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KAE-08152-ABA-SD-FA

Onsemi

KAE-08152-ABA-SD-FA by Onsemi

The Onsemi KAE-08152-ABA-SD-FA image sensor features 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,345 parts In-Stock

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Digiode

USA . 564 parts In-Stock

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TANS Electronics

Latvia . 4,587 parts In-Stock

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Kulean Microsystems

USA . 3,856 parts In-Stock

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Corphita

USA . 1,982 parts In-Stock

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SupplyDigital Components

Austria . 1,554 parts In-Stock

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Problanco Electronics

Mexico . 556 parts In-Stock

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UHIMA Technologies

Türkiye . 124 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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Overview

Enhance your imaging projects with the KAE-08152-ABA-SD-FA by Onsemi, a top-tier manufacturer known for cutting-edge technology and superior quality. As a leading product in the Image Sensors category, this device offers unparalleled performance and reliability. With a wide range of applications, from security cameras to medical imaging systems, this sensor provides exceptional value and benefits to customers looking for high-quality imaging solutions. Upgrade your projects with the KAE-08152-ABA-SD-FA and experience the advantages that only Onsemi can deliver.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Larger pixel size allows for more light to be captured, resulting in better image quality and low-light performance.

Maximum Supply Voltage: 15.3 V

Higher maximum supply voltage allows for more flexibility in power sources and potential for higher performance.

Master Clock: 40 MHz

High master clock speed enables fast data readout and processing, making this sensor suitable for high-speed imaging applications.

Body Width: 41 inch

Compact body width allows for easy integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high image quality and sensitivity, making this product a good choice for imaging applications where quality is key.

Body Height: 5.62 mm

Low body height enables slim and compact designs when integrating this sensor into products.

Package Shape or Style: RECTANGULAR

Rectangular packaging is space-efficient and allows for easy placement and mounting within devices.

Minimum Supply Voltage: 14.7 V

Low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 60 °C

High maximum operating temperature allows for operation in a wide range of environments.

Horizontal Pixel: 2856

High horizontal pixel count enables high-resolution imaging and detailed image capture.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Dynamic Range: 86 dB

High dynamic range allows for capturing a wide range of light intensities in a single image, resulting in better contrast and detail.

Vertical Pixel: 2856

High vertical pixel count complements the high horizontal pixel count for detailed and high-resolution image capture.

Body Length/Diameter: 43.5 mm

Compact body length enables easy integration and placement within devices.

Optical Format (inch): 4/3

4/3 optical format is ideal for a variety of imaging applications and provides a good balance between image quality and sensor size.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections for long-term use.

Frame Rate: 14 fps

Decent frame rate of 14 fps allows for smooth video recording and high-speed imaging applications.

Array Type: INTERLINE

Interline array type offers fast readout speeds and reduced image lag, making this sensor suitable for dynamic imaging scenarios.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation of the sensor within devices.

Technical Specifications

Image Sensors KAE-08152-ABA-SD-FA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

41 inch

Body Height:

5.62 mm

Body Length/Diameter:

43.5 mm

Dynamic Range:

86 dB

Frame Rate:

14 fps

Horizontal Pixel:

2856

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

4/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.3 V

Minimum Supply Voltage:

14.7 V

Termination Type:

SOLDER

Vertical Pixel:

2856

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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