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MT9V124EBKSTC-CR

Onsemi

MT9V124EBKSTC-CR by Onsemi

MT9V124EBKSTC-CR by Onsemi is an image sensor with 1.75um pixel size, 44 MHz master clock, and 648x488 resolution. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high dynamic range of 58 dB and frame rate of 30 fps.

Median Price

$6.715

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 38,180 parts In-Stock

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-

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38,180

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DigiKey

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

$7.340

1k+ parts

$7.340

10k+ parts

$7.340

33,000

-

$7.340

$7.340

$7.340

Verical

USA . 20,522 parts In-Stock

1+ parts

-

100+ parts

$7.612

1k+ parts

$6.813

10k+ parts

$6.412

20,522

-

$7.612

$6.813

$6.412

Rochester

USA . 20,522 parts In-Stock

1+ parts

-

100+ parts

$6.090

1k+ parts

$5.450

10k+ parts

$5.130

20,522

-

$6.090

$5.450

$5.130

Arrow

USA . 3,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.705

3,691

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-

$5.705

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 571 parts In-Stock

1+ parts

$5.784

100+ parts

-

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571

$5.784

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Flip Electronics

USA . 38,000 parts In-Stock

1+ parts

-

100+ parts

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38,000

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Digiode

USA . 2,366 parts In-Stock

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2,366

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 378 parts In-Stock

1+ parts

$5.784

100+ parts

-

1k+ parts

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10k+ parts

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378

$5.784

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Kulean Microsystems

USA . 7,486 parts In-Stock

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7,486

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TANS Electronics

Latvia . 7,321 parts In-Stock

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7,321

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Problanco Electronics

Mexico . 7,085 parts In-Stock

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7,085

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SupplyDigital Components

Austria . 5,364 parts In-Stock

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5,364

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Continental Prestige Electronics

USA . 4,196 parts In-Stock

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4,196

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,180 parts In-Stock

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1,180

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Corphita

USA . 150 parts In-Stock

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150

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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114

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Overview

Discover the cutting-edge technology of the MT9V124EBKSTC-CR image sensor by Onsemi, a leading manufacturer in the industry. This sensor offers unparalleled quality and performance, making it perfect for a wide range of applications. From security cameras to medical imaging, this sensor provides crisp and clear images with a high dynamic range. Experience the value and benefits of this product, with its advanced features and reliable design, making it a top choice for professionals in need of superior image capture capabilities. Elevate your projects with the MT9V124EBKSTC-CR and unlock endless possibilities in the world of imaging technology.

Feature Benefit Bullets

Pixel Size (um): 1.75

Smaller pixel size allows for higher resolution images to be captured with greater detail.

Maximum Supply Voltage: 1.95 V

Allows for efficient power usage while ensuring proper functionality of the image sensor.

Master Clock: 44 MHz

High master clock speed enables fast image processing and data transfer capabilities.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology provides low power consumption and high image quality, making it a reliable choice for image sensors.

Maximum Operating Temperature: 70 °C

Operating at high temperature range allows for versatility in various environmental conditions.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies interfacing with other digital systems for easy integration.

Frame Rate: 30 fps

High frame rate allows for smooth and clear video recording or streaming.

Technical Specifications

Image Sensors MT9V124EBKSTC-CR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.50-3.10 V

Array Type:

FRAME

Body Width:

2.6935 inch

Body Height:

.67 mm

Body Length/Diameter:

2.6935 mm

Dynamic Range:

58 dB

Frame Rate:

30 fps

Horizontal Pixel:

648

JESD-609 Code:

e1

Master Clock:

44 MHz

Mounting Feature:

Maximum Operating Current:

9.5 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/13

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

1.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

488

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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