Loading...

KAI-08050-CBA-JB-B2

Onsemi

KAI-08050-CBA-JB-B2 by Onsemi

The Onsemi KAI-08050-CBA-JB-B2 is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Operating b/w -50 °C to 70°C, it requires a 15V power supply and has an optical format of 4/3 inch. Ideal for applications requiring high-resolution imaging in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

-

-

-

-

Digiode

USA . 945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

945

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 3,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,181

-

-

-

-

Kulean Microsystems

USA . 1,742 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

-

-

-

-

Corphita

USA . 1,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

-

-

-

-

Corohmni

South Africa . 353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

353

-

-

-

-

UHIMA Technologies

Türkiye . 333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

333

-

-

-

-

TANS Electronics

Latvia . 313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

313

-

-

-

-

Problanco Electronics

Mexico . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32

-

-

-

-

Overview

Capture every moment in stunning detail with the KAI-08050-CBA-JB-B2 image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This sensor is perfect for a wide range of applications, from industrial imaging to machine vision systems. Experience exceptional value with its high dynamic range and precise pixel size. Elevate your projects with the advantages that this advanced sensor offers and unlock endless possibilities for creativity and innovation.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

This small pixel size allows for high resolution imaging and detailed results.

Power Supplies (V): 15

The low power supply requirement of 15V makes this product energy efficient.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD technology ensures high-quality image capture and processing.

Package Shape or Style: RECTANGULAR

The rectangular shape allows for easy integration and mounting in various devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C makes this sensor suitable for a wide range of environments and applications.

Horizontal Pixel: 3296

With a high horizontal pixel count of 3296, this sensor can capture detailed and sharp images.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature of -50 °C ensures reliable performance even in extreme cold conditions.

Dynamic Range: 64 dB

The high dynamic range of 64 dB allows the sensor to capture a wide range of light intensities accurately.

Vertical Pixel: 2472

With a high vertical pixel count of 2472, this sensor can capture high-resolution images with clarity.

Optical Format (inch): 4/3

The 4/3 optical format is a popular choice and provides compatibility with various lenses and optics.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections for seamless integration.

Array Type: INTERLINE

The interline array type enhances the sensor's performance in capturing fast-moving objects and reduces distortion.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature makes installation and assembly easy and convenient.

Technical Specifications

Image Sensors KAI-08050-CBA-JB-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

3296

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Termination Type:

SOLDER

Vertical Pixel:

2472

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20