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MT9V034C12STC-DP

Onsemi

MT9V034C12STC-DP by Onsemi

Onsemi's MT9V034C12STC-DP image sensor features 6x6 um pixel size, 27 MHz master clock, and 752x480 resolution. Ideal for applications requiring high-quality imaging such as surveillance cameras, drones, and industrial machine vision systems.

Median Price

$13.842

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 22,800 parts In-Stock

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22,800

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$13.842

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10

$13.842

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Flip Electronics

USA . 21,280 parts In-Stock

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21,280

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Vyrian

USA . 4,995 parts In-Stock

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4,995

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Digiode

USA . 699 parts In-Stock

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699

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 923 parts In-Stock

1+ parts

$2.120

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923

$2.120

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Corohmni

South Africa . 484 parts In-Stock

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$13.563

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484

$13.563

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Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$13.840

100+ parts

$13.148

1k+ parts

-

10k+ parts

$12.318

1,000

$13.840

$13.148

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$12.318

Continental Prestige Electronics

USA . 4,027 parts In-Stock

1+ parts

$13.842

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$13.565

4,027

$13.842

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$13.565

AZTECH Wire

Italy . 130 parts In-Stock

1+ parts

$20.450

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130

$20.450

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Ampacity Inc.

Singapore . 22,600 parts In-Stock

1+ parts

$52.750

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22,600

$52.750

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 5,954 parts In-Stock

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Perfect Parts

USA . 3,640 parts In-Stock

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Problanco Electronics

Mexico . 2,024 parts In-Stock

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Argo Parts USA

USA . 1,876 parts In-Stock

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Kulean Microsystems

USA . 1,795 parts In-Stock

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1,795

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Kepictronics

USA . 1,510 parts In-Stock

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1,510

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TANS Electronics

Latvia . 368 parts In-Stock

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368

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Corphita

USA . 316 parts In-Stock

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316

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UHIMA Technologies

Türkiye . 203 parts In-Stock

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203

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Overview

Capture breathtaking moments with the Onsemi MT9V034C12STC-DP Image Sensor. Renowned for its exceptional quality and reliability, Onsemi is a trusted manufacturer in the industry. This sensor is perfect for a wide range of applications, offering unparalleled performance and precision. Unlock the full potential of your imaging projects with the MT9V034C12STC-DP, delivering superior value and cutting-edge technology to meet all your needs. Elevate your creations with this top-of-the-line product that guarantees unmatched benefits and advantages for every customer.

Feature Benefit Bullets

Pixel Size (um) - 6X6

Smaller pixel size allows for higher resolution images to be captured with more detail.

Maximum Supply Voltage - 3.6 V

Higher maximum supply voltage allows for better performance and flexibility in power supply options.

Master Clock - 27 MHz

High master clock frequency enables fast data processing and high frame rates for capturing moving objects.

Body Width - 11.43 inch

Compact body width makes this sensor suitable for applications where space is limited.

Sensors or Transducers Type - IMAGE SENSOR,CMOS

CMOS type sensor provides high image quality and low power consumption, making it a reliable choice for imaging applications.

Body Height - 2.3 mm

Low body height allows for easy integration into various devices and systems.

Package Shape or Style - SQUARE

Square package design simplifies mounting and alignment during integration.

Minimum Supply Voltage - 3 V

Low minimum supply voltage ensures efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature - 70 °C

High maximum operating temperature tolerance enables use in various environmental conditions without risk of damage.

Horizontal Pixel - 752

High horizontal pixel count allows for wide and detailed image capture.

Output Range -11-11mA

Wide output range enables capturing both bright and dark scenes accurately.

Output Type - DIGITAL CURRENT

Digital current output simplifies data processing and transmission.

Minimum Operating Temperature -30 °C

Low minimum operating temperature allows for use in cold environments without performance issues.

Maximum Operating Current - 60 mA

Moderate maximum operating current ensures low power consumption and efficient performance.

Housing - CERAMIC

Ceramic housing provides durability and reliability in various operating conditions.

Dynamic Range - 100 dB

High dynamic range allows for capturing both dark and bright areas in a scene with high fidelity.

Vertical Pixel - 480

Suitable vertical pixel count for capturing detailed images with good resolution.

Body Length/Diameter - 11.43 mm

Compact body length/diameter makes this sensor easy to integrate into different devices.

Optical Format (inch) - 1/3

Common optical format size enabling compatibility with various lenses and optical systems.

Termination Type - SOLDER

Solder termination ensures secure and reliable electrical connections during installation.

Output Interface Type - 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices and systems.

Frame Rate - 60 fps

High frame rate allows for capturing fast-moving scenes with smooth and clear images.

Array Type - FRAME

Frame array type enables efficient image capture and processing for various applications.

Sensitivity (V/lx.s) - 4.8 V/lx.s

High sensitivity allows for capturing clear images in low light conditions with minimal noise.

Mounting Feature - SURFACE MOUNT

Surface mount capability simplifies installation and integration into different devices and systems.

Technical Specifications

Image Sensors MT9V034C12STC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

DUAL OUTPUT

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

100 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensitivity (V/lx.s):

4.8 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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