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VSP7502ZWV

Texas Instruments

VSP7502ZWV by Texas Instruments

VSP7502ZWV by Texas Instruments is an 8mm square CCD image sensor with a supply voltage range of 1.65-1.95V, ideal for digital voltage output applications. Operating temperature ranges from -25 to 85°C, making it suitable for various imaging and sensing applications requiring precise measurements in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,994 parts In-Stock

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5,994

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Digiode

USA . 1,901 parts In-Stock

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Parana Technologies

USA . 1,107 parts In-Stock

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$2.170

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$2.682

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1,107

$2.170

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$2.682

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DigiPath Technology Company

USA . 1,307 parts In-Stock

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$2.389

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$2.198

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$2.389

$2.198

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ChromeModa Solutions

Germany . 4,334 parts In-Stock

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$2.438

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$1.999

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$2.438

$1.999

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IDEA Electronic Components Group

UK . 539 parts In-Stock

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$2.438

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$2.194

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539

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Semicontronic

India . 429 parts In-Stock

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$11.750

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$11.456

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$11.398

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429

$11.750

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$11.398

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AZTECH Wire

Italy . 426 parts In-Stock

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$12.137

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Ampacity Inc.

Singapore . 802 parts In-Stock

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$40.750

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802

$40.750

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One Stop Electronics

USA . 951 parts In-Stock

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$46.750

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951

$46.750

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QUARKTWIN TECHNOLOGY LTD

USA . 23,009 parts In-Stock

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Corphita

USA . 812 parts In-Stock

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Corohmni

South Africa . 384 parts In-Stock

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Microchip USA

USA . 159 parts In-Stock

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Overview

Capture every moment with the VSP7502ZWV Image Sensor by Texas Instruments, a cutting-edge technology that delivers unparalleled quality and precision. Designed by a trusted manufacturer in the industry, this sensor is perfect for a wide range of applications. From security cameras to medical imaging, this sensor offers value and benefits that will exceed your expectations. Experience superior performance and reliability with the VSP7502ZWV, making it the perfect choice for all your imaging needs.

Feature Benefit Bullets

Maximum Supply Voltage: 1.95 V

Having a maximum supply voltage of 1.95 V allows for efficient power consumption and provides stable operation.

Body Width: 8 inch

The 8-inch body width offers a compact size, making it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CCD

Being an image sensor with CCD technology ensures high-quality image capture and processing capabilities.

Minimum Supply Voltage: 1.65 V

With a minimum supply voltage of 1.65 V, the sensor can function effectively even with low power input.

Output Range: 1.50-2.10V

The output voltage range of 1.50-2.10V provides flexibility in compatibility with other devices and systems.

Output Type: DIGITAL VOLTAGE

Having a digital voltage output simplifies integration with digital circuits and facilitates data processing.

Minimum Operating Temperature: -25 °C

The ability to operate at a minimum temperature of -25°C ensures reliable performance in a wide range of environmental conditions.

Maximum Operating Current: 0.001 mA

With a maximum operating current of 0.001 mA, the sensor consumes minimal power, making it energy-efficient.

Housing: PLASTIC

The plastic housing offers durability, lightweight, and cost-effectiveness, making the sensor a practical choice for various applications.

Termination Type: SOLDER

The solder termination type simplifies the installation process and ensures a secure connection for reliable performance.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure mounting on PCBs or other surfaces, enhancing the sensor's usability and versatility.

Technical Specifications

Image Sensors VSP7502ZWV attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Additional Features:

ITS ALSO OPERATES IN 2.7 TO 3.6V

Body Width:

8 inch

Body Height:

1.2 mm

Body Length/Diameter:

8 mm

Housing:

PLASTIC

Mounting Feature:

Maximum Operating Current:

.001 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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