTI-E
NOIX1SE016KB-LTI-E by Onsemi is a 3.2x3.2 um CMOS image sensor with an optical format of 1.1 inches, offering a frame rate of 65 fps. This rectangular package sensor is ideal for surface mount applications requiring high-quality image capture in various devices and systems.
AR0135CS2C00SUEA0-DPBR1
Onsemi's AR0135CS2C00SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, 50 MHz master clock, and 71.1 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 54 fps in a compact surface-mount package.
AS0142ATSC00XUSM0-TPBR-E
Onsemi's AS0142ATSC00XUSM0-TPBR-E is a 3x3 um CMOS image sensor with 1280H x 800V pixels. It operates at -40 to 105 °C, offering a dynamic range of 93 dB. Ideal for digital voltage output applications like frame arrays with a 60 fps frame rate.
KAF-3200-ABA-CD-B2
The Onsemi KAF-3200-ABA-CD-B2 is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 horizontal and 1472 vertical pixels. It operates b/w -60 to 60 °C, has a dynamic range of 78 dB, and spectral response of 200-1100 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAF-18500-NXA-JH-AE-08
KAF-18500-NXA-JH-AE-08 by Onsemi is a 6.8X6.8 um CCD image sensor with 5270 (H) x 3516 (V) pixels, offering a dynamic range of 68.1 dB. It operates b/w 0 to 60 °C and has a data rate of 24 Mbps. Ideal for high-resolution imaging applications in industries like surveillance, astronomy, and scientific research.
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KAI-47051-AXA-JD-B1
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Additional Features: IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Minimum Supply Voltage: 14.5 V;
KAI-4011-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 35.56 mm; Termination Type: SOLDER; Dynamic Range: 60 dB;
KAI-4021-AAA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2048; Termination Type: SOLDER; Minimum Operating Temperature: -50 Cel;
KAI-4011-CBA-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 35.56 mm; Housing: CERAMIC; Body Width: 25.4 inch;
KAI-4020M
Image Sensors;
KAI-4011-ABA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -50 Cel; Body Width: 25.4 inch; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER;
KAI-4021-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Maximum Operating Temperature: 70 Cel; Dynamic Range: 60 dB;
KAI-4010CM
KAI-4011-AAA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS A SENSITIVITY OF 16 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER; Vertical Pixel: 2048; Body Length/Diameter: 35.56 mm;
KAI-4011-CBA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Horizontal Pixel: 2048; Housing: CERAMIC;
KAI-4011CM
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4;
KAI-4020CM
KAI-4011-ABA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.95 mm; Pixel Size (um): 7.4X7.4; Body Width: 25.4 inch;
KAI-4021
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 31 UV/ELECTRON, ELECTRONIC SHUTTER; Array Type: INTERLINE;
KAI-4011
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 40 Mbps; Body Length/Diameter: 35.56 mm;
KAI-4011M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Termination Type: SOLDER;
KAI-4011-ABA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE; Housing: CERAMIC;
KAI-4010
KAI-4010M
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2048; Pixel Size (um): 7.4X7.4; Minimum Operating Temperature: -50 Cel;
Supply Digital Components
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