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KAI-10100-CXC-CB-XA

Onsemi

KAI-10100-CXC-CB-XA by Onsemi

KAI-10100-CXC-CB-XA by Onsemi is an image sensor with 3760x2840 pixels, 4.75um pixel size, and 64dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and has a frame rate of 19fps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,433 parts In-Stock

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Vyrian

USA . 179 parts In-Stock

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SupplyDigital Components

Austria . 7,928 parts In-Stock

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TANS Electronics

Latvia . 7,678 parts In-Stock

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Problanco Electronics

Mexico . 5,863 parts In-Stock

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Kulean Microsystems

USA . 5,059 parts In-Stock

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Corphita

USA . 455 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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UHIMA Technologies

Türkiye . 331 parts In-Stock

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Overview

Unlock the power of crystal-clear imaging with the KAI-10100-CXC-CB-XA by Onsemi. Crafted by a trusted manufacturer known for quality, this image sensor is perfect for a wide range of applications. From medical imaging to security systems, this sensor offers unparalleled performance and reliability. Experience superior image quality, advanced technology, and seamless integration with the KAI-10100-CXC-CB-XA. Elevate your projects and exceed expectations with this cutting-edge sensor.

Feature Benefit Bullets

Pixel Size (um): 4.75X4.75

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for efficient power usage and performance.

Body Width: 20.32 inch

Wide body width provides stability and durability to the image sensor.

Power Supplies (V): 15

Provides sufficient power for the image sensor to operate effectively.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensor technology ensures high quality image capture and low noise performance.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy integration and mounting in various devices.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage ensures efficient power usage and extended battery life.

Horizontal Pixel: 3760

High horizontal pixel count provides high resolution images with sharp details.

Housing: CERAMIC

Ceramic housing provides thermal stability and protection to the image sensor.

Dynamic Range: 64 dB

High dynamic range allows for capturing images with a wide range of light intensities.

Vertical Pixel: 2840

High vertical pixel count ensures detailed images with excellent clarity.

Body Length/Diameter: 29.21 mm

Compact body length/diameter allows for easy integration in various devices.

Data Rate: 30 Mbps

High data rate enables fast and efficient image transfer for real-time applications.

Termination Type: SOLDER

Solder termination ensures secure connection and reliability in operation.

Frame Rate: 19 fps

Decent frame rate allows for smooth video recording and playback.

Array Type: INTERLINE

Interline array type provides efficient light sensitivity and reduced blooming effects.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for easy installation and secure attachment in devices.

Technical Specifications

Image Sensors KAI-10100-CXC-CB-XA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Length/Diameter:

29.21 mm

Data Rate:

30 Mbps

Dynamic Range:

64 dB

Frame Rate:

19 fps

Horizontal Pixel:

3760

Housing:

CERAMIC

Mounting Feature:

Package Shape or Style:

Pixel Size (um):

4.75X4.75

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2840

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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