Loading...

KAI-29050-QXA-JD-B1

Onsemi

KAI-29050-QXA-JD-B1 by Onsemi

KAI-29050-QXA-JD-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 15.5 V max supply voltage, and 6644 horizontal pixels. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,371

-

-

-

-

Digiode

USA . 231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

231

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 81 parts In-Stock

1+ parts

$8.560

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$8.560

-

-

-

Problanco Electronics

Mexico . 7,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,556

-

-

-

-

SupplyDigital Components

Austria . 5,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,946

-

-

-

-

Kulean Microsystems

USA . 5,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,398

-

-

-

-

Corphita

USA . 2,097 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,097

-

-

-

-

TANS Electronics

Latvia . 1,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

-

-

-

-

Corohmni

South Africa . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

341

-

-

-

-

UHIMA Technologies

Türkiye . 318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

318

-

-

-

-

Overview

Discover the unparalleled quality and innovation of the KAI-29050-QXA-JD-B1 by Onsemi. As a leading manufacturer in the image sensor category, Onsemi offers cutting-edge technology designed to meet the demands of various applications. With its high-performance capabilities and advanced features, this product delivers exceptional value, benefits, and advantages to customers. Elevate your projects with the KAI-29050-QXA-JD-B1 and experience superior imaging like never before.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images to be captured, making this sensor suitable for demanding imaging applications.

Maximum Supply Voltage: 15.5 V

The high maximum supply voltage provides flexibility in power supply options and ensures stable performance even under varying voltage conditions.

Body Width: 45.34 inch

The compact body width makes it easy to integrate this image sensor into a wide range of space-constrained devices.

Power Supplies (V): 15

The standard power supply voltage of 15V makes it easy to find compatible power sources for this sensor.

Sensors or Transducers Type: IMAGE SENSOR, CCD

A CCD image sensor provides high-quality, low-noise image capture, making it ideal for applications where image clarity is essential.

Body Height: 3.61 mm

The low body height allows for a slim profile design, enabling easy integration into various devices without adding bulk.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers versatility in mounting options and facilitates efficient use of space in electronic designs.

Minimum Supply Voltage: 14.5 V

The low minimum supply voltage ensures energy efficiency and can help extend the operating life of battery-powered devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in demanding environmental conditions, making this sensor suitable for a wide range of applications.

Horizontal Pixel: 6644

The high horizontal pixel count results in detailed and sharp images, making this sensor ideal for applications that require high-resolution imaging.

Minimum Operating Temperature: -50 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making this sensor suitable for use in various environments.

Maximum Operating Current: 11 mA

The low maximum operating current contributes to energy efficiency, making this sensor a cost-effective choice for power-conscious applications.

Dynamic Range: 64 dB

The high dynamic range ensures accurate capture of both dark and bright areas in an image, resulting in high-quality and true-to-life image rendering.

Vertical Pixel: 4452

The high vertical pixel count complements the high horizontal pixel count to deliver detailed and well-balanced images, making this sensor suitable for a wide range of imaging applications.

Body Length/Diameter: 47.24 mm

The moderate body length allows for easy integration and flexibility in design, making it suitable for various form factors and mounting options.

Optical Format (inch): 11/8

The optical format specification provides compatibility with a wide range of lenses and optical systems, allowing for versatile imaging solutions.

Data Rate: 40 Mbps

The high data rate allows for fast and efficient image transfer, making this sensor ideal for applications that require real-time image processing.

Termination Type: SOLDER

The solder termination type offers secure and reliable electrical connections, ensuring stable performance in various environmental conditions.

Frame Rate: 4 fps

The moderate frame rate allows for smooth and clear video capture, making this sensor suitable for applications that require video recording capabilities.

Array Type: INTERLINE

The interline array type offers fast readout speed and reduced image lag, making this sensor ideal for applications that require high-speed imaging.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides secure and stable mounting options, ensuring reliable performance even in high-vibration environments.

Technical Specifications

Image Sensors KAI-29050-QXA-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

40 Mbps

Dynamic Range:

64 dB

Frame Rate:

4 fps

Horizontal Pixel:

6644

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

11/8

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4452

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20