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MT9V024IA7XTM-TR

Onsemi

MT9V024IA7XTM-TR by Onsemi

MT9V024IA7XTM-TR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at -40 to 105°C, it has a frame rate of 60 fps and digital voltage output interface. Ideal for applications requiring high-quality imaging in compact devices.

Median Price

$27.040

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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$27.040

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Vyrian

USA . 8,430 parts In-Stock

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Flip Electronics

USA . 1,991 parts In-Stock

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Digiode

USA . 772 parts In-Stock

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Aztec Data Supply Inc.

USA . 379 parts In-Stock

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$1.700

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$1.700

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AZTECH Wire

Italy . 277 parts In-Stock

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$15.589

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Corohmni

South Africa . 225 parts In-Stock

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$26.499

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Continental Prestige Electronics

USA . 6,171 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$27.040

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$27.581

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$27.581

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$27.581

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Ampacity Inc.

Singapore . 242 parts In-Stock

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$33.750

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Semicontronic

India . 1,201 parts In-Stock

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$48.750

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$47.531

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$47.288

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Problanco Electronics

Mexico . 8,138 parts In-Stock

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SupplyDigital Components

Austria . 8,072 parts In-Stock

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TANS Electronics

Latvia . 6,899 parts In-Stock

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Argo Parts USA

USA . 3,387 parts In-Stock

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Kulean Microsystems

USA . 2,164 parts In-Stock

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Corphita

USA . 1,829 parts In-Stock

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UHIMA Technologies

Türkiye . 897 parts In-Stock

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Overview

Experience the ultimate in image sensor technology with the MT9V024IA7XTM-TR by Onsemi. As a trusted manufacturer, Onsemi delivers top-quality products that exceed industry standards. With applications ranging from security cameras to medical imaging, this image sensor offers unparalleled performance and reliability. Capture stunning visuals with ease, thanks to its advanced features and innovative design. Trust Onsemi to provide you with the best-in-class solutions for all your imaging needs. Elevate your projects to the next level with the MT9V024IA7XTM-TR.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high-resolution images with fine detail.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage supply, potentially improving performance and sensitivity.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high frame rates.

Body Width: 9 inch

The compact size of the body makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high integration capabilities.

Horizontal Pixel: 752

High horizontal pixel count allows for detailed and wide-angle images.

Output Range: 0.30-3V

The wide output range provides flexibility in signal processing and compatibility with different systems.

Dynamic Range: 100 dB

High dynamic range ensures accurate representation of both dark and bright areas in an image.

Vertical Pixel: 480

Vertical pixel count contributes to the overall image resolution and quality.

Optical Format (inch): 1/3

Common optical format size ensures compatibility with various lenses and imaging systems.

Technical Specifications

Image Sensors MT9V024IA7XTM-TR attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.3 mm

Body Length/Diameter:

9 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

TIN SILVER COPPER

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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