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KAI-16000-AAA-JR-B1

Onsemi

KAI-16000-AAA-JR-B1 by Onsemi

KAI-16000-AAA-JR-B1 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It has a dynamic range of 65 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging with precise color reproduction.

Median Price

$4,435.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$4,435.550

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200

$4,435.550

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Digiode

USA . 1,091 parts In-Stock

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1,091

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Vyrian

USA . 210 parts In-Stock

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$8.649

100+ parts

-

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828

$8.649

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Corohmni

South Africa . 329 parts In-Stock

1+ parts

$4,346.839

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-

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329

$4,346.839

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Continental Prestige Electronics

USA . 4,096 parts In-Stock

1+ parts

$4,435.550

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$4,346.839

4,096

$4,435.550

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-

$4,346.839

Netroflash

USA . 500 parts In-Stock

1+ parts

$4,435.550

100+ parts

-

1k+ parts

$4,213.772

10k+ parts

$4,125.061

500

$4,435.550

-

$4,213.772

$4,125.061

Argo Parts USA

USA . 319 parts In-Stock

1+ parts

$4,435.550

100+ parts

$4,391.194

1k+ parts

$4,346.839

10k+ parts

$4,302.483

319

$4,435.550

$4,391.194

$4,346.839

$4,302.483

Kulean Microsystems

USA . 3,916 parts In-Stock

1+ parts

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3,916

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TANS Electronics

Latvia . 2,921 parts In-Stock

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2,921

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SupplyDigital Components

Austria . 1,298 parts In-Stock

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Problanco Electronics

Mexico . 1,188 parts In-Stock

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1,188

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Corphita

USA . 1,171 parts In-Stock

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1,171

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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797

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Overview

Capture stunning images with the KAI-16000-AAA-JR-B1 image sensor by Onsemi. Known for their top-quality products, Onsemi has designed this sensor to deliver exceptional performance and reliability. Perfect for a wide range of applications, this sensor offers customers unparalleled value and benefits. Whether you're a professional photographer or a tech enthusiast, this product is sure to exceed your expectations with its advanced features and cutting-edge technology. Elevate your imaging experience with the KAI-16000-AAA-JR-B1 and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution imaging, making this sensor ideal for detailed image capture.

Maximum Supply Voltage: 15.5 V

High maximum supply voltage provides flexibility in powering options, increasing compatibility with various systems.

Body Width: 45.34 inch

Compact body width allows for easy integration into space-constrained applications, ensuring a versatile product.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Utilizing CCD technology ensures high-quality image output, making this sensor suitable for professional imaging applications.

Body Height: 4.88 mm

Low body height enables the sensor to be easily incorporated into slim devices without compromising performance.

Package Shape or Style: RECTANGULAR

Rectangular package shape offers convenient mounting options, simplifying installation processes.

Minimum Supply Voltage: 14.5 V

With a low minimum supply voltage requirement, this sensor is energy-efficient, reducing power consumption.

Horizontal Pixel: 4872

High horizontal pixel count enables wide image capture, perfect for panoramic or large-scale photography.

Output Type: ANALOG VOLTAGE

Analog voltage output provides compatibility with a wide range of systems, ensuring seamless connectivity.

Dynamic Range: 65 dB

A high dynamic range allows for accurate color reproduction and detailed image quality, making this sensor a reliable choice.

Vertical Pixel: 3248

The vertical pixel count contributes to the sensor's overall image resolution, ensuring clear and sharp picture output.

Body Length/Diameter: 44.45 mm

The moderate body length ensures a balance between compactness and functionality, making this sensor versatile in various applications.

Data Rate: 30 Mbps

With a high data rate, this sensor can quickly transmit image data, making it suitable for real-time imaging applications.

Termination Type: SOLDER

Solder termination offers secure connections, enhancing the sensor's durability and reliability.

Array Type: INTERLINE

The interline array type enhances image quality by reducing image distortion and noise, making this sensor an excellent choice for accurate imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting allows for sturdy and secure installation, ensuring the sensor remains in place during operation.

Technical Specifications

Image Sensors KAI-16000-AAA-JR-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

4.88 mm

Body Length/Diameter:

44.45 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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