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KAE-02150-ABB-JP-EE

Onsemi

KAE-02150-ABB-JP-EE by Onsemi

KAE-02150-ABB-JP-EE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 1920x1080 resolution, and 68 dB dynamic range. It operates b/w -70 to 40 °C and is ideal for high-quality imaging applications requiring a max supply voltage of 6V and min of 4.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,945 parts In-Stock

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Vyrian

USA . 781 parts In-Stock

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TANS Electronics

Latvia . 4,473 parts In-Stock

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Kulean Microsystems

USA . 3,828 parts In-Stock

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SupplyDigital Components

Austria . 2,499 parts In-Stock

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2,499

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Corphita

USA . 1,967 parts In-Stock

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Problanco Electronics

Mexico . 665 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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UHIMA Technologies

Türkiye . 67 parts In-Stock

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Overview

Experience crystal-clear images like never before with the KAE-02150-ABB-JP-EE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that revolutionize the way you capture moments. Perfect for various applications, this sensor offers unmatched value and benefits to customers seeking superior image quality. Upgrade your imaging experience with the KAE-02150-ABB-JP-EE and discover the difference today.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Large pixel size allows for better light sensitivity and higher image quality.

Maximum Supply Voltage: 6 V

Allows for a wide operating voltage range, making it versatile for various applications.

Body Width: 30 inch

Compact size makes it suitable for integration into different systems.

Power Supplies (V): 15

Provides sufficient power for optimal performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture abilities.

Body Height: 2.53 mm

Low profile design helps in space-constrained applications.

Package Shape or Style: RECTANGULAR

Easy to integrate into existing systems and setups.

Minimum Supply Voltage: 4.5 V

Can operate efficiently even at lower voltage levels.

Maximum Operating Temperature: 40 °C

Can withstand high temperature environments.

Horizontal Pixel: 1920

High resolution for detailed image capture.

Minimum Operating Temperature: -70 °C

Can operate in extremely cold conditions without issues.

Housing: ALUMINIUM

Durable and lightweight material for protection and ease of handling.

Dynamic Range: 68 dB

Wide dynamic range for better contrast in captured images.

Vertical Pixel: 1080

High vertical resolution for quality image output.

Body Length/Diameter: 33 mm

Compact size for easy integration and handling.

Optical Format (inch): 2/3

Commonly used format in the industry for compatibility.

Termination Type: SOLDER

Secure connections for reliable performance.

Frame Rate: 60 fps

High frame rate for smooth video recording and fast motion capture.

Array Type: INTERLINE

Interline arrangement for efficient image capture.

Mounting Feature: THROUGH HOLE MOUNT

Easy and secure mounting for stability.

Technical Specifications

Image Sensors KAE-02150-ABB-JP-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB

Array Type:

INTERLINE

Body Width:

30 inch

Body Height:

2.53 mm

Body Length/Diameter:

33 mm

Dynamic Range:

68 dB

Frame Rate:

60 fps

Horizontal Pixel:

1920

Housing:

ALUMINIUM

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-70 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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