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TC285SPD-B0

Texas Instruments

TC285SPD-B0 by Texas Instruments

TC285SPD-B0 by Texas Instruments is an 8x8 um Image Sensor with 1004 horizontal and 1002 vertical pixels. It operates at -10 to 55 °C, powered by a 14V supply. Ideal for THROUGH HOLE MOUNT applications in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,420 parts In-Stock

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Digiode

USA . 1,532 parts In-Stock

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1,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,213 parts In-Stock

1+ parts

$2.545

100+ parts

-

1k+ parts

$3.033

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2,213

$2.545

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$3.033

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DigiPath Technology Company

USA . 1,916 parts In-Stock

1+ parts

$2.803

100+ parts

$2.579

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-

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1,916

$2.803

$2.579

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ChromeModa Solutions

Germany . 4,886 parts In-Stock

1+ parts

$2.860

100+ parts

$2.345

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4,886

$2.860

$2.345

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

1+ parts

$2.860

100+ parts

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$2.574

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2,053

$2.860

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$2.574

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AZTECH Wire

Italy . 410 parts In-Stock

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$9.139

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410

$9.139

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Semicontronic

India . 1,632 parts In-Stock

1+ parts

$29.750

100+ parts

$29.006

1k+ parts

$28.858

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1,632

$29.750

$29.006

$28.858

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

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$36.750

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$36.750

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One Stop Electronics

USA . 995 parts In-Stock

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$51.750

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995

$51.750

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Corphita

USA . 1,383 parts In-Stock

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1,383

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Corohmni

South Africa . 278 parts In-Stock

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Overview

Capture every detail with the TC285SPD-B0 image sensor by Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers cutting-edge technology that exceeds expectations. This image sensor is perfect for a variety of applications, offering unparalleled precision and clarity. Elevate your projects with the TC285SPD-B0 and experience the unmatched value and advantages it brings to your work.

Feature Benefit Bullets

Pixel Size (um): 8X8

Having a small pixel size of 8x8 um allows for high resolution images to be captured, making this product suitable for applications where image clarity is essential.

Power Supplies (V): 14

Operating at a voltage of 14V provides sufficient power to the image sensor, ensuring reliable performance and accurate image capturing.

Maximum Operating Temperature: 55 °C

With a high maximum operating temperature of 55°C, this image sensor can function effectively even in harsh environments or extended periods of use without overheating.

Horizontal Pixel: 1004

The high number of horizontal pixels (1004) allows for detailed and wide image capture, enabling accurate representation of scenes or objects in the frame.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C ensures the image sensor can operate in cold environments without compromising its performance, making it versatile for various conditions.

Vertical Pixel: 1002

With 1002 vertical pixels, this image sensor can capture clear and sharp images with good resolution, suitable for applications requiring precision in image quality.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature makes it easy to securely install the image sensor onto circuit boards or other devices, ensuring stable and reliable integration for seamless operation.

Technical Specifications

Image Sensors TC285SPD-B0 attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Horizontal Pixel:

1004

Mounting Feature:

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Pixel Size (um):

8X8

Power Supplies (V):

14

Sub-Category:

CCD Image Sensors

Vertical Pixel:

1002

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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