Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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KAI-16070-FXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 4864x3232 pixel resolution and INTERLINE array type.
Median Price
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3
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1k+
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1+ parts
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Vyrian
Digiode
AZTECH Wire
$15.660
Problanco Electronics
Kulean Microsystems
Corphita
TANS Electronics
SupplyDigital Components
Corohmni
UHIMA Technologies
Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications where detail is crucial.
Higher maximum supply voltage provides flexibility in power supply options and ensures reliable operation in various voltage conditions.
High master clock frequency enables fast data readout and processing, resulting in quick performance of the image sensor.
The compact body width allows for easy integration into different devices and systems without taking up too much space.
CCD image sensors are known for their high-quality image output and low noise, making this sensor a great choice for demanding imaging applications.
Low body height facilitates slim designs and enables the image sensor to be used in applications with space constraints.
Rectangular package shape provides easy handling and installation in various devices, ensuring compatibility and ease of use.
The lower minimum supply voltage ensures efficient power consumption and allows for operation in lower voltage conditions, increasing flexibility.
High maximum operating temperature range ensures reliable performance even in harsh environmental conditions, making this sensor ideal for outdoor and industrial applications.
High horizontal pixel count enables capturing detailed and wide images, making this sensor suitable for applications requiring high-resolution imaging.
Wide minimum operating temperature range allows for operation in extreme cold conditions, making this image sensor versatile and suitable for various environments.
High dynamic range enables the sensor to capture both bright and dark areas in an image accurately, ensuring excellent image quality in varying lighting conditions.
High vertical pixel count allows for capturing detailed images with fine vertical resolution, making this sensor ideal for applications requiring precise imaging.
The moderate body length/diameter ratio provides a balance between compact size and functionality, making this sensor suitable for various applications.
The specified optical format ensures compatibility with various lenses and optical systems, making this sensor versatile and suitable for different imaging setups.
Solder termination offers a reliable and secure connection for the image sensor, ensuring stable performance and durability in different operating conditions.
Although the frame rate is not high, it is suitable for applications where slower frame rates are acceptable, such as surveillance or industrial monitoring.
Interline array type provides fast readout speed and reduced image lag, making this sensor suitable for applications where capturing moving objects is important.
Through hole mounting feature allows for secure and stable installation of the image sensor on PCBs or mounting surfaces, ensuring reliable operation in different setups.
Image Sensors KAI-16070-FXA-JD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Frame Rate:
Horizontal Pixel:
Master Clock:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 18/Sep/2019
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
LAN8720A-CP-TR
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
KAI-16070-FXA-JD-AE
KAI-16070-FXA-JD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging at a max supply voltage of 15.5 V and operating temperatures ranging from -50 to 70 °C.
AR0238CSSC12SPRA0-DR
Onsemi's AR0238CSSC12SPRA0-DR image sensor features 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging with a frame rate of 30 fps in a compact square package.
KAF-1603E
Image Sensors;
KAI-2001-ABA-CD-AE
KAI-2001-ABA-CD-AE by Onsemi is an image sensor with 7.4um pixel size, 1600H x 1200V resolution, and 60dB dynamic range. It operates at supply voltages b/w 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-quality imaging in a compact form factor.
KAF-10500-CXA-JH-AE-OFFSET
KAI-08051-ABA-JP-BA
KAI-08051-ABA-JP-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3364 horizontal pixels, and 2520 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
CYII5SC1300AB-QDC
CYII5SC1300AB-QDC by Onsemi is an image sensor with 1280x1024 pixels, 6.7x6.7um pixel size, and 40MHz master clock. It operates b/w -30 to 65 °C, outputs digital voltage from 0.50-2.20V, and has a dynamic range of 64dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
TCD1305DG
Toshiba
Toshiba TCD1305DG is an 8X64 um CCD image sensor with a 3648 horizontal pixel array. Operating at 4.5-5.5V, it offers a spectral response of 400-1200nm and sensitivity of 64 V/lx.s. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments.
KAF-09000-ABA-DP-AE
Onsemi's KAF-09000-ABA-DP-AE is a 3056x3056 full-frame CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications requiring precise color reproduction and low light sensitivity.
KAI-2020-FBA-CP-AE
KAI-2020-FBA-CP-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, offering a dynamic range of 68 dB and 1600x1200 resolution. Ideal for applications requiring high-quality imaging in a compact form factor, this CCD sensor operates b/w -50 to 70 °C with supply voltage ranging from 14.5V to 15.5V.
KAI-0372CM
NOIP1SN0300A-QDI
NOIP1SN0300A-QDI by Onsemi features 4.80X4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. This image sensor is ideal for applications requiring high-speed digital imaging with a dynamic range of 60 dB.
AMIS-722402
Image Sensors; Minimum Operating Temperature: -10 Cel; Vertical Pixel: 1; Horizontal Pixel: 1376; Power Supplies (V): 3.3; Maximum Operating Temperature: 50 Cel;
KAE-04471-ABA-SP-EE
The Onsemi KAE-04471-ABA-SP-EE is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 72 dB. It operates b/w -30 to 40 °C, outputs voltage, and has a data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various lighting conditions.
AR0231AT7C00XUD20-E
IMAGE SENSOR,CMOS;
NOIP1SN016KA-GTI
NOIP1SN016KA-GTI by Onsemi is an Image Sensor with 4.5X4.5 um pixel size, 360 MHz master clock, and 4096x4096 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-speed imaging applications requiring precise color reproduction and low-light performance.
KAI-04022-FBA-CR-BA
KAI-04022-FBA-CR-BA by Onsemi is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 72dB dynamic range. Ideal for applications requiring high-resolution imaging in a compact form factor, such as industrial machine vision systems or scientific cameras.
AS0142ATSC00XUSM0-TRBR-E
AS0142ATSC00XUSM0-TRBR-E by Onsemi is a 3x3 um CMOS image sensor with 1280H x 800V pixels, offering a dynamic range of 93 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports a frame rate of 60 fps. Ideal for applications requiring high-quality imaging in compact devices.
KAI-29052-FXA-JD-B1
KAI-29052-FXA-JD-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 6576 horizontal pixels, and 4384 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging with current output and through-hole mounting features.
KAI-02150-ABA-JP-AE
KAI-02150-ABA-JP-AE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, with supply voltage ranging from 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in various environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-16000-AAA-JD-B1
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 30 UV/ELECTRON; Minimum Supply Voltage: 14.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 65 dB; Termination Type: SOLDER;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 30 Mbps; Array Type: INTERLINE;
KAI-16000-AAA-JR-B1
KAI-16000-AAA-JR-B1 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 4872 horizontal pixels, and 3248 vertical pixels. It has a dynamic range of 65 dB and outputs analog voltage. Ideal for applications requiring high-resolution imaging with precise color reproduction.
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Termination Type: SOLDER;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.88 mm; Body Length/Diameter: 44.45 mm;
KAI-16000-AAA-JD-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 65 dB; Maximum Supply Voltage: 15.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 45.34 inch; Additional Features: SENSITIVITY IS 30 UV/ELECTRON;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 30 UV/ELECTRON; Body Height: 4.88 mm;
KAI-1003-AAA-CR-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Maximum Supply Voltage: 15.5 V; Pixel Size (um): 12.8X12.8;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1024; Maximum Supply Voltage: 15.5 V; Housing: CERAMIC;
KAI-1010-ABA-CD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15 V; Pixel Size (um): 9X9;
KAI-1003-ABA-CR-B2
KAI-1010-ABA-CR-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Dynamic Range: 60 dB; Horizontal Pixel: 1008;
KAI-1010-ABA-CR-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 12 MICRO V/ELECTRON; Vertical Pixel: 1018;
KAI-1003M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.30V; Spectral Response (nm): 400-700;
KAI-1010M
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1018; Maximum Supply Voltage: 15 V; Minimum Operating Temperature: -50 Cel;
KAI-1010
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Horizontal Pixel: 1008; Maximum Supply Voltage: 15 V;
KAI-1020
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Master Clock: 40 MHz; Array Type: INTERLINE;
Supply Digital Components
$106.00
$54.25
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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