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KAI-0330S

Onsemi

KAI-0330S by Onsemi

The Onsemi KAI-0330S is a CCD image sensor with 9x9 um pixel size, offering 648 (H) x 484 (V) resolution. It operates b/w -20 to 40 °C, with a dynamic range of 58 dB. Ideal for applications requiring analog voltage output in industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,324 parts In-Stock

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Vyrian

USA . 654 parts In-Stock

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654

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Problanco Electronics

Mexico . 5,235 parts In-Stock

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Kulean Microsystems

USA . 4,879 parts In-Stock

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TANS Electronics

Latvia . 2,436 parts In-Stock

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Corphita

USA . 1,487 parts In-Stock

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SupplyDigital Components

Austria . 938 parts In-Stock

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Corohmni

South Africa . 219 parts In-Stock

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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Overview

Capture every moment in stunning clarity with the KAI-0330S Image Sensor by Onsemi. Designed with precision and expertise, this innovative product offers unrivaled quality and reliability for a wide range of applications. Whether you're capturing breathtaking landscapes or fast-paced action shots, the KAI-0330S delivers exceptional performance and versatility. Elevate your imaging experience with this cutting-edge sensor and discover the endless possibilities it brings to your creative vision.

Feature Benefit Bullets

Pixel Size (um): 9X9

Small pixel size allows for higher resolution images with finer details.

Maximum Supply Voltage: 15 V

High maximum supply voltage provides flexibility and compatibility with different power sources.

Body Width: 10.03 inch

Compact body width enables easy integration into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensor type provides high-quality images with low noise levels.

Body Height: 3.18 mm

Low body height allows for sleek and slim device designs.

Package Shape or Style: RECTANGULAR

Rectangular package shape is easy to mount and align in different configurations.

Minimum Supply Voltage: 7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 40 °C

Wide operating temperature range ensures performance in various environmental conditions.

Horizontal Pixel: 648

High horizontal pixel count provides detailed and sharp images.

Output Range: 12-15.5V

Wide output voltage range allows for compatibility with different signal processing circuits.

Output Type: ANALOG VOLTAGE

Analog voltage output simplifies signal processing and interfacing with other components.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality in cold environments or during startup.

Dynamic Range: 58 dB

High dynamic range enables the sensor to capture a wide range of light intensity levels accurately.

Vertical Pixel: 484

Vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 17.7 mm

Compact body length/diameter facilitates easy installation and integration in space-restricted applications.

Array Type: LINEAR

Linear array type simplifies image capture and processing for linear scanning applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting enables secure and reliable attachment to circuit boards or mounting surfaces.

Technical Specifications

Image Sensors KAI-0330S attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

LINEAR

Body Width:

10.03 inch

Body Height:

3.18 mm

Body Length/Diameter:

17.7 mm

Dynamic Range:

58 dB

Horizontal Pixel:

648

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-20 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

7 V

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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